MMA6263QR2 vs MMA6262QR2-FR Perbandingan
Perbandingan bersamaan detil MMA6263QR2 dari NXP Semiconductors dan MMA6262QR2-FR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Waktu Beli TerakhirNXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndPerbandingan Spesifikasi
| Parameter Umum | MMA6263QR2 | MMA6262QR2-FR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Tipe Pengukur | Accelerometer, Dual Axis (X, Y) | Accelerometer, dual-axis (X, Y) |
| Acceleration Range | ±1.5 g (g-select to ±6 g) | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) | 800 mV/g (typical, ratiometric) |
| Tegangan Pemuat | 3.3 V nominal (range per datasheet) | — |
| Tipe Output | Analog, ratiometric voltage | Analog, ratiometric to VDD |
| Bandwidth | 900 Hz sensor bandwidth | — |
| Low-Pass Filter | 1-pole on-chip, ~400 Hz cutoff | — |
| Zero-g Output (Typ) | 1.65 V (mid-supply) | — |
| Temperature Compensation | On-chip factory trimmed | — |
| Self-Test | Logic-level input on each axis | Yes (external logic input) |
| Paket | 16-QFN-EP (6x6 mm) with exposed pad | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead Status | Contains Lead (legacy package) | — |
| Status RoHS | RoHS Compliant | RoHS Compliant (Contains Lead in some variants - check datasheet) |
| Operating Principle | Capacitive micromachined (MEMS) | — |
| Number of Axes | — | 2 (X, Y) |
| Bandwidth (-3 dB) | — | 150 Hz (internal 1-pole LPF) |
| Supply Voltage (VDD) | — | 2.2 V to 3.6 V |
| Arus Pemuat | — | 2 mA (typical) |
| Zero-g Output (ratiometric) | — | VDD/2 (typical) |
| Suhu Kerja | — | -40 °C to +105 °C |
| Shock Survival | — | 2000 g |
| MEMS Process | — | Capacitive micromachined (surface micromachining) |