MCIMX6S4AVM08AB vs MCIMX6S5DVM10AB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MCIMX6S4AVM08AB disebabkan oleh NXP Semiconductors dan MCIMX6S5DVM10AB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MCIMX6S4AVM08AB MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB Nrnd
NXP Semiconductors
MCIMX6S5DVM10AB MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB Nrnd

Pengandingan Spesifikasi

Parametr MCIMX6S4AVM08AB MCIMX6S5DVM10AB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Part Number MCIMX6S4AVM08AB —
Core Processor ARM Cortex-A9 —
Number of Cores 1 1
Bus Width 32-bit —
Speed 800 MHz —
Series i.MX 6Solo —
Kemasan 624-MAPBGA (21x21 mm, 0.8 mm pitch) 624-MAPBGA 21x21 mm, 0.8 mm pitch
Tegangan Pemberi Arus 1.8 V / 2.5 V / 2.8 V / 3.15 V —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 512 KB unified 512 KB unified
GPU GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1) Vivante GC880 (3D) + GC320 (2D)
Video Decoder (VPU) H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30 —
Memory Interface 32-bit DDR3 / LPDDR2 LPDDR2, DDR3, DDR3L (16/32-bit)
Display Interface 24-bit parallel RGB LCD up to WXGA (1366x768) —
Camera Interface 2x MIPI-CSI —
USB 3x USB 2.0 (1x OTG with PHY) —
PCIe 1x PCIe 2.0 (x1 lane) —
Ethernet 10/100/1000 MAC —
SD/MMC 2x SD3.0 / MMC4.4 —
Suhu Operasi -40C to +125C (automotive) —
Aras MSL 3 (168 hours) —
Status RoHS Compliant Compliant
Core Architecture — ARM Cortex-A9 (32-bit)
Maximum CPU Frequency — 1.0 GHz
L1 Cache (I + D per core) — 32 KB + 32 KB
NEON SIMD Engine — Yes
Hardware FPU — VFPv3
Image Processing Unit (IPU) — IPUv3C, two units
Display Controller — Dual-display up to WXGA, EPDC for e-paper
Operating Temperature (TJ) — 0C to +95C (commercial)
Process Technology — 40 nm CMOS
Moisture Sensitivity Level — MSL3

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