MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
MPN: MCF53010CQT240 ✓ AktifMCF53010CQT240 Ringkasan
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
Alternatif penggantian untuk MCF53010CQT240 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian MCF53010CQT240 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Ethernet, Manufacturer, Program Memory, USB.
MCF53015CQT240
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
MCF53011CQT240
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →MCF53013CQT240
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →MCF53010CQT240 Rating Maksimal & Karakteristik Listrik
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| Tegangan Pemuat | 3.3 V I/O |
| Paket | 208-LQFP (28x28 mm) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| Status RoHS | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020) |
Konfigurasi Pin MCF53010CQT240
| Pin produk 1 | A[0] — Address bus bit 0 |
| Pin produk 2 | A[1] — Address bus bit 1 |
| Pin produk 3 | A[2] — Address bus bit 2 |
| Pin produk 4 | A[3] — Address bus bit 3 |
| Pin produk 5 | A[4] — Address bus bit 4 |
| Pin produk 6 | A[5] — Address bus bit 5 |
| Pin produk 7 | A[6] — Address bus bit 6 |
| Pin produk 8 | A[7] — Address bus bit 7 |
| Pin produk 9 | A[8] — Address bus bit 8 |
| Pin produk 10 | A[9] — Address bus bit 9 |
| Pin produk 11 | A[10] — Address bus bit 10 |
| Pin produk 12 | A[11] — Address bus bit 11 |
| Pin produk 13 | A[12] — Address bus bit 12 |
| Pin produk 14 | A[13] — Address bus bit 13 |
| Pin produk 15 | A[14] — Address bus bit 14 |
| Pin produk 16 | A[15] — Address bus bit 15 |
| Pin produk 17 | A[16] — Address bus bit 16 |
| Pin produk 18 | A[17] — Address bus bit 17 |
| Pin produk 19 | A[18] — Address bus bit 18 |
| Pin produk 20 | A[19] — Address bus bit 19 |
| Pin produk 21 | A[20] — Address bus bit 20 |
| Pin produk 22 | A[21] — Address bus bit 21 |
| Pin produk 23 | A[22] — Address bus bit 22 |
| Pin produk 24 | A[23] — Address bus bit 23 |
| Pin produk 25 | D[0] — Data bus bit 0 |
| Pin produk 26 | D[1] — Data bus bit 1 |
| Pin produk 27 | D[2] — Data bus bit 2 |
| Pin produk 28 | D[3] — Data bus bit 3 |
| Pin produk 29 | D[4] — Data bus bit 4 |
| Pin produk 30 | D[5] — Data bus bit 5 |
| Pin produk 31 | D[6] — Data bus bit 6 |
| Pin produk 32 | D[7] — Data bus bit 7 |
| Pin produk 33 | D[8] — Data bus bit 8 |
| Pin produk 34 | D[9] — Data bus bit 9 |
| Pin produk 35 | D[10] — Data bus bit 10 |
| Pin produk 36 | D[11] — Data bus bit 11 |
| Pin produk 37 | D[12] — Data bus bit 12 |
| Pin produk 38 | D[13] — Data bus bit 13 |
| Pin produk 39 | D[14] — Data bus bit 14 |
| Pin produk 40 | D[15] — Data bus bit 15 |
| Pin produk 41 | D[16] — Data bus bit 16 |
| Pin produk 42 | D[17] — Data bus bit 17 |
| Pin produk 43 | D[18] — Data bus bit 18 |
| Pin produk 44 | D[19] — Data bus bit 19 |
| Pin produk 45 | D[20] — Data bus bit 20 |
| Pin produk 46 | D[21] — Data bus bit 21 |
| Pin produk 47 | D[22] — Data bus bit 22 |
| Pin produk 48 | D[23] — Data bus bit 23 |
| Pin produk 49 | D[24] — Data bus bit 24 |
| Pin produk 50 | D[25] — Data bus bit 25 |
| Pin produk 51 | D[26] — Data bus bit 26 |
| Pin produk 52 | D[27] — Data bus bit 27 |
| Pin produk 53 | D[28] — Data bus bit 28 |
| Pin produk 54 | D[29] — Data bus bit 29 |
| Pin produk 55 | D[30] — Data bus bit 30 |
| Pin produk 56 | D[31] — Data bus bit 31 |
| Pin produk 57 | VDD — 3.3 V I/O supply |
| Pin produk 58 | VSS — Ground |
| Pin produk 59 | SD_CLK — SDRAM clock |
| Pin produk 60 | SD_CKE — SDRAM clock enable |
| Pin produk 61 | SD_CS — SDRAM chip select |
| Pin produk 62 | SD_WE — SDRAM write enable |
| Pin produk 63 | SD_CAS — SDRAM column address strobe |
| Pin produk 64 | SD_RAS — SDRAM row address strobe |
| Pin produk 65 | SD_BA[0] — SDRAM bank address 0 |
| Pin produk 66 | SD_BA[1] — SDRAM bank address 1 |
| Pin produk 67 | SD_DQM[0] — SDRAM data mask 0 |
| Pin produk 68 | SD_DQM[1] — SDRAM data mask 1 |
