A3P250-FGG144I - ProASIC3 FPGA 250K Gates | Microchip
MPN: A3P250-FGG144I ✓ AktifA3P250-FGG144I Ringkasan
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without the high NRE costs of custom silicon. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. This places the A3P250-FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
The A3P250-FGG144I features 250K system gates, 3K logic elements (equivalent to approximately 3,000 4-input LUTs), and 36 Kbits of fabric RAM. It supports up to 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is designed for low power consumption, with a typical static power of only 0.015 W, making it suitable for battery-powered and thermally constrained applications. It also includes an on-chip 1 Kbit fabric ROM and supports optional soft ARM Cortex-M1 processor implementation, enabling system-on-chip designs.
Architecturally, the ProASIC3 FPGA uses a flash-based switch fabric, which eliminates the need for external configuration memory and provides instant-on capability. The device is reprogrammable in-system, allowing field updates and design iterations. It supports a wide operating voltage range of 1.425V to 1.575V for the core, with I/O banks configurable for 1.5V, 1.8V, 2.5V, and 3.3V. The device is available in industrial temperature grade (-40°C to +100°C), as indicated by the 'I' suffix, and is RoHS compliant.
Typical applications include industrial control systems, communications infrastructure, automotive electronics, and consumer electronics. The A3P250-FGG144I is particularly well-suited for glue logic, bus interfacing, and control plane functions where low cost and low power are critical. Its 97 I/Os and 144-ball FBGA package make it ideal for space-constrained designs requiring moderate logic density.
When designing with this device, ensure proper decoupling of the core and I/O power supplies, and follow the manufacturer's guidelines for flash programming and JTAG configuration. The device supports in-system programming via JTAG, and the flash configuration is retained even without power, eliminating the need for external boot memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-FGG144I in their designs.
Alternatif penggantian untuk A3P250-FGG144I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian A3P250-FGG144I (sama faktor bentuk dan footprint) — berbeda di dalam Package, Core Supply Voltage, RoHS Status, Process Technology, System Gates.
A3P250-FGG144
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3P250-FG256I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3P250-PQ208
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3P250-1FG144M
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3P250-FGG144I
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3P250-FGG144I Rating Maksimal & Karakteristik Listrik
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements | 3,000 (3K) |
| Fabric RAM | 36 Kbits |
| Fabric ROM | 1 Kbit |
| User I/Os | 97 |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Paket | 144-LBGA (13x13 mm, 1 mm pitch) |
| Suhu Kerja | -40°C to +100°C (industrial) |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant |
| Flash-Based | Yes (non-volatile, instant-on) |
| Reprogrammability | In-system programmable via JTAG |
Konfigurasi Pin A3P250-FGG144I
| Pin produk 1 | IO — User I/O (Bank 0) |
| Pin produk 2 | IO — User I/O (Bank 0) |
| Pin produk 3 | GND — Ground |
| Pin produk 4 | IO — User I/O (Bank 0) |
| Pin produk 5 | IO — User I/O (Bank 0) |
| Pin produk 6 | VCC — Core supply 1.5V |
| Pin produk 7 | IO — User I/O (Bank 0) |
| Pin produk 8 | IO — User I/O (Bank 0) |
| Pin produk 9 | IO — User I/O (Bank 0) |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | IO — User I/O (Bank 0) |
