XC6SLX75-2FG484I vs XC6SLX75-2FGG484I Perbandingan

Perbandingan bersamaan detil XC6SLX75-2FG484I dari AMD dan XC6SLX75-2FGG484I dari AMD. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum XC6SLX75-2FG484I XC6SLX75-2FGG484I
Merek AMD AMD
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Manufacturer AMD / Xilinx —
Logic Elements 74,637 LE —
Logic Blocks 5,831 —
Internal Frequency 667 MHz —
I/O Count 280 I/O —
Package Type FCBGA-484 / 484-BBGA —
Number of Terminals 484 balls —
Package Dimensions 23 mm x 23 mm —
Ball Pitch 1 mm —
Package Outline MS-034 —
Speed Grade -2 -2 (mid-range)
Temperature Grade Industrial —
Suhu Kerja 0°C to +85°C (32°F to 185°F) —
Terminal Form Ball —
Package Shape Square —
Configuration Memory [DATA_NEEDED: configuration memory capacity] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Device Family — Spartan-6 LX
Logic Cells — 74,637
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
Block RAM — 4,824 Kbits (180 x 18 Kbit)
DSP Slices (DSP48A1) — 132
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Process Technology — 45 nm CMOS
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Paket — 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
Tipe Mounting — Surface Mount (BGA)
Level MSL — 3 (168 hours)

Spek dan Sumber

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