MCF53010CQT240 vs MCF53017CMJ240 Perbandingan
Perbandingan bersamaan detil MCF53010CQT240 dari NXP Semiconductors dan MCF53017CMJ240 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MCF53010CQT240 | MCF53017CMJ240 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | ColdFire V3 (Version 3) with EMAC | — |
| Core Type | 32-bit MPU (ROMless) | — |
| Maximum Core Frequency | 240 MHz | — |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz | — |
| Unified Cache | 16 KBytes (instruction/data) | — |
| Internal SRAM | 128 KBytes | — |
| Program Memory | ROMless (external memory required) | — |
| Tegangan Pemuat | 3.3 V I/O | 3.3 V |
| Paket | 208-LQFP (28x28 mm) | — |
| Tipe Mounting | Surface Mount | Surface mount |
| Suhu Kerja | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Ethernet | 10/100 MAC (EMAC) | — |
| USB | USB 2.0 Full-Speed OTG | — |
| Other Connectivity | CAN, I2C, SPI, UART | — |
| Voice Codec | Integrated codec with amplifiers | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Memory Configuration | — | ROMless |
| Ethernet MAC | — | EMAC |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| Manufacturer | — | NXP Semiconductors |
| REACH Status | — | [DATA_NEEDED: REACH status] |