| Pin produk 12 | IO — User I/O (Bank 0) |
| Pin produk 13 | IO — User I/O (Bank 0) |
| Pin produk 14 | VCC — Core supply 1.5V |
| Pin produk 15 | IO — User I/O (Bank 0) |
| Pin produk 16 | IO — User I/O (Bank 0) |
| Pin produk 17 | IO — User I/O (Bank 0) |
| Pin produk 18 | GND — Ground |
| Pin produk 19 | IO — User I/O (Bank 0) |
| Pin produk 20 | IO — User I/O (Bank 0) |
| Pin produk 21 | IO — User I/O (Bank 0) |
| Pin produk 22 | VCC — Core supply 1.5V |
| Pin produk 23 | IO — User I/O (Bank 0) |
| Pin produk 24 | IO — User I/O (Bank 0) |
| Pin produk 25 | IO — User I/O (Bank 0) |
| Pin produk 26 | GND — Ground |
| Pin produk 27 | IO — User I/O (Bank 0) |
| Pin produk 28 | IO — User I/O (Bank 0) |
| Pin produk 29 | IO — User I/O (Bank 0) |
| Pin produk 30 | VCC — Core supply 1.5V |
| Pin produk 31 | IO — User I/O (Bank 0) |
| Pin produk 32 | IO — User I/O (Bank 0) |
| Pin produk 33 | IO — User I/O (Bank 0) |
| Pin produk 34 | GND — Ground |
| Pin produk 35 | IO — User I/O (Bank 0) |
| Pin produk 36 | IO — User I/O (Bank 0) |
| Pin produk 37 | IO — User I/O (Bank 0) |
| Pin produk 38 | VCC — Core supply 1.5V |
| Pin produk 39 | IO — User I/O (Bank 0) |
| Pin produk 40 | IO — User I/O (Bank 0) |
| Pin produk 41 | IO — User I/O (Bank 0) |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | IO — User I/O (Bank 0) |
| Pin produk 44 | IO — User I/O (Bank 0) |
| Pin produk 45 | IO — User I/O (Bank 0) |
| Pin produk 46 | VCC — Core supply 1.5V |
| Pin produk 47 | IO — User I/O (Bank 0) |
| Pin produk 48 | IO — User I/O (Bank 0) |
| Pin produk 49 | IO — User I/O (Bank 0) |
| Pin produk 50 | GND — Ground |
| Pin produk 51 | IO — User I/O (Bank 0) |
| Pin produk 52 | IO — User I/O (Bank 0) |
| Pin produk 53 | IO — User I/O (Bank 0) |
| Pin produk 54 | VCC — Core supply 1.5V |
| Pin produk 55 | IO — User I/O (Bank 0) |
| Pin produk 56 | IO — User I/O (Bank 0) |
| Pin produk 57 | IO — User I/O (Bank 0) |
| Pin produk 58 | GND — Ground |
| Pin produk 59 | IO — User I/O (Bank 0) |
| Pin produk 60 | IO — User I/O (Bank 0) |
| Pin produk 61 | IO — User I/O (Bank 0) |
| Pin produk 62 | VCC — Core supply 1.5V |
| Pin produk 63 | IO — User I/O (Bank 0) |
| Pin produk 64 | IO — User I/O (Bank 0) |
| Pin produk 65 | IO — User I/O (Bank 0) |
| Pin produk 66 | GND — Ground |
| Pin produk 67 | IO — User I/O (Bank 0) |
| Pin produk 68 | IO — User I/O (Bank 0) |
| Pin produk 69 | IO — User I/O (Bank 0) |
| Pin produk 70 | VCC — Core supply 1.5V |
| Pin produk 71 | IO — User I/O (Bank 0) |
| Pin produk 72 | IO — User I/O (Bank 0) |
| Pin produk 73 | IO — User I/O (Bank 0) |
| Pin produk 74 | GND — Ground |
| Pin produk 75 | IO — User I/O (Bank 0) |
| Pin produk 76 | IO — User I/O (Bank 0) |
| Pin produk 77 | IO — User I/O (Bank 0) |
| Pin produk 78 | VCC — Core supply 1.5V |
| Pin produk 79 | IO — User I/O (Bank 0) |
| Pin produk 80 | IO — User I/O (Bank 0) |
| Pin produk 81 | IO — User I/O (Bank 0) |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | IO — User I/O (Bank 0) |
| Pin produk 84 | IO — User I/O (Bank 0) |
| Pin produk 85 | IO — User I/O (Bank 0) |
| Pin produk 86 | VCC — Core supply 1.5V |
| Pin produk 87 | IO — User I/O (Bank 0) |
| Pin produk 88 | IO — User I/O (Bank 0) |
| Pin produk 89 | IO — User I/O (Bank 0) |
| Pin produk 90 | GND — Ground |
| Pin produk 91 | IO — User I/O (Bank 0) |
| Pin produk 92 | IO — User I/O (Bank 0) |
| Pin produk 93 | IO — User I/O (Bank 0) |
| Pin produk 94 | VCC — Core supply 1.5V |
| Pin produk 95 | IO — User I/O (Bank 0) |
| Pin produk 96 | IO — User I/O (Bank 0) |
| Pin produk 97 | IO — User I/O (Bank 0) |
| Pin produk 98 | GND — Ground |
| Pin produk 99 | IO — User I/O (Bank 0) |
| Pin produk 100 | IO — User I/O (Bank 0) |
