W971GG6NB-25 TR vs W971GG6NB-6 Perbandingan
Perbandingan bersamaan detil W971GG6NB-25 TR dari Winbond dan W971GG6NB-6 dari Winbond. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | W971GG6NB-25 TR | W971GG6NB-6 |
|---|---|---|
| Merek | Winbond | Winbond |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | SDRAM - DDR2 | DDR2 SDRAM |
| Ukuran Memori | 1 Gbit | 1 Gbit |
| Organisasi | 64M x 16 (8,388,608 words x 8 banks x 16 bits) | 8M x 8 banks x 16 bits |
| Clock Frequency | 400 MHz | 333 MHz (667 Mbps data rate) |
| Access Time | 57.5 ns | [DATA_NEEDED: precise CL-trcd-trp in ns] |
| Write Cycle Time | 15 ns | — |
| Antarmuka | SSTL_18 | — |
| Tegangan Pemuat | 1.8 V | — |
| Number of Banks | 8 | 8 |
| Laju Data | DDR2-800 | — |
| Paket | 84-TFBGA (8 x 12.5 mm) | 84-ball TFBGA (8 x 12.5 mm) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Packaging | Tape & Reel (TR) | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Refresh Interval | [DATA_NEEDED: refresh interval] | — |
| Status RoHS | Compliant (all Winbond packaging RoHS compliant per manufacturer) | — |
| Speed Grade | — | -6 (DDR2-667, 667 Mbps) |
| Interface Standard | — | SSTL_18 (1.8 V) |
| Burst Length | — | 4 / 8 (programmable) |
| On-Die Termination | — | Dynamic ODT (supported) |
| Data Mask (DM) | — | Supported |
| Auto Precharge | — | Supported |
| Self-Refresh | — | Supported |
| Operating Temperature Range (commercial) | — | 0C to +85C (TCASE) |
| Supply Voltage VDD/VDDQ | — | 1.8 V (typ) |
| RoHS / Halogen-Free | — | Compliant / Halogen-Free (per Winbond) |
| JEDEC Standard | — | JEDEC DDR2 (DDR2-667 grade) |
| Level MSL | — | [DATA_NEEDED: MSL rating] |