MCF5329CVM240 vs MCF53281CVM240 Perbandingan
Perbandingan bersamaan detil MCF5329CVM240 dari NXP Semiconductors dan MCF53281CVM240 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MCF5329CVM240 | MCF53281CVM240 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Architecture | ColdFire V3 (VLRISC) | Version 3 ColdFire |
| Core Bit Width | 32-bit | — |
| Frekuensi Bawah Maximum | 240 MHz | — |
| On-chip SRAM | 32 KB | — |
| Unified Cache | 16 KB write-back | — |
| Program Memory Type | ROMless (external memory bus required) | ROMless (external memory required) |
| Number of I/O Lines | 94 | — |
| Paket | 256-LBGA (MAPBGA) | 256-MAPBGA (17x17 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Tegangan Pemuat | 1.5 V core / 3.3 V I/O (typical, refer to datasheet) | — |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Oscillator Type | External | External |
| LCD Controller | Integrated (TFT/STN, first integrated LCD on ColdFire) | — |
| Ethernet | 10/100 MAC integrated | — |
| USB | USB 2.0 Full-Speed OTG | — |
| Debug Interface | JTAG/BDM/OnCE | JTAG (IEEE 1149.1), BDM |
| Packaging | Tray | Tray |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status from NXP product page] |
| Core | — | ColdFire V3 (variable-length RISC, 32-bit) |
| Maximum Core Frequency | — | 240 MHz |
| On-chip Program Memory | — | None |
| RAM Size | — | 32K x 8 (256 Kbit on-chip SRAM) |
| Number of I/O | — | 94 |
| Integrated LCD Controller | — | Yes (first LCD controller integrated on ColdFire family) |
| Operating Temperature Grade | — | Industrial |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Connectivity | — | Ethernet MAC, USB OTG, CAN |