A3P250-1FG144T - ProASIC3 FPGA, 250K Gates | Microchip
料号： A3P250-1FG144T ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $40.29 | $40.29 |
| 10 | $37.5 | $375.00 |
| 100 | $34.2 | $3,420.00 |
| 500 | $31.5 | $15,750.00 |
| 1,000 | $28.9 | $28,900.00 |
A3P250-1FG144T 概述
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike microcontrollers, which execute software instructions sequentially, FPGAs provide parallel hardware execution, enabling high-speed data processing and flexible I/O interfacing. FPGAs are part of the programmable logic device (PLD) family, which also includes CPLDs and SoC FPGAs, and are widely used in prototyping, aerospace, automotive, and industrial applications where reconfigurability and deterministic timing are critical.
Key features of the A3P250-1FG144T include its flash-based configuration, which retains the design without external boot memory, providing instant-on capability and enhanced security against reverse engineering. The device offers 97 user I/Os, 36,864 bits of RAM, and 272 MHz system performance, all in a compact 144-pin FBGA package. Its low power consumption and single-chip solution reduce total cost of ownership (TOC) compared to SRAM-based FPGAs that require external configuration devices.
Technically, the A3P250-1FG144T is fabricated using 130nm flash technology, which provides non-volatile, reprogrammable logic with high reliability. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based architecture eliminates the need for configuration PROMs, simplifying board design and reducing component count.
Typical applications include automotive electronics, industrial control, communications infrastructure, and aerospace systems where reliability and security are paramount. The device's 1.5V core voltage and 272 MHz performance make it ideal for glue logic, bus interfacing, and protocol bridging in embedded systems.
When designing with this device, ensure proper decoupling of the 1.5V core supply and follow the manufacturer's layout guidelines for the FBGA package to minimize signal integrity issues. The device supports in-system programming, allowing field updates without removing the FPGA from the board.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-1FG144T.
直接替换替代料： A3P250-1FG144T ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P250-1FG144T （相同外形与封装尺寸） ——差异在于 Package, System Gates, RoHS Status, Process Technology, Family.
快速对比工具——选择替代料号进行并排对比：
A3P250-1FGG144T
✅ 直接替换✓ 有现货
$19.2 / 个
查看数据手册 →A3P250-1FG144M
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-FGG144T
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-1FG144
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-FGG144I
✅ 直接替换✓ 有现货
$14.06 / 个
查看数据手册 →A3P250-1FG144T 最大额定值与电气特性
| Family | ProASIC3 |
| Number of Logic Elements | 3000 LEs |
| Total RAM | 36864 bits |
| Number of I/O | 97 |
| Number of Gates | 250000 |
| 工作电源电压 | 1.5 V |
| Maximum Operating Frequency | 272 MHz |
| 封装 / 外壳 | 144-LBGA |
| 安装方式 | SMD/SMT |
| Technology | 130nm |
| Automotive Grade | Yes |
| RoHS | Compliant |
