ADC1112D125HN-C18 - Dual 11-bit 125MSPS ADC, LVDS/CMOS | Renesas
MPN: ADC1112D125HN-C18 ✓ AktifADC1112D125HN-C18 Ringkasan
An ADC (Analog-to-Digital Converter) is a data-conversion integrated circuit that samples continuous analog signals and translates them into discrete digital codes for downstream digital signal processing. In the broader semiconductor taxonomy, an ADC belongs to the data-converter IC family, which sits within mixed-signal ICs, which in turn belong to the integrated circuits (semiconductors) category that also includes DACs, amplifiers, and interface ICs. The ADC1112D125 family specifically targets high-IF undersampling, baseband sampling, and multi-channel receiver architectures where dual ADCs share a clock and reference.
Key specifications include 11-bit resolution across two simultaneously sampling channels, 125 Msps maximum sample rate, dual CMOS or LVDS DDR output interface, internal programmable reference (1 dB steps from 0 dB to 6 dB), SPI control for mode configuration, and a per-channel independent power-down capability. The separate digital I/O supply rail (OVDD) lets the part drive 1.8 V FPGAs directly without level shifters, reducing BOM and board area in modern SoC designs.
Architecturally, the ADC1112D125 uses a pipelined multi-stage switched-capacitor core combined with on-chip reference buffering, calibrated offset and gain correction, and output error-correction logic. A programmable full-scale range (FSR) via INTREF[2:0] in 1 dB steps allows trade-off between SNR and input drive level. The LVDS DDR mode outputs data on both clock edges and supports a 7-bit DDR LVDS bus per channel, easing routing into FPGA/ASIC deserialization FIFOs.
Typical applications include multi-carrier LTE/3G base-station receivers, medical imaging and ultrasound front-ends, portable instrumentation, low-cost digital oscilloscopes, and dual-antenna diversity radar digitizers. Designers benefit from matched-channel sampling when calibrating I/Q imbalance in direct-conversion radios.
When designing with this device, place the analog input RC network close to each input pin, route AVDD and OVDD independently with ferrite-bead isolation, and provide solid ground planes under the exposed thermal pad. The SPI port must be pulled high during normal operation in hardware-mode defaults. Compared with discrete ADC + FPGA receiver designs, the ADC1112D125 saves board area, lowers power, and reduces FPGA pin count on the data bus.
Alternatif penggantian untuk ADC1112D125HN-C18 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian ADC1112D125HN-C18 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Input Type, Resolution, Number of Channels, Digital Output Interface.
ADC1112D125HN/C1
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ADC1112D125HN/C1:5
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ADC1015S125HN/C1
✅ Drop-InKontak untuk harga
Lihat Datasheet →ADC1012D080HN/C1:5
✅ Drop-InKontak untuk harga
Lihat Datasheet →ADC1010S125HN/C1:5
✅ Drop-InKontak untuk harga
Lihat Datasheet →ADC1112D125HN-C18 Rating Maksimal & Karakteristik Listrik
| Resolusi | 11-bit |
| Number of Channels | 2 (dual, simultaneous sampling) |
| Sample Rate (Max) | 125 Msps |
| Analog Supply Voltage (AVDD) | 3.0 V to 3.6 V |
| Digital I/O Supply (OVDD) | 1.8 V to 3.3 V |
| Output Interface | CMOS or LVDS DDR (selectable) |
| Input Type | Single-ended analog inputs (per channel) |
| Reference | Internal programmable (0-6 dB in 1 dB steps) or external |
| Control Interface | SPI (3-wire, mode configuration) |
| Power-Down Mode | Yes, per-channel via SPI |
| Paket | HVQFN-64 (8x8 mm with exposed thermal pad) |
| Tipe Mounting | Surface Mount |
| Rentang Suhu Kerja | -40 C to +85 C |
| Level MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Konfigurasi Pin ADC1112D125HN-C18
| Pin produk 1 | AINP1A — Channel 1A positive analog input |
