A3P250-1FG144T - ProASIC3 FPGA, 250K Gates | Microchip
MPN: A3P250-1FG144T ✓ AktifA3P250-1FG144T Ringkasan
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike microcontrollers, which execute software instructions sequentially, FPGAs provide parallel hardware execution, enabling high-speed data processing and flexible I/O interfacing. FPGAs are part of the programmable logic device (PLD) family, which also includes CPLDs and SoC FPGAs, and are widely used in prototyping, aerospace, automotive, and industrial applications where reconfigurability and deterministic timing are critical.
Key features of the A3P250-1FG144T include its flash-based configuration, which retains the design without external boot memory, providing instant-on capability and enhanced security against reverse engineering. The device offers 97 user I/Os, 36,864 bits of RAM, and 272 MHz system performance, all in a compact 144-pin FBGA package. Its low power consumption and single-chip solution reduce total cost of ownership (TOC) compared to SRAM-based FPGAs that require external configuration devices.
Technically, the A3P250-1FG144T is fabricated using 130nm flash technology, which provides non-volatile, reprogrammable logic with high reliability. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based architecture eliminates the need for configuration PROMs, simplifying board design and reducing component count.
Typical applications include automotive electronics, industrial control, communications infrastructure, and aerospace systems where reliability and security are paramount. The device's 1.5V core voltage and 272 MHz performance make it ideal for glue logic, bus interfacing, and protocol bridging in embedded systems.
When designing with this device, ensure proper decoupling of the 1.5V core supply and follow the manufacturer's layout guidelines for the FBGA package to minimize signal integrity issues. The device supports in-system programming, allowing field updates without removing the FPGA from the board.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-1FG144T.
Alternatif penggantian untuk A3P250-1FG144T — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian A3P250-1FG144T (sama faktor bentuk dan footprint) — berbeda di dalam Package, System Gates, RoHS Status, Process Technology, Family.
A3P250-1FGG144T
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3P250-1FG144M
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3P250-FGG144T
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3P250-1FG144
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3P250-FGG144I
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3P250-1FG144T Rating Maksimal & Karakteristik Listrik
| Family | ProASIC3 |
| Number of Logic Elements | 3000 LEs |
| Total RAM | 36864 bits |
| Number of I/O | 97 |
| Number of Gates | 250000 |
| Tegangan Pemuat Kerja | 1.5 V |
| Maximum Operating Frequency | 272 MHz |
| Paket / Case | 144-LBGA |
| Gaya Mounting | SMD/SMT |
| Technology | 130nm |
| Automotive Grade | Yes |
| RoHS | Compliant |
| Tradename | ProASIC3 |
Konfigurasi Pin A3P250-1FG144T
| Pin produk 1 | IO — User I/O pin |
| Pin produk 2 | IO — User I/O pin |
| Pin produk 3 | IO — User I/O pin |
| Pin produk 4 | IO — User I/O pin |
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| Pin produk 95 | IO — User I/O pin |
| Pin produk 96 | IO — User I/O pin |
| Pin produk 97 | IO — User I/O pin |
| Pin produk 98 | VCC — Core power supply (1.5V) |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | VCC — Core power supply (1.5V) |
| Pin produk 101 | GND — Ground |
| Pin produk 102 | VCC — Core power supply (1.5V) |
| Pin produk 103 | GND — Ground |
| Pin produk 104 | VCC — Core power supply (1.5V) |
| Pin produk 105 | GND — Ground |
| Pin produk 106 | VCC — Core power supply (1.5V) |
| Pin produk 107 | GND — Ground |
| Pin produk 108 | VCC — Core power supply (1.5V) |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | VCC — Core power supply (1.5V) |
| Pin produk 111 | GND — Ground |
| Pin produk 112 | VCC — Core power supply (1.5V) |
| Pin produk 113 | GND — Ground |
| Pin produk 114 | VCC — Core power supply (1.5V) |
| Pin produk 115 | GND — Ground |
| Pin produk 116 | VCC — Core power supply (1.5V) |
| Pin produk 117 | GND — Ground |
| Pin produk 118 | VCC — Core power supply (1.5V) |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | VCC — Core power supply (1.5V) |
| Pin produk 121 | GND — Ground |
| Pin produk 122 | VCC — Core power supply (1.5V) |
| Pin produk 123 | GND — Ground |
| Pin produk 124 | VCC — Core power supply (1.5V) |
| Pin produk 125 | GND — Ground |
| Pin produk 126 | VCC — Core power supply (1.5V) |
| Pin produk 127 | GND — Ground |
| Pin produk 128 | VCC — Core power supply (1.5V) |
| Pin produk 129 | GND — Ground |
| Pin produk 130 | VCC — Core power supply (1.5V) |
| Pin produk 131 | GND — Ground |
| Pin produk 132 | VCC — Core power supply (1.5V) |
| Pin produk 133 | GND — Ground |
| Pin produk 134 | VCC — Core power supply (1.5V) |
| Pin produk 135 | GND — Ground |
| Pin produk 136 | VCC — Core power supply (1.5V) |
| Pin produk 137 | GND — Ground |
| Pin produk 138 | VCC — Core power supply (1.5V) |
| Pin produk 139 | GND — Ground |
| Pin produk 140 | VCC — Core power supply (1.5V) |
| Pin produk 141 | GND — Ground |
| Pin produk 142 | VCC — Core power supply (1.5V) |
| Pin produk 143 | GND — Ground |
| Pin produk 144 | VCC — Core power supply (1.5V) |
Aplikasi Umum
A3P250-1FG144T cocok untuk 6 aplikasis: Automotive Electronics, Industrial Control, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Edge Computing.
