MRF5S9101MBR1 vs MRF5S9101MR1 Perbandingan
Perbandingan bersamaan detil MRF5S9101MBR1 dari NXP Semiconductors dan MRF5S9101MR1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MRF5S9101MBR1 | MRF5S9101MR1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | MOSFETs | MOSFETs |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Tipe Transistor | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET | LDMOS (N-Channel Enhancement-Mode Lateral MOSFET) |
| Frequency Range | 869 MHz to 960 MHz | 869 MHz to 960 MHz |
| Test Frequency | 960 MHz | 960 MHz |
| Output Power (Pout) | 100 W | — |
| Power Gain (Gps) | 17.5 dB (min, at 960 MHz, 26 V) | — |
| Test Drain Voltage (Vdd) | 26 V | — |
| Test Drain Current (Idq) | 700 mA | — |
| Drain-Source Voltage Rating (Vdss) | 68 V | — |
| Configuration | Single, Common Source | — |
| Paket / Case | TO-272 WB-4 (Case 1486-03, Style 1) | TO-270 WB-4 (Case 1486-03, Style 1) |
| Supplier Device Package | TO-272 WB-4 | TO-270 WB-4 |
| Tipe Mounting | Surface Mount | Chassis / Flange Mount (through-hole flange) |
| Maximum Power Dissipation | 427 W | — |
| Suhu Kerja | -40C to +150C (TJ) | [DATA_NEEDED: operating temperature range] |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free N-suffix variants) |
| Lead-Free / Terminal Finish | Tin-Lead (per Partstack listing) | — |
| Technology | LDMOS (Laterally Diffused MOSFET) | RF Power Field Effect Transistor |
| Application Target | GSM / GSM EDGE Base Station Power Amplifiers | — |
| Test Voltage | — | 26 V |
| Test Current (Quiescent) | — | 700 mA |
| Power Output (POUT) | — | 100 W (CW) |
| Power Gain | — | 17.5 dB at 960 MHz |
| Drain-Source Voltage (Rated) | — | 68 V |
| Drain Current Rating | — | [DATA_NEEDED: maximum continuous drain current] |
| Lead Free Status | — | Replaced by MRF5S9101NR1/NBR1 (form/fit/function equivalent) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Thermal Resistance Junction-to-Case | — | [DATA_NEEDED: RθJC value] |
| Application | — | GSM / GSM EDGE / N-CDMA base station final-stage PA |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |