S9S08SL8F1CTJ vs S9S08SG16E1CTJ Perbandingan
Perbandingan bersamaan detil S9S08SL8F1CTJ dari NXP Semiconductors dan S9S08SG16E1CTJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S08SG16E1CTJ - 8-bit S08 MCU 16KB Flash 40MHz | NXP
S9S08SG16E1CTJ ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | S9S08SL8F1CTJ | S9S08SG16E1CTJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Core Processor | S08 8-bit | S08 |
| Core Size | 8-bit | 8-Bit |
| Frekuensi Bawah Maximum | 40 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 1K x 8 |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| Paket | 20-TSSOP (0.173 in, 4.40 mm width) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40 C to +85 C | -40C to +85C |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| Status RoHS | Compliant | — |
| Architecture | — | CISC |
| Speed | — | 40 MHz |
| Program Memory Size | — | 16KB (16K x 8) |
| Program Memory Type | — | FLASH |
| Number of I/O | — | 16 |
| Oscillator Type | — | Internal |
| Qualification | — | Automotive Qualified |
| Paket / Case | — | 20-TSSOP (0.173", 4.40 mm Width) |
| Packaging | — | Tube |
| Peripherals | — | LIN support, S08 peripheral set |
| Status Lingkungan Hidup | — | End of Life |