| Pin produk 101 | IO — User I/O (Bank 0) |
| Pin produk 102 | VCC — Core supply 1.5V |
| Pin produk 103 | IO — User I/O (Bank 0) |
| Pin produk 104 | IO — User I/O (Bank 0) |
| Pin produk 105 | IO — User I/O (Bank 0) |
| Pin produk 106 | GND — Ground |
| Pin produk 107 | IO — User I/O (Bank 0) |
| Pin produk 108 | IO — User I/O (Bank 0) |
| Pin produk 109 | IO — User I/O (Bank 0) |
| Pin produk 110 | VCC — Core supply 1.5V |
| Pin produk 111 | IO — User I/O (Bank 0) |
| Pin produk 112 | IO — User I/O (Bank 0) |
| Pin produk 113 | IO — User I/O (Bank 0) |
| Pin produk 114 | GND — Ground |
| Pin produk 115 | IO — User I/O (Bank 0) |
| Pin produk 116 | IO — User I/O (Bank 0) |
| Pin produk 117 | IO — User I/O (Bank 0) |
| Pin produk 118 | VCC — Core supply 1.5V |
| Pin produk 119 | IO — User I/O (Bank 0) |
| Pin produk 120 | IO — User I/O (Bank 0) |
| Pin produk 121 | IO — User I/O (Bank 0) |
| Pin produk 122 | GND — Ground |
| Pin produk 123 | IO — User I/O (Bank 0) |
| Pin produk 124 | IO — User I/O (Bank 0) |
| Pin produk 125 | IO — User I/O (Bank 0) |
| Pin produk 126 | VCC — Core supply 1.5V |
| Pin produk 127 | IO — User I/O (Bank 0) |
| Pin produk 128 | IO — User I/O (Bank 0) |
| Pin produk 129 | IO — User I/O (Bank 0) |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | IO — User I/O (Bank 0) |
| Pin produk 132 | IO — User I/O (Bank 0) |
| Pin produk 133 | IO — User I/O (Bank 0) |
| Pin produk 134 | VCC — Core supply 1.5V |
| Pin produk 135 | IO — User I/O (Bank 0) |
| Pin produk 136 | IO — User I/O (Bank 0) |
| Pin produk 137 | IO — User I/O (Bank 0) |
| Pin produk 138 | GND — Ground |
| Pin produk 139 | IO — User I/O (Bank 0) |
| Pin produk 140 | IO — User I/O (Bank 0) |
| Pin produk 141 | IO — User I/O (Bank 0) |
| Pin produk 142 | VCC — Core supply 1.5V |
| Pin produk 143 | IO — User I/O (Bank 0) |
| Pin produk 144 | IO — User I/O (Bank 0) |
Aplikasi Umum
A3P250-FGG144I cocok untuk 6 aplikasis: Industrial Control Systems, Communications Infrastructure, Automotive Electronics, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P250-FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 250K gates and 3K logic elements provide sufficient capacity for implementing custom communication protocols, sensor interfaces, and control logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments. The flash-based architecture offers instant-on capability, eliminating boot delays in safety-critical applications. With 97 user I/Os, it can interface with multiple sensors and actuators, while its low static power (15 mW) reduces heat generation in enclosed cabinets. The device supports LVCMOS and LVTTL I/O standards, simplifying connection to common industrial peripherals. Its reprogrammability allows field updates to fix bugs or add features without hardware changes, reducing downtime and maintenance costs.
Direkomendasikan
Communications Infrastructure
In communications infrastructure, the A3P250-FGG144I serves as a cost-effective solution for protocol bridging, packet processing, and interface conversion. Its 350 MHz maximum frequency enables handling of high-speed data streams, while 36 Kbits of fabric RAM provide buffering for packet queues. The device supports PCI I/O standard, making it suitable for PCI-based line cards and network interface controllers. Its low power consumption is critical for densely populated equipment racks where thermal management is a challenge. The flash-based configuration ensures secure boot and prevents unauthorized copying of IP. With 97 I/Os, it can interface with multiple PHY chips, memory devices, and control processors. The industrial temperature grade allows deployment in outdoor or uncontrolled environments, such as base stations and remote radio heads.