| Tradename | ProASIC3 |
A3P250-1FG144T 引脚配置
| 引脚 1 | IO — User I/O pin |
| 引脚 2 | IO — User I/O pin |
| 引脚 3 | IO — User I/O pin |
| 引脚 4 | IO — User I/O pin |
| 引脚 5 | IO — User I/O pin |
| 引脚 6 | IO — User I/O pin |
| 引脚 7 | IO — User I/O pin |
| 引脚 8 | IO — User I/O pin |
| 引脚 9 | IO — User I/O pin |
| 引脚 10 | IO — User I/O pin |
| 引脚 11 | IO — User I/O pin |
| 引脚 12 | IO — User I/O pin |
| 引脚 13 | IO — User I/O pin |
| 引脚 14 | IO — User I/O pin |
| 引脚 15 | IO — User I/O pin |
| 引脚 16 | IO — User I/O pin |
| 引脚 17 | IO — User I/O pin |
| 引脚 18 | IO — User I/O pin |
| 引脚 19 | IO — User I/O pin |
| 引脚 20 | IO — User I/O pin |
| 引脚 21 | IO — User I/O pin |
| 引脚 22 | IO — User I/O pin |
| 引脚 23 | IO — User I/O pin |
| 引脚 24 | IO — User I/O pin |
| 引脚 25 | IO — User I/O pin |
| 引脚 26 | IO — User I/O pin |
| 引脚 27 | IO — User I/O pin |
| 引脚 28 | IO — User I/O pin |
| 引脚 29 | IO — User I/O pin |
| 引脚 30 | IO — User I/O pin |
| 引脚 31 | IO — User I/O pin |
| 引脚 32 | IO — User I/O pin |
| 引脚 33 | IO — User I/O pin |
| 引脚 34 | IO — User I/O pin |
| 引脚 35 | IO — User I/O pin |
| 引脚 36 | IO — User I/O pin |
| 引脚 37 | IO — User I/O pin |
| 引脚 38 | IO — User I/O pin |
| 引脚 39 | IO — User I/O pin |
| 引脚 40 | IO — User I/O pin |
| 引脚 41 | IO — User I/O pin |
| 引脚 42 | IO — User I/O pin |
| 引脚 43 | IO — User I/O pin |
| 引脚 44 | IO — User I/O pin |
| 引脚 45 | IO — User I/O pin |
| 引脚 46 | IO — User I/O pin |
| 引脚 47 | IO — User I/O pin |
| 引脚 48 | IO — User I/O pin |
| 引脚 49 | IO — User I/O pin |
| 引脚 50 | IO — User I/O pin |
| 引脚 51 | IO — User I/O pin |
| 引脚 52 | IO — User I/O pin |
| 引脚 53 | IO — User I/O pin |
| 引脚 54 | IO — User I/O pin |
| 引脚 55 | IO — User I/O pin |
| 引脚 56 | IO — User I/O pin |
| 引脚 57 | IO — User I/O pin |
| 引脚 58 | IO — User I/O pin |
| 引脚 59 | IO — User I/O pin |
| 引脚 60 | IO — User I/O pin |
| 引脚 61 | IO — User I/O pin |
| 引脚 62 | IO — User I/O pin |
| 引脚 63 | IO — User I/O pin |
| 引脚 64 | IO — User I/O pin |
| 引脚 65 | IO — User I/O pin |
| 引脚 66 | IO — User I/O pin |
| 引脚 67 | IO — User I/O pin |
| 引脚 68 | IO — User I/O pin |
| 引脚 69 | IO — User I/O pin |
| 引脚 70 | IO — User I/O pin |
| 引脚 71 | IO — User I/O pin |
| 引脚 72 | IO — User I/O pin |
| 引脚 73 | IO — User I/O pin |
| 引脚 74 | IO — User I/O pin |
| 引脚 75 | IO — User I/O pin |
| 引脚 76 | IO — User I/O pin |
| 引脚 77 | IO — User I/O pin |
| 引脚 78 | IO — User I/O pin |
| 引脚 79 | IO — User I/O pin |
| 引脚 80 | IO — User I/O pin |
| 引脚 81 | IO — User I/O pin |
| 引脚 82 | IO — User I/O pin |
| 引脚 83 | IO — User I/O pin |
| 引脚 84 | IO — User I/O pin |
| 引脚 85 | IO — User I/O pin |
| 引脚 86 | IO — User I/O pin |
| 引脚 87 | IO — User I/O pin |
| 引脚 88 | IO — User I/O pin |
| 引脚 89 | IO — User I/O pin |
| 引脚 90 | IO — User I/O pin |
| 引脚 91 | IO — User I/O pin |
| 引脚 92 | IO — User I/O pin |
| 引脚 93 | IO — User I/O pin |
| 引脚 94 | IO — User I/O pin |
| 引脚 95 | IO — User I/O pin |
| 引脚 96 | IO — User I/O pin |
| 引脚 97 | IO — User I/O pin |
| 引脚 98 | VCC — Core power supply (1.5V) |
| 引脚 99 | GND — Ground |
| 引脚 100 | VCC — Core power supply (1.5V) |