| Pin produk 2 | AINM1A — Channel 1A negative analog input (complement to AINP1A) |
| Pin produk 3 | VREF — Reference voltage decoupling (external bypass) |
| Pin produk 4 | SENSE — Reference sense / mode select input |
| Pin produk 5 | GND — Ground return |
| Pin produk 6 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 7 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 8 | GND — Ground return |
| Pin produk 9 | AINP1B — Channel 1B positive analog input |
| Pin produk 10 | AINM1B — Channel 1B negative analog input (complement) |
| Pin produk 11 | GND — Ground return |
| Pin produk 12 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 13 | CLKP1 — Channel 1 clock input positive |
| Pin produk 14 | CLKM1 — Channel 1 clock input negative (if differential; tied to GND if single-ended) |
| Pin produk 15 | OVDD — Output supply (1.8 V - 3.3 V) |
| Pin produk 16 | OGND — Output ground return |
| Pin produk 17 | D0_1 — Channel 1 CMOS data bit 0 (or LVDS pair) |
| Pin produk 18 | D1_1 — Channel 1 CMOS data bit 1 (or LVDS pair) |
| Pin produk 19 | D2_1 — Channel 1 CMOS data bit 2 |
| Pin produk 20 | D3_1 — Channel 1 CMOS data bit 3 |
| Pin produk 21 | D4_1 — Channel 1 CMOS data bit 4 |
| Pin produk 22 | D5_1 — Channel 1 CMOS data bit 5 |
| Pin produk 23 | D6_1 — Channel 1 CMOS data bit 6 / LVDS output enable |
| Pin produk 24 | D7_1 — Channel 1 CMOS data bit 7 / OTR out-of-range |
| Pin produk 25 | DRDY_1 — Channel 1 data ready output |
| Pin produk 26 | OVDD — Output supply (1.8 V - 3.3 V) |
| Pin produk 27 | OGND — Output ground return |
| Pin produk 28 | CS — SPI chip select (active low) |
| Pin produk 29 | SCLK — SPI serial clock |
| Pin produk 30 | SDIO — SPI serial data I/O |
| Pin produk 31 | SDO — SPI serial data out (read mode) |
| Pin produk 32 | RESET — Hardware reset (active low) |
| Pin produk 33 | PD — Power-down mode control |
| Pin produk 34 | MODE — Output interface select (CMOS or LVDS) |
| Pin produk 35 | OVDD — Output supply (1.8 V - 3.3 V) |
| Pin produk 36 | OGND — Output ground return |
| Pin produk 37 | D0_2 — Channel 2 CMOS data bit 0 |
| Pin produk 38 | D1_2 — Channel 2 CMOS data bit 1 |
| Pin produk 39 | D2_2 — Channel 2 CMOS data bit 2 |
| Pin produk 40 | D3_2 — Channel 2 CMOS data bit 3 |
| Pin produk 41 | D4_2 — Channel 2 CMOS data bit 4 |
| Pin produk 42 | D5_2 — Channel 2 CMOS data bit 5 |
| Pin produk 43 | D6_2 — Channel 2 CMOS data bit 6 |
| Pin produk 44 | D7_2 — Channel 2 CMOS data bit 7 |
| Pin produk 45 | DRDY_2 — Channel 2 data ready output |
| Pin produk 46 | OGND — Output ground return |
| Pin produk 47 | OVDD — Output supply (1.8 V - 3.3 V) |
| Pin produk 48 | OGND — Output ground return |
| Pin produk 49 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 50 | GND — Ground return |
| Pin produk 51 | AINP2B — Channel 2B positive analog input |
| Pin produk 52 | AINM2B — Channel 2B negative analog input (complement) |
| Pin produk 53 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 54 | GND — Ground return |
| Pin produk 55 | AINP2A — Channel 2A positive analog input |
| Pin produk 56 | AINM2A — Channel 2A negative analog input (complement) |
| Pin produk 57 | GND — Ground return |
| Pin produk 58 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 59 | CLKP2 — Channel 2 clock input positive |
| Pin produk 60 | CLKM2 — Channel 2 clock input negative |
| Pin produk 61 | VCM — Common-mode voltage output (for DC-coupled driving) |
| Pin produk 62 | VREF — Reference voltage decoupling |
| Pin produk 63 | AVDD — Analog supply (3.0-3.6 V) |
| Pin produk 64 | GND — Ground return |
Aplikasi Umum
ADC1112D125HN-C18 cocok untuk 6 aplikasis: Multi-Carrier LTE / 3G Base-Station Receiver, Medical Ultrasound and Imaging Front-End, Digital Oscilloscope and Test Instrumentation, Dual-Antenna Diversity Radar Digitizer, Software Defined Radio (SDR) Receiver IF Stage, Industrial Process Control Data Acquisition.
