S9S08QD4J2MSCR vs MC9S08QD4VSC Perbandingan
Perbandingan bersamaan detil S9S08QD4J2MSCR dari NXP Semiconductors dan MC9S08QD4VSC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | S9S08QD4J2MSCR | MC9S08QD4VSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Tegangan Pemuat | 2.7 V to 5.5 V | [DATA_NEEDED: supply voltage range] |
| Suhu Kerja | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Paket | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| Status RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-bit |
| Frekuensi Bawah Maximum | — | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| GPIO Count | — | 6 |
| Instruction Set | — | CISC (HC08 with added BGND instruction) |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint on-chip |
| Series | — | MC9S08QD4 |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |