MPC8245LVV266D vs MPC8245LVV333D Perbandingan
Perbandingan bersamaan detil MPC8245LVV266D dari NXP Semiconductors dan MPC8245LVV333D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking
MPC8245LVV266D ✗ Akhir HidupNXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoletePerbandingan Spesifikasi
| Parameter Umum | MPC8245LVV266D | MPC8245LVV333D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Manufacturer | NXP USA Inc. | NXP USA Inc. (formerly Freescale / Motorola) |
| Part Family | PowerQUICC II (MPC82xx) | — |
| Processor Core | PowerPC MPC603e (32-bit Power Architecture) | — |
| Core Clock Speed | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Number of Cores | 1 | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Core Voltage (Vcc) | 1.8 V | — |
| I/O Voltage | 3.3 V | — |
| Suhu Kerja | 0C to +105C (industrial, 'D' suffix) | 0 C to +105 C (junction) |
| Paket | 352-TBGA (35x35 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Status RoHS | RoHS compliant (lead-free) | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Integrated PCI Bridge | Yes, 32-bit / 66 MHz PCI | — |
| Memory Controller | DDR SDRAM | 64-bit SDRAM (PC133), ROM/Flash interface |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Product Category | — | Microprocessors (MPU) |
| Core Architecture | — | PowerPC 603e (Power Architecture technology) |
| Core Count | — | 1 |
| Lebar Bus Data | — | 32-bit |
| Core Frequency | — | 333 MHz |
| Integrated Bridge | — | PCI bridge + memory controller |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| Paket / Case | — | 352-TBGA (35x35 mm) |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |