MPC855TVR66D4 vs MPC860DTVR66D4 Perbandingan
Perbandingan bersamaan detil MPC855TVR66D4 dari NXP Semiconductors dan MPC860DTVR66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | MPC855TVR66D4 | MPC860DTVR66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Lebar Bus Data | 32 bit | 32-bit |
| Frekuensi Bawah Maximum | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Paket | 357-PBGA (25x25 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0 °C to +95 °C | 0 C to +95 C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Kategori | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Core Architecture | — | PowerPC (MPC8xx) |
| Core Count | — | 1 |
| Max Core Frequency | — | 66 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Series | — | MPC8xx / PowerQUICC |
| Paket / Case | — | 357-BGA (PBGA, 25x25 mm) |
| Packaging | — | Tray |
| On-chip Peripherals | — | CPM, ENET, ATM, HDLC, PCMCIA |
| Ethernet | — | 10 Mbps x2 |
| Graphics Acceleration | — | No |
| Lead Free Status | — | Lead Free |
| Part Status | — | Not For New Designs |