| Pin produk 69 | SD_DQM[2] — SDRAM data mask 2 |
| Pin produk 70 | SD_DQM[3] — SDRAM data mask 3 |
| Pin produk 71 | ETH_TXCLK — Ethernet transmit clock |
| Pin produk 72 | ETH_TXEN — Ethernet transmit enable |
| Pin produk 73 | ETH_TX[0] — Ethernet transmit data 0 |
| Pin produk 74 | ETH_TX[1] — Ethernet transmit data 1 |
| Pin produk 75 | ETH_RXCLK — Ethernet receive clock |
| Pin produk 76 | ETH_RXDV — Ethernet receive data valid |
| Pin produk 77 | ETH_RX[0] — Ethernet receive data 0 |
| Pin produk 78 | ETH_RX[1] — Ethernet receive data 1 |
| Pin produk 79 | ETH_MDC — Ethernet management clock |
| Pin produk 80 | ETH_MDIO — Ethernet management data |
| Pin produk 81 | USB_DP — USB 2.0 FS data plus |
| Pin produk 82 | USB_DM — USB 2.0 FS data minus |
| Pin produk 83 | USB_VBUS — USB VBUS sense |
| Pin produk 84 | CAN_TX — CAN transmit |
| Pin produk 85 | CAN_RX — CAN receive |
| Pin produk 86 | UART0_TX — UART0 transmit |
| Pin produk 87 | UART0_RX — UART0 receive |
| Pin produk 88 | UART1_TX — UART1 transmit |
| Pin produk 89 | UART1_RX — UART1 receive |
| Pin produk 90 | UART2_TX — UART2 transmit |
| Pin produk 91 | UART2_RX — UART2 receive |
| Pin produk 92 | I2C0_SCL — I2C0 clock |
| Pin produk 93 | I2C0_SDA — I2C0 data |
| Pin produk 94 | I2C1_SCL — I2C1 clock |
| Pin produk 95 | I2C1_SDA — I2C1 data |
| Pin produk 96 | SPI0_SCK — SPI0 clock |
| Pin produk 97 | SPI0_MOSI — SPI0 master out slave in |
| Pin produk 98 | SPI0_MISO — SPI0 master in slave out |
| Pin produk 99 | SPI0_SS — SPI0 slave select |
| Pin produk 100 | SPI1_SCK — SPI1 clock |
| Pin produk 101 | SPI1_MOSI — SPI1 master out slave in |
| Pin produk 102 | SPI1_MISO — SPI1 master in slave out |
| Pin produk 103 | SPI1_SS — SPI1 slave select |
| Pin produk 104 | MIC_IN_P — Microphone positive input (codec) |
| Pin produk 105 | MIC_IN_N — Microphone negative input (codec) |
| Pin produk 106 | LINE_IN_L — Line input left (codec) |
| Pin produk 107 | LINE_IN_R — Line input right (codec) |
| Pin produk 108 | HP_OUT_L — Headphone output left (codec) |
| Pin produk 109 | HP_OUT_R — Headphone output right (codec) |
| Pin produk 110 | LINE_OUT_L — Line output left (codec) |
| Pin produk 111 | LINE_OUT_R — Line output right (codec) |
| Pin produk 112 | AVDD — Analog supply for codec |
| Pin produk 113 | AGND — Analog ground for codec |
| Pin produk 114 | GPIO[0] — General purpose I/O 0 |
| Pin produk 115 | GPIO[1] — General purpose I/O 1 |
| Pin produk 116 | GPIO[2] — General purpose I/O 2 |
| Pin produk 117 | GPIO[3] — General purpose I/O 3 |
| Pin produk 118 | GPIO[4] — General purpose I/O 4 |
| Pin produk 119 | GPIO[5] — General purpose I/O 5 |
| Pin produk 120 | GPIO[6] — General purpose I/O 6 |
| Pin produk 121 | GPIO[7] — General purpose I/O 7 |
| Pin produk 122 | GPIO[8] — General purpose I/O 8 |
| Pin produk 123 | GPIO[9] — General purpose I/O 9 |
| Pin produk 124 | GPIO[10] — General purpose I/O 10 |
| Pin produk 125 | GPIO[11] — General purpose I/O 11 |
| Pin produk 126 | GPIO[12] — General purpose I/O 12 |
| Pin produk 127 | GPIO[13] — General purpose I/O 13 |
| Pin produk 128 | GPIO[14] — General purpose I/O 14 |
| Pin produk 129 | GPIO[15] — General purpose I/O 15 |
| Pin produk 130 | IRQ[0] — External interrupt 0 |
| Pin produk 131 | IRQ[1] — External interrupt 1 |
| Pin produk 132 | IRQ[2] — External interrupt 2 |
| Pin produk 133 | IRQ[3] — External interrupt 3 |
| Pin produk 134 | IRQ[4] — External interrupt 4 |
| Pin produk 135 | IRQ[5] — External interrupt 5 |
| Pin produk 136 | IRQ[6] — External interrupt 6 |
| Pin produk 137 | IRQ[7] — External interrupt 7 |
| Pin produk 138 | TC[0] — Timer/Counter 0 |
| Pin produk 139 | TC[1] — Timer/Counter 1 |
| Pin produk 140 | TC[2] — Timer/Counter 2 |
| Pin produk 141 | TC[3] — Timer/Counter 3 |
| Pin produk 142 | PWM[0] — PWM output 0 |
| Pin produk 143 | PWM[1] — PWM output 1 |
| Pin produk 144 | PWM[2] — PWM output 2 |
| Pin produk 145 | PWM[3] — PWM output 3 |
| Pin produk 146 | JTAG_TCK — JTAG test clock |