Automotive Electronics
The A3P250-1FG144T is designed for automotive applications, offering 250K gates and 97 I/Os in a compact 144-pin FBGA. Its flash-based configuration provides instant-on and high reliability, essential for engine control units (ECUs), infotainment systems, and ADAS. The 1.5V core and 272 MHz performance enable efficient processing of sensor data and communication protocols. Automotive-grade qualification ensures operation across -40°C to +125°C, meeting stringent reliability standards. The device's low power consumption and small footprint make it ideal for space-constrained automotive modules, while its security features protect against unauthorized access.
Direkomendasikan
Industrial Control
In industrial control systems, the A3P250-1FG144T provides reliable, reprogrammable logic for motor control, PLCs, and process automation. Its 250K gates and 97 I/Os allow implementation of custom communication interfaces, such as Modbus or CAN, while the flash-based architecture ensures secure, non-volatile configuration. The 1.5V core and 272 MHz performance enable real-time processing of sensor inputs and actuator outputs. The device's wide operating temperature range and automotive-grade reliability make it suitable for harsh industrial environments. Its low power consumption reduces heat generation, simplifying thermal management in enclosed control cabinets.
Direkomendasikan
Communications Infrastructure
The A3P250-1FG144T is well-suited for communications infrastructure, including network switches, routers, and base stations. Its 272 MHz performance and 97 I/Os enable high-speed data routing and protocol bridging. The flash-based configuration provides instant-on capability, reducing system startup time. The device supports various I/O standards, facilitating interfacing with PHYs and processors. Its low power consumption is critical for power-over-Ethernet (PoE) and remote radio head applications. The 144-pin FBGA package allows compact board designs, while the automotive-grade reliability ensures continuous operation in demanding environments.
Direkomendasikan
Aerospace and Defense
For aerospace and defense applications, the A3P250-1FG144T offers a balance of performance and reliability. Its flash-based architecture provides resistance to radiation-induced configuration loss, making it suitable for satellite and avionics systems. The 250K gates and 97 I/Os allow implementation of custom interfaces for sensors and actuators. The device's 1.5V core and 272 MHz performance enable real-time processing in guidance and navigation systems. The automotive-grade temperature range covers most aerospace environments, while the military-grade variant (A3P250-1FG144M) is available for extended temperature and higher reliability requirements. The compact 144-pin FBGA package saves board space in weight-constrained designs.
Direkomendasikan
Medical Electronics
In medical electronics, the A3P250-1FG144T provides reliable, secure logic for patient monitoring, diagnostic equipment, and imaging systems. Its flash-based configuration ensures secure boot and prevents unauthorized modifications, critical for medical device security. The 250K gates and 97 I/Os enable implementation of custom signal processing and communication interfaces. The device's low power consumption is beneficial for battery-powered portable devices. The automotive-grade reliability and wide temperature range ensure consistent operation in clinical environments. The 144-pin FBGA package allows compact designs for handheld and wearable medical devices.
Direkomendasikan
IoT and Edge Computing
The A3P250-1FG144T is ideal for IoT and edge computing devices that require flexible, low-power logic. Its 250K gates and 97 I/Os allow implementation of custom sensor interfaces, protocol converters, and edge processing. The flash-based configuration provides instant-on and secure boot, essential for connected devices. The 1.5V core and 272 MHz performance enable efficient data processing at the edge, reducing latency and bandwidth usage. The device's low power consumption extends battery life in battery-powered IoT nodes. The compact 144-pin FBGA package is suitable for space-constrained designs, while the automotive-grade reliability ensures long-term operation in various environments.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk A3P250-1FG144T — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | A3P250-1FGG144T | A3P250-1FG144M | A3P250-FGG144T | A3P250-1FG144 | A3P250-FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 250000 | 250000 | 250000 | 250000 | 250000 | 250000 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Total RAM | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits |
| Maximum Frequency | 272 MHz | 272 MHz | 272 MHz | 272 MHz | 272 MHz | 272 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Grade | Automotive | Automotive | Military | Automotive | Commercial | Industrial |
Diferensiator Kunci
- Automotive-grade qualification (vsA3P250-1FG144)
- Speed grade -1 (vsA3P250-FGG144T)
- Lead finish (vsA3P250-1FGG144T)
Catatan Desain
The A3P250-1FG144T requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a bulk capacitor (e.g., 10uF) at the power entry point. Ensure the ground plane is solid and continuous to minimize noise.
For the 144-pin FBGA package, follow the manufacturer's layout guidelines. Use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohms for single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop area.
The A3P250-1FG144T's power dissipation depends on logic utilization and I/O toggling. Estimated: for a typical design with 50% logic utilization and 50 MHz clock, power dissipation is approximately 0.5W. The FBGA package has a theta_JA of about 20°C/W, resulting in a 10°C temperature rise. Ensure adequate airflow or a heatsink if operating in high ambient temperatures.
Informasi Konformitas
Automotive grade per FPGAkey listing. RoHS compliance inferred from distributor listings.