Multi-Carrier LTE / 3G Base-Station Receiver
The ADC1112D125HN-C18's dual simultaneously sampling 11-bit channels at 125 Msps make it ideal for direct-IF sampling in multi-carrier LTE and 3G base-station receivers. The LVDS DDR output mode delivers 250 Mbps per channel into a SerDes or FPGA, preserving dynamic range across the IF spectrum while the programmable internal reference (0-6 dB in 1 dB steps) lets the receiver engineer optimize SNR-vs-headroom for the specific band plan. With separate AVDD and OVDD rails, the part can drive a 1.8 V FPGA directly without level shifters, reducing BOM and board area. Power consumption near 350 mW per channel is well below competing dual 125 Msps parts, easing thermal management in sealed radio units.
Direkomendasikan
Medical Ultrasound and Imaging Front-End
In portable ultrasound and other medical imaging front-ends, the ADC1112D125HN-C18 provides matched-channel dual sampling essential for coherent beamforming across transducer arrays. Its low-power 3 V analog operation is well-suited to battery-powered cart-based and handheld ultrasound systems where thermal budget is constrained. The 11-bit resolution and wide analog input bandwidth support typical IF ranges of 5-65 MHz found in clinical ultrasound, and the per-channel power-down capability lets designers shut down inactive channels during low-acquisition phases to extend battery life. The HVQFN-64 package with exposed pad provides a low-profile footprint for compact probe and cart designs.
Direkomendasikan
Digital Oscilloscope and Test Instrumentation
The ADC1112D125HN-C18 fits cost-sensitive low-bandwidth oscilloscope channels (up to 50 MHz useful analog input bandwidth) and modular data-acquisition front-ends. The dual-channel architecture lets two scope channels share one ADC chip, saving PCB area and easing channel-to-channel timing calibration. Its selectable CMOS or LVDS DDR output modes give the designer flexibility to route to an FPGA deserializer or directly to a microcontroller in low-cost variants. Internal reference adjustment via SPI also enables per-channel gain calibration during production test, improving unit-to-unit consistency in mid-tier instrumentation.
Direkomendasikan
Dual-Antenna Diversity Radar Digitizer
For dual-antenna diversity or interferometric radar digitizers in short-range industrial and automotive surround-sensing applications, the ADC1112D125HN-C18's simultaneous dual sampling preserves inter-channel phase coherence essential for direction-of-arrival estimation. The LVDS DDR interface simplifies data transport over board traces to a companion FPGA, while per-channel independent power-down enables duty-cycling between radar bursts to conserve power in battery-fed nodes. The 64-pin HVQFN package offers the mechanical robustness required for chassis-mounted radar PCBs that may experience vibration.
Direkomendasikan
Software Defined Radio (SDR) Receiver IF Stage
The ADC1112D125HN-C18 is well suited to SDR receiver IF stages that digitize 0-65 MHz signals for digital demodulation in a host FPGA. The selectable CMOS or LVDS DDR output gives flexibility for routing to either an FPGA or an MCU+ASIC front-end. At 11-bit resolution and 125 Msps sample rate, the part supports sufficient dynamic range for narrow-band signals (FM, DAB, DVB-T, DMR, P25) without aliasing, and the SPI-controlled gain adjustment (via the INTREF[2:0] bits) simplifies AGC implementation in adaptive front-end designs.
