MPC860ENCVR50D4 vs MPC860DTVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860ENCVR50D4 dari NXP Semiconductors dan MPC860DTVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860ENCVR50D4 | MPC860DTVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Processor Type | MPU PowerQUICC MPC8xx | MPC8xx PowerQUICC |
| Core Architecture | 32-Bit PowerPC | 32-bit PowerPC |
| Core Count | 1 | — |
| Frekuensi Bawah Maximum | 50 MHz | — |
| Tegangan Pemuat Kerja | 3.3 V | — |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS |
| Paket / Case | 357-BBGA (PBGA, 25 x 25 mm) | 357-PBGA (25 x 25 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Lead Free |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Series | MPC8xx PowerQUICC | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| Suhu Kerja | — | 0C to +95C |
| External Memory Bus | — | 32-bit (single/dual bus) |