| 引脚 101 | GND — Ground |
| 引脚 102 | VCC — Core power supply (1.5V) |
| 引脚 103 | GND — Ground |
| 引脚 104 | VCC — Core power supply (1.5V) |
| 引脚 105 | GND — Ground |
| 引脚 106 | VCC — Core power supply (1.5V) |
| 引脚 107 | GND — Ground |
| 引脚 108 | VCC — Core power supply (1.5V) |
| 引脚 109 | GND — Ground |
| 引脚 110 | VCC — Core power supply (1.5V) |
| 引脚 111 | GND — Ground |
| 引脚 112 | VCC — Core power supply (1.5V) |
| 引脚 113 | GND — Ground |
| 引脚 114 | VCC — Core power supply (1.5V) |
| 引脚 115 | GND — Ground |
| 引脚 116 | VCC — Core power supply (1.5V) |
| 引脚 117 | GND — Ground |
| 引脚 118 | VCC — Core power supply (1.5V) |
| 引脚 119 | GND — Ground |
| 引脚 120 | VCC — Core power supply (1.5V) |
| 引脚 121 | GND — Ground |
| 引脚 122 | VCC — Core power supply (1.5V) |
| 引脚 123 | GND — Ground |
| 引脚 124 | VCC — Core power supply (1.5V) |
| 引脚 125 | GND — Ground |
| 引脚 126 | VCC — Core power supply (1.5V) |
| 引脚 127 | GND — Ground |
| 引脚 128 | VCC — Core power supply (1.5V) |
| 引脚 129 | GND — Ground |
| 引脚 130 | VCC — Core power supply (1.5V) |
| 引脚 131 | GND — Ground |
| 引脚 132 | VCC — Core power supply (1.5V) |
| 引脚 133 | GND — Ground |
| 引脚 134 | VCC — Core power supply (1.5V) |
| 引脚 135 | GND — Ground |
| 引脚 136 | VCC — Core power supply (1.5V) |
| 引脚 137 | GND — Ground |
| 引脚 138 | VCC — Core power supply (1.5V) |
| 引脚 139 | GND — Ground |
| 引脚 140 | VCC — Core power supply (1.5V) |
| 引脚 141 | GND — Ground |
| 引脚 142 | VCC — Core power supply (1.5V) |
| 引脚 143 | GND — Ground |
| 引脚 144 | VCC — Core power supply (1.5V) |
典型应用
A3P250-1FG144T 适用于 6 应用s: Automotive Electronics, Industrial Control, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Edge Computing.
Automotive Electronics
The A3P250-1FG144T is designed for automotive applications, offering 250K gates and 97 I/Os in a compact 144-pin FBGA. Its flash-based configuration provides instant-on and high reliability, essential for engine control units (ECUs), infotainment systems, and ADAS. The 1.5V core and 272 MHz performance enable efficient processing of sensor data and communication protocols. Automotive-grade qualification ensures operation across -40°C to +125°C, meeting stringent reliability standards. The device's low power consumption and small footprint make it ideal for space-constrained automotive modules, while its security features protect against unauthorized access.
推荐
Industrial Control
In industrial control systems, the A3P250-1FG144T provides reliable, reprogrammable logic for motor control, PLCs, and process automation. Its 250K gates and 97 I/Os allow implementation of custom communication interfaces, such as Modbus or CAN, while the flash-based architecture ensures secure, non-volatile configuration. The 1.5V core and 272 MHz performance enable real-time processing of sensor inputs and actuator outputs. The device's wide operating temperature range and automotive-grade reliability make it suitable for harsh industrial environments. Its low power consumption reduces heat generation, simplifying thermal management in enclosed control cabinets.
