MPC8306SVMABDCA vs MPC8306VMABDCA Perbandingan
Perbandingan bersamaan detil MPC8306SVMABDCA dari NXP Semiconductors dan MPC8306VMABDCA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Waktu Beli TerakhirNXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MPC8306SVMABDCA | MPC8306VMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Core Architecture | PowerPC e300c3 (Power Architecture) | — |
| Core Count | 1 | — |
| Lebar Bus Data | 32-bit | 32 bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 up to 333 MHz data rate | DDR2 with ECC |
| On-chip Cache | 32 KB instruction / 32 KB data | — |
| Ethernet | Dual 10/100 MAC with MII/RMII | 2x 10/100 MAC with R/MII, IEEE 1588 v2 |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Connectivity | QUICC Engine (HDLC, TDM), 2x UART | — |
| Paket | 369-MAPBGA (19x19 mm, 0.8 mm pitch) | 369-LFBGA (19x19 mm) |
| Suhu Kerja | 0C to +105C | 0 °C to +105 °C |
| Tegangan Pemuat | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O | — |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | PowerPC e300c3 |
| Number of Cores | — | 1 |
| Co-Processor / DSP | — | QUICC Engine (communications offload) |
| CAN | — | CAN 2.0 |
| Serial Protocols | — | HDLC, TDM (time-slot) |
| Graphics Acceleration | — | No |
| Tipe Mounting | — | Surface Mount (BGA) |
| Series | — | MPC83xx / PowerQUICC II Pro |