MPC860ENCVR50D4 vs MPC860TZQ66D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860ENCVR50D4 sa pamamagitan ng NXP Semiconductors at MPC860TZQ66D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC860TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TZQ66D4 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC860ENCVR50D4 | MPC860TZQ66D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Tapus ng Buhay |
| Processor Type | MPU PowerQUICC MPC8xx | — |
| Core Architecture | 32-Bit PowerPC | PowerPC, 32-bit |
| Core Count | 1 | 1 |
| Maksimum na Taktiko ng Oras | 50 MHz | — |
| Supply Voltage na Operasyon | 3.3 V | — |
| Process Technology | 0.32 um CMOS | — |
| Packhaging / Kaso | 357-BBGA (PBGA, 25 x 25 mm) | 357-PBGA (25x25 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Contains Lead |
| Tindminan RoHS | RoHS Compliant | RoHS non-compliant (Contains Lead) |
| Series | MPC8xx PowerQUICC | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| Volte ng Pagbibigay | — | 3.3 V |
| Temperature na Operasyon | — | 0 °C to +70 °C |
| Communications Module | — | CPM (QUICC Engine) |
| Katayuan ng Lifecycle | — | End of Life (per NXP) |
| Kategorya | — | Microprocessors - MPU |