Direkomendasikan
Automotive Electronics
The A3P250-FGG144I is suitable for automotive electronics such as infotainment systems, body control modules, and advanced driver-assistance systems (ADAS) that do not require AEC-Q100 qualification. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption helps reduce fuel consumption in electric vehicles. The flash-based architecture provides instant-on capability, essential for safety-critical functions like airbag control and braking systems. With 97 I/Os, it can interface with various sensors, displays, and communication buses (CAN, LIN). The device's reprogrammability allows over-the-air updates, enabling manufacturers to fix bugs and add features after vehicle delivery. Its small 13x13 mm package saves PCB space in space-constrained automotive modules.
Direkomendasikan
Consumer Electronics
In consumer electronics, the A3P250-FGG144I is used in smart home devices, wearable gadgets, and multimedia systems. Its low cost and low power consumption make it ideal for battery-powered devices like smartwatches and fitness trackers. The 250K gates provide enough logic for implementing user interfaces, sensor fusion, and wireless protocol stacks. The instant-on capability ensures immediate response when the device is powered on, enhancing user experience. With 97 I/Os, it can connect to displays, touch sensors, and audio codecs. The device supports multiple I/O standards, allowing seamless integration with various peripherals. Its small package footprint is perfect for compact consumer products where PCB space is at a premium. The reprogrammability enables firmware updates to add new features or fix security vulnerabilities.
Direkomendasikan
Medical Devices
The A3P250-FGG144I is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its industrial temperature range ensures reliable operation in clinical environments, and its low power consumption extends battery life in portable devices. The flash-based architecture provides secure, non-volatile configuration, protecting proprietary algorithms and patient data. With 97 I/Os, it can interface with sensors, ADCs, and display modules. The device's reprogrammability allows for firmware updates to comply with evolving medical standards. Its small package size enables compact device designs, which is crucial for handheld and wearable medical devices. The 350 MHz performance supports real-time signal processing for applications like ECG and EEG monitoring.
Direkomendasikan
Aerospace and Defense
The A3P250-FGG144I is used in aerospace and defense applications such as avionics, satellite subsystems, and military communication systems. Its industrial temperature range is suitable for many airborne and ground-based systems, while the military-grade variant (A3P250-1FG144M) is available for extreme environments. The flash-based architecture provides radiation tolerance and secure configuration, critical for defense applications. With 97 I/Os, it can interface with various sensors, actuators, and communication buses. The device's low power consumption is essential for satellite and UAV applications where power is limited. Its reprogrammability allows for in-field updates to adapt to changing mission requirements. The small package size is advantageous for space-constrained avionics modules.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk A3P250-FGG144I — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | A3P250-FGG144 | A3P250-FG256I | A3P250-PQ208 | A3P250-1FG144M |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 256-FBGA | 208-PQFP | 144-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Elements | 3K | 3K | 3K | 3K | 3K |
| User I/Os | 97 | 97 | 157 | 151 | 97 |
| Fabric RAM | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Military (-55°C to +125°C) |
Diferensiator Kunci
- Flash-based instant-on configuration (vsSRAM-based FPGAs (e.g., Lattice ECP3))
- Low static power consumption (vsA3P250-FG256I)
- Industrial temperature grade (vsA3P250-FGG144)
Catatan Desain
The A3P250-FGG144I requires a 1.5V core supply and separate I/O bank supplies (1.5V, 1.8V, 2.5V, or 3.3V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIO pin to minimize power supply noise. The flash-based FPGA has low static power (~15 mW), but dynamic power scales with switching activity and frequency. Estimate total power using the Microchip Power Calculator tool to ensure adequate thermal management.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane and power plane. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 FPGA User Guide for optimal signal integrity.
A common pitfall is forgetting to connect the JTAG pins for programming. Ensure TCK, TDI, TDO, TMS, and TRST are properly terminated and accessible for in-system programming. Also, do not leave unused I/O pins floating; configure them as outputs or tie them to a defined level to avoid excessive leakage current. Verify that all VCC and GND pins are connected, as missing connections can cause erratic behavior.
Informasi Konformitas
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per package description. REACH and conflict minerals status not specified in provided data.
