MPC8306SVMABDCA vs MPC8306VMABDCA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8306SVMABDCA disebabkan oleh NXP Semiconductors dan MPC8306VMABDCA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC8306SVMABDCA | MPC8306VMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Core Architecture | PowerPC e300c3 (Power Architecture) | — |
| Core Count | 1 | — |
| Lebar Bus Data | 32-bit | 32 bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 up to 333 MHz data rate | DDR2 with ECC |
| On-chip Cache | 32 KB instruction / 32 KB data | — |
| Ethernet | Dual 10/100 MAC with MII/RMII | 2x 10/100 MAC with R/MII, IEEE 1588 v2 |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Connectivity | QUICC Engine (HDLC, TDM), 2x UART | — |
| Kemasan | 369-MAPBGA (19x19 mm, 0.8 mm pitch) | 369-LFBGA (19x19 mm) |
| Suhu Operasi | 0C to +105C | 0 °C to +105 °C |
| Tegangan Pemberi Arus | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O | — |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | PowerPC e300c3 |
| Number of Cores | — | 1 |
| Co-Processor / DSP | — | QUICC Engine (communications offload) |
| CAN | — | CAN 2.0 |
| Serial Protocols | — | HDLC, TDM (time-slot) |
| Graphics Acceleration | — | No |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Series | — | MPC83xx / PowerQUICC II Pro |