MPC860ENCVR50D4 vs MPC860TZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860ENCVR50D4 dari NXP Semiconductors dan MPC860TZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860ENCVR50D4 | MPC860TZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Processor Type | MPU PowerQUICC MPC8xx | — |
| Core Architecture | 32-Bit PowerPC | PowerPC, 32-bit |
| Core Count | 1 | 1 |
| Frekuensi Bawah Maximum | 50 MHz | — |
| Tegangan Pemuat Kerja | 3.3 V | — |
| Process Technology | 0.32 um CMOS | — |
| Paket / Case | 357-BBGA (PBGA, 25 x 25 mm) | 357-PBGA (25x25 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Contains Lead |
| Status RoHS | RoHS Compliant | RoHS non-compliant (Contains Lead) |
| Series | MPC8xx PowerQUICC | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Suhu Kerja | — | 0 °C to +70 °C |
| Communications Module | — | CPM (QUICC Engine) |
| Status Lingkungan Hidup | — | End of Life (per NXP) |
| Kategori | — | Microprocessors - MPU |