S9S08QD4J2MSCR vs MC9S08QD4VSC مقایسه
مقایسه دقیق کنار به کنار S9S08QD4J2MSCR توسط NXP Semiconductors و MC9S08QD4VSC توسط NXP Semiconductors. مشخصات کلیدی، پارامترهای الکتریکی، بستهبندی، وضعیت چرخه عمر، قیمتگذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
مقایسه مشخصات
| پارامتر | S9S08QD4J2MSCR | MC9S08QD4VSC |
|---|---|---|
| برند | NXP Semiconductors | NXP Semiconductors |
| دستهبندی | Microcontrollers | Microcontrollers |
| وضعیت چرخه عمر | فعال | پایان عمر محصول |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| ولتاژ تغذیه | 2.7 V to 5.5 V | [DATA_NEEDED: supply voltage range] |
| دمای کاری | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| بستهبندی | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| نوع نصب | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| وضعیت RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-bit |
| حداکثر فرکانس کلاک | — | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| GPIO Count | — | 6 |
| Instruction Set | — | CISC (HC08 with added BGND instruction) |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint on-chip |
| Series | — | MC9S08QD4 |
| وضعیت چرخه عمر | — | End of Life (per NXP product page) |