MCF5329CVM240 vs MCF53281CVM240 比較

詳細並排比較 MCF5329CVM240 由 NXP Semiconductors 與 MCF53281CVM240 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd
NXP Semiconductors
MCF53281CVM240 MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 Nrnd

規格比較

參數 MCF5329CVM240 MCF53281CVM240
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core Architecture ColdFire V3 (VLRISC) Version 3 ColdFire
Core Bit Width 32-bit —
最大時脈頻率 240 MHz —
On-chip SRAM 32 KB —
Unified Cache 16 KB write-back —
Program Memory Type ROMless (external memory bus required) ROMless (external memory required)
Number of I/O Lines 94 —
封裝 256-LBGA (MAPBGA) 256-MAPBGA (17x17 mm)
安裝類型 Surface Mount Surface Mount
供應電壓 1.5 V core / 3.3 V I/O (typical, refer to datasheet) —
工作溫度 -40C to +85C (industrial) —
Oscillator Type External External
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire) —
Ethernet 10/100 MAC integrated —
USB USB 2.0 Full-Speed OTG —
Debug Interface JTAG/BDM/OnCE JTAG (IEEE 1149.1), BDM
Packaging Tray Tray
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status from NXP product page]
Core — ColdFire V3 (variable-length RISC, 32-bit)
Maximum Core Frequency — 240 MHz
On-chip Program Memory — None
RAM Size — 32K x 8 (256 Kbit on-chip SRAM)
Number of I/O — 94
Integrated LCD Controller — Yes (first LCD controller integrated on ColdFire family)
Operating Temperature Grade — Industrial
Lead-Free — [DATA_NEEDED: lead-free status]
Connectivity — Ethernet MAC, USB OTG, CAN

資料表與資源

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