| Pin produk 147 | JTAG_TMS — JTAG test mode select |
| Pin produk 148 | JTAG_TDI — JTAG test data in |
| Pin produk 149 | JTAG_TDO — JTAG test data out |
| Pin produk 150 | JTAG_TRST — JTAG test reset |
| Pin produk 151 | RESET — External reset input |
| Pin produk 152 | RSTOUT — Reset output to peripherals |
| Pin produk 153 | VDD_CORE — Internal core voltage (decoupling) |
| Pin produk 154 | VSS_CORE — Internal core ground |
| Pin produk 155 | PLL_VDD — PLL supply |
| Pin produk 156 | PLL_VSS — PLL ground |
| Pin produk 157 | XTAL_IN — Crystal oscillator input |
| Pin produk 158 | XTAL_OUT — Crystal oscillator output |
| Pin produk 159 | CLKOUT — System clock output |
| Pin produk 160 | BOOT[0] — Boot mode select 0 |
| Pin produk 161 | BOOT[1] — Boot mode select 1 |
| Pin produk 162 | TEST — Test mode (factory only, tie low in application) |
| Pin produk 163 | NC — Not connected (per datasheet) |
| Pin produk 164 | NC — Not connected (per datasheet) |
| Pin produk 165 | NC — Not connected (per datasheet) |
| Pin produk 166 | NC — Not connected (per datasheet) |
| Pin produk 167 | VDD — 3.3 V I/O supply |
| Pin produk 168 | VSS — Ground |
| Pin produk 169 | VDD — 3.3 V I/O supply |
| Pin produk 170 | VSS — Ground |
| Pin produk 171 | VDD — 3.3 V I/O supply |
| Pin produk 172 | VSS — Ground |
| Pin produk 173 | NC — Not connected (per datasheet) |
| Pin produk 174 | NC — Not connected (per datasheet) |
| Pin produk 175 | NC — Not connected (per datasheet) |
| Pin produk 176 | NC — Not connected (per datasheet) |
| Pin produk 177 | VDD — 3.3 V I/O supply |
| Pin produk 178 | VSS — Ground |
| Pin produk 179 | VDD — 3.3 V I/O supply |
| Pin produk 180 | VSS — Ground |
| Pin produk 181 | VDD — 3.3 V I/O supply |
| Pin produk 182 | VSS — Ground |
| Pin produk 183 | NC — Not connected (per datasheet) |
| Pin produk 184 | NC — Not connected (per datasheet) |
| Pin produk 185 | NC — Not connected (per datasheet) |
| Pin produk 186 | NC — Not connected (per datasheet) |
| Pin produk 187 | VDD — 3.3 V I/O supply |
| Pin produk 188 | VSS — Ground |
| Pin produk 189 | VDD — 3.3 V I/O supply |
| Pin produk 190 | VSS — Ground |
| Pin produk 191 | VDD — 3.3 V I/O supply |
| Pin produk 192 | VSS — Ground |
| Pin produk 193 | NC — Not connected (per datasheet) |
| Pin produk 194 | NC — Not connected (per datasheet) |
| Pin produk 195 | NC — Not connected (per datasheet) |
| Pin produk 196 | NC — Not connected (per datasheet) |
| Pin produk 197 | VDD — 3.3 V I/O supply |
| Pin produk 198 | VSS — Ground |
| Pin produk 199 | VDD — 3.3 V I/O supply |
| Pin produk 200 | VSS — Ground |
| Pin produk 201 | VDD — 3.3 V I/O supply |
| Pin produk 202 | VSS — Ground |
| Pin produk 203 | NC — Not connected (per datasheet) |
| Pin produk 204 | NC — Not connected (per datasheet) |
| Pin produk 205 | NC — Not connected (per datasheet) |
| Pin produk 206 | NC — Not connected (per datasheet) |
| Pin produk 207 | VDD — 3.3 V I/O supply |
| Pin produk 208 | VSS — Ground |
Aplikasi Umum
MCF53010CQT240 cocok untuk 7 aplikasis: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
Direkomendasikan
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
Direkomendasikan
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
Direkomendasikan
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
Direkomendasikan
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
Direkomendasikan
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
Direkomendasikan
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MCF53010CQT240 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Diferensiator Kunci
- Integrated voice codec with amplifiers (vsGeneric ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (vsCores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (vsMPUs with fewer industrial connectivity options)
Catatan Desain
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
Informasi Konformitas
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