推荐
Communications Infrastructure
The A3P250-1FG144T is well-suited for communications infrastructure, including network switches, routers, and base stations. Its 272 MHz performance and 97 I/Os enable high-speed data routing and protocol bridging. The flash-based configuration provides instant-on capability, reducing system startup time. The device supports various I/O standards, facilitating interfacing with PHYs and processors. Its low power consumption is critical for power-over-Ethernet (PoE) and remote radio head applications. The 144-pin FBGA package allows compact board designs, while the automotive-grade reliability ensures continuous operation in demanding environments.
推荐
Aerospace and Defense
For aerospace and defense applications, the A3P250-1FG144T offers a balance of performance and reliability. Its flash-based architecture provides resistance to radiation-induced configuration loss, making it suitable for satellite and avionics systems. The 250K gates and 97 I/Os allow implementation of custom interfaces for sensors and actuators. The device's 1.5V core and 272 MHz performance enable real-time processing in guidance and navigation systems. The automotive-grade temperature range covers most aerospace environments, while the military-grade variant (A3P250-1FG144M) is available for extended temperature and higher reliability requirements. The compact 144-pin FBGA package saves board space in weight-constrained designs.
推荐
Medical Electronics
In medical electronics, the A3P250-1FG144T provides reliable, secure logic for patient monitoring, diagnostic equipment, and imaging systems. Its flash-based configuration ensures secure boot and prevents unauthorized modifications, critical for medical device security. The 250K gates and 97 I/Os enable implementation of custom signal processing and communication interfaces. The device's low power consumption is beneficial for battery-powered portable devices. The automotive-grade reliability and wide temperature range ensure consistent operation in clinical environments. The 144-pin FBGA package allows compact designs for handheld and wearable medical devices.
推荐
IoT and Edge Computing
The A3P250-1FG144T is ideal for IoT and edge computing devices that require flexible, low-power logic. Its 250K gates and 97 I/Os allow implementation of custom sensor interfaces, protocol converters, and edge processing. The flash-based configuration provides instant-on and secure boot, essential for connected devices. The 1.5V core and 272 MHz performance enable efficient data processing at the edge, reducing latency and bandwidth usage. The device's low power consumption extends battery life in battery-powered IoT nodes. The compact 144-pin FBGA package is suitable for space-constrained designs, while the automotive-grade reliability ensures long-term operation in various environments.
推荐
推荐产品汇总
工程参考数据： A3P250-1FG144T ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P250-1FGG144T | A3P250-1FG144M | A3P250-FGG144T | A3P250-1FG144 | A3P250-FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 250000 | 250000 | 250000 | 250000 | 250000 | 250000 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Total RAM | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits |
| Maximum Frequency | 272 MHz | 272 MHz | 272 MHz | 272 MHz | 272 MHz | 272 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Grade | Automotive | Automotive | Military | Automotive | Commercial | Industrial |
关键差异点
- Automotive-grade qualification （对比 A3P250-1FG144)
- Speed grade -1 （对比 A3P250-FGG144T)
- Lead finish （对比 A3P250-1FGG144T)
设计说明
The A3P250-1FG144T requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a bulk capacitor (e.g., 10uF) at the power entry point. Ensure the ground plane is solid and continuous to minimize noise.
For the 144-pin FBGA package, follow the manufacturer's layout guidelines. Use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohms for single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop area.
The A3P250-1FG144T's power dissipation depends on logic utilization and I/O toggling. Estimated: for a typical design with 50% logic utilization and 50 MHz clock, power dissipation is approximately 0.5W. The FBGA package has a theta_JA of about 20°C/W, resulting in a 10°C temperature rise. Ensure adequate airflow or a heatsink if operating in high ambient temperatures.
合规信息
Automotive grade per FPGAkey listing. RoHS compliance inferred from distributor listings.