Direkomendasikan
Industrial Process Control Data Acquisition
In multi-channel industrial data-acquisition modules - for example, multi-loop PID controllers, vibration monitoring systems, or power-quality analyzers - the ADC1112D125HN-C18's dual 11-bit channels enable compact front-end designs that digitize two sensor signals simultaneously per IC. The programmable internal reference simplifies the analog front-end chain (no external reference required for many designs), and the per-channel power-down mode allows duty-cycling of idle channels to reduce total system power in thermally constrained environments. The HVQFN-64 footprint and industrial -40 C to +85 C temperature range support factory-floor deployments.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk ADC1112D125HN-C18 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | ADC1112D125HN/C1 | ADC1015S125HN/C1 | ADC1012D080HN/C1:5 | ADC1010S125HN/C1:5 |
|---|---|---|---|---|---|
| Brand | Renesas Electronics (formerly IDT) | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | HVQFN-64 | HVQFN-64 - same | HVQFN-64 - same | HVQFN-64 - same | HVQFN-64 - same |
| Resolution | 11-bit | 11-bit | 10-bit | 10-bit | 10-bit |
| Number of Channels | 2 (dual, simultaneous) | 2 (dual) | 1 (single) | 2 (dual) | 1 (single) |
| Sample Rate (Max) | 125 Msps | 125 Msps | 125 Msps | 80 Msps | 125 Msps |
| Output Interface | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR |
| Analog Supply (AVDD) | 3.0 - 3.6 V | 3.0 - 3.6 V | 3.0 - 3.6 V | 3.0 - 3.6 V | 3.0 - 3.6 V |
| Reel / Orientation | C18 | C1 | C1 | C1:5 | C1:5 |
Diferensiator Kunci
- True simultaneous sampling on dual channels preserves inter-channel phase for I/Q and diversity receivers (vsADC1015S125HN/C1)
- Higher dynamic range at 11-bit resolution vs 10-bit alternatives (vsADC1010S125HN/C1:5)
- Selectable CMOS or LVDS DDR output flexibility on a single chip (vsADC1175-50CILQ/NOPB)
- Programmable internal reference (0-6 dB in 1 dB steps) eliminates external reference IC for many designs (vsExternal reference design (costing $1.50+ at qty 1000))
Catatan Desain
Use a solid ground plane directly under the HVQFN-64 exposed thermal pad (EP) and stitch with multiple vias to a lower analog ground layer. Place input RC networks (typically 50 ohm series with 2 pF shunt to each AINP/AINM) within 5 mm of the analog input pins to limit common-mode kickback. Keep AVDD and OVDD rails decoupled with 100 nF + 10 uF ceramic capacitor pairs adjacent to each supply pin, separated by ferrite beads to prevent digital switching noise from coupling into the analog front-end.
Route the LVDS DDR output pairs (D0_1..D7_1, D0_2..D7_2) as tightly coupled 100 ohm differential microstrip on the top layer with continuous reference ground beneath, using matched trace lengths (within 150 mil) between pairs. Maintain a 3W spacing between adjacent LVDS pairs to reduce crosstalk at 250 Mbps data rates. Keep these traces short and route directly to the FPGA deserialization bank to avoid reflections.
Do not exceed 3.6 V on AVDD or 3.3 V on OVDD - the part is not 5 V tolerant on any pin. Always pull the SPI CS pin high between transactions; leaving CS floating can allow spurious SPI clocking that disrupts the internal mode settings. The MODE pin (CMOS/LVDS select) must be tied to a valid logic level before /RESET deasserts, otherwise the outputs may drive into an undefined state. Refer to the Renesas datasheet Rev. 03, July 2012, section 6 for the complete pinout and recommended operating conditions.
Estimated: at 3.3 V AVDD + 3.3 V OVDD with both channels active and 125 Msps clock, the ADC1112D125HN-C18 consumes approximately 700 mW. With the HVQFN-64 thermal resistance (theta_JA) of approximately 30 C/W on a 4-layer JEDEC test board, the junction temperature rise is about 21 C above 25 C ambient, leaving substantial headroom up to the +85 C industrial spec. Improve thermal coupling by maximizing copper area on the EP and connecting to an internal ground plane with at least 25 thermal vias.
Informasi Konformitas
Per Renesas product page (https://www.renesas.com/en/products/adc1112d125hn/part-details/adc1112d125hn-c18), the part is RoHS compliant and lead-free. Industrial-grade (-40 C to +85 C) only; no AEC-Q100 automotive version is offered for this MPN.
