MCIMX6S4AVM08AB vs MCIMX6S5DVM10AB Perbandingan

Perbandingan bersamaan detil MCIMX6S4AVM08AB dari NXP Semiconductors dan MCIMX6S5DVM10AB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MCIMX6S4AVM08AB MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB Nrnd
NXP Semiconductors
MCIMX6S5DVM10AB MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB Nrnd

Perbandingan Spesifikasi

Parameter Umum MCIMX6S4AVM08AB MCIMX6S5DVM10AB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Part Number MCIMX6S4AVM08AB —
Core Processor ARM Cortex-A9 —
Number of Cores 1 1
Bus Width 32-bit —
Speed 800 MHz —
Series i.MX 6Solo —
Paket 624-MAPBGA (21x21 mm, 0.8 mm pitch) 624-MAPBGA 21x21 mm, 0.8 mm pitch
Tegangan Pemuat 1.8 V / 2.5 V / 2.8 V / 3.15 V —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 512 KB unified 512 KB unified
GPU GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1) Vivante GC880 (3D) + GC320 (2D)
Video Decoder (VPU) H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30 —
Memory Interface 32-bit DDR3 / LPDDR2 LPDDR2, DDR3, DDR3L (16/32-bit)
Display Interface 24-bit parallel RGB LCD up to WXGA (1366x768) —
Camera Interface 2x MIPI-CSI —
USB 3x USB 2.0 (1x OTG with PHY) —
PCIe 1x PCIe 2.0 (x1 lane) —
Ethernet 10/100/1000 MAC —
SD/MMC 2x SD3.0 / MMC4.4 —
Suhu Kerja -40C to +125C (automotive) —
Level MSL 3 (168 hours) —
Status RoHS Compliant Compliant
Core Architecture — ARM Cortex-A9 (32-bit)
Maximum CPU Frequency — 1.0 GHz
L1 Cache (I + D per core) — 32 KB + 32 KB
NEON SIMD Engine — Yes
Hardware FPU — VFPv3
Image Processing Unit (IPU) — IPUv3C, two units
Display Controller — Dual-display up to WXGA, EPDC for e-paper
Operating Temperature (TJ) — 0C to +95C (commercial)
Process Technology — 40 nm CMOS
Moisture Sensitivity Level — MSL3

Spek dan Sumber

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