MPC8555EVTAPF vs MPC8544ECVTANGA Perbandingan

Perbandingan bersamaan detil MPC8555EVTAPF dari NXP Semiconductors dan MPC8544ECVTANGA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC8544ECVTANGA MPC8544ECVTANGA - PowerQUICC III 32-Bit SoC, 800MHz | NXP

MPC8544ECVTANGA - PowerQUICC III 32-Bit SoC, 800MHz | NXP

MPC8544ECVTANGA Obsolete

Perbandingan Spesifikasi

Parameter Umum MPC8555EVTAPF MPC8544ECVTANGA
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Core Architecture PowerPC e500 —
Core Count 1 —
Lebar Bus Data 32 bit —
Frekuensi Bawah Maximum 833 MHz —
Series PowerQUICC III (MPC85xx) —
Paket 783-FCPBGA (29 x 29 mm) —
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja -40C to +105C (industrial extended) -40C to +105C (industrial grade, per 'A' suffix)
L1 Cache 32 KB instruction + 32 KB data —
L2 Cache 256 KB integrated —
Memory Controller 32-bit DDR with ECC, up to DDR-333 —
Ethernet 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI) 1 Gbit Ethernet (TSEC + eTSEC)
PCI Interface 2 x PCI 2.2 (32-bit, 66 MHz) —
Security Engine IPSec / SSL / TLS / bulk crypto acceleration —
Tegangan Pemuat 1.0 V core, 3.3 V I/O (typical) —
Status RoHS Compliant —
Level MSL [DATA_NEEDED: MSL rating] —
Processor Type — MPC85xx PowerQUICC III
Core — PowerPC e500
Number of Cores — 1
Core Width — 32-Bit
Speed (Clock Frequency) — 800 MHz
Core Voltage — 0.95 V to 1.05 V (1.0 V typical)
Co-Processors/DSP — Signal Processing (SPE); Security (SEC 2.0)
RAM Controllers — DDR, DDR2, SDRAM
PCI/PCIe — PCI Express x4 + PCI-X / PCI
USB — USB 2.0 with integrated PHY
Graphics Acceleration — No
Paket / Case — 783-FCBGA (29x29 mm)
Technology — CMOS
Terminal Form — Ball
Number of Terminals — 783
Package Code — HBGA / FCBGA
Revision — Rev 2.1 (per datasheet title)

Spek dan Sumber

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