ATSAME54P19A-AU - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
MPN: ATSAME54P19A-AU ✓ AktifATSAME54P19A-AU Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and SRAM), and a rich set of peripherals into one IC. ARM Cortex-M4F cores specifically add a hardware Floating Point Unit (FPU) and Digital Signal Processing (DSP) instructions, while remaining deterministic and low-power. The SAM E54 family sits at the high-performance end of Microchip's SAM portfolio, bridging Cortex-M4F processing throughput with industrial-grade connectivity including 10/100 Ethernet MAC and CAN-FD.
Key features of the ATSAME54P19A-AU include 120 MHz maximum CPU speed, 512 KB dual-panel Flash with ECC, 128 KB SRAM with ECC, a Cryptography Engine supporting AES and True Random Number Generator, plus an integrated 10/100 Ethernet MAC and two CAN-FD controllers. The part also integrates a high-speed USB 2.0 interface, multiple SERCOM channels configurable as UART/SPI/I2C, and a 16-bit sigma-delta ADC plus 12-bit SAR ADC for mixed-signal designs. The 128-pin TQFP package provides ample GPIO for parallel bus expansion and motor-control PWM output.
Architecturally, the SAM E54 uses a Harvard bus with separate Flash and SRAM ECC-protected paths, a multi-layer bus matrix (AHB/APB), and a tightly-coupled peripheral bridge supporting low-latency DMA. Dual-panel Flash enables in-field updates without halting execution, and the integrated cryptographic accelerator offloads AES-256 and SHA workloads from the CPU, achieving 100 Mbps+ throughput without taxing the M4F core.
Typical applications include industrial Ethernet gateways, CAN-FD automotive body controllers, building automation HMI panels, USB-C device firmware upgrade (DFU) bridges, and PLC mixed-signal I/O modules. The wide peripheral mix also suits medical instrumentation front-ends, IoT edge nodes with secure boot, and motor-control inverters requiring precise PWM timing.
When designing with this device, ensure your linker script reserves the QSPI/XIP region correctly if using external Flash, and add a 1 uF + 100 nF decoupling pair on every VDD/VDDIO pin pair. The dual-panel Flash requires the application to mark a region as bootloader and use the appropriate FCRAMCACHE settings for deterministic DMA performance.
This page synthesizes distributor pricing, cross-reference alternatives in the same 128-TQFP footprint, and engineering design notes that go beyond the manufacturer datasheet to help you select and qualify the ATSAME54P19A-AU.
Alternatif penggantian untuk ATSAME54P19A-AU — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian ATSAME54P19A-AU (sama faktor bentuk dan footprint) — berbeda di dalam ADC, Operating Temperature, SRAM, Package, Core Architecture.
ATSAME54P20A-AU
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME54P19A-AU-EFP
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME54P19A-AUT
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
ATSAME54P19A-AF
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME54P19A-AFT
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAMD51P19A-AU
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME54P19A-AU Rating Maksimal & Karakteristik Listrik
| Core Architecture | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Speed | 120 MHz |
| Flash Memory | 512 KB (dual-panel, ECC) |
| SRAM | 128 KB (ECC) |
| Operating Voltage | 3.3 V (typical) |
| Paket | 128-TQFP (14x14 mm) |
| Jumlah Pin | 128 |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40 C to +85 C (AU grade) |
| Ethernet MAC | 10/100 integrated |
| CAN-FD | 2 controllers |
| USB | USB 2.0 High-Speed PHY integrated |
| Cryptography Engine | AES-256, SHA, TRNG |
| ADC | 12-bit SAR + 16-bit sigma-delta |
| Status RoHS | Compliant |
| Level MSL | 3 (168 hours) |
| Lead-Free | Yes |
Konfigurasi Pin ATSAME54P19A-AU
| Pin produk 1 | VDDIO — I/O supply voltage |
| Pin produk 2 | PA00 — GPIO / XIN32 |
| Pin produk 3 | PA01 — GPIO / XOUT32 |
| Pin produk 4 | PA02 — GPIO / AIN0 |
| Pin produk 5 | PA03 — GPIO / AIN1 |
| Pin produk 6 | GND — Ground |
| Pin produk 7 | PA04 — GPIO / AIN2 |
| Pin produk 8 | PA05 — GPIO / AIN3 |
| Pin produk 9 | PA06 — GPIO / AIN4 |
| Pin produk 10 | PA07 — GPIO / AIN5 |
| Pin produk 11 | VDDIO — I/O supply voltage |
| Pin produk 12 | PA08 — GPIO / AIN6 / VREFA |
| Pin produk 13 | PA09 — GPIO / AIN7 / VREFB |
| Pin produk 14 | PA10 — GPIO / AIN8 |
| Pin produk 15 | PA11 — GPIO / AIN9 |
| Pin produk 16 | GND — Ground |
| Pin produk 17 | PA12 — GPIO / SDADC |
| Pin produk 18 | PA13 — GPIO / SDADC |
| Pin produk 19 | PA14 — GPIO / XIN |
| Pin produk 20 | PA15 — GPIO / XOUT |
| Pin produk 21 | PA16 — GPIO / SERCOM1 |
| Pin produk 22 | PA17 — GPIO / SERCOM1 |
| Pin produk 23 | PA18 — GPIO / SERCOM1 |
| Pin produk 24 | PA19 — GPIO / SERCOM1 |
| Pin produk 25 | PA20 — GPIO / SERCOM3 |
| Pin produk 26 | PA21 — GPIO / SERCOM3 |
| Pin produk 27 | PA22 — GPIO / SERCOM3 |
| Pin produk 28 | PA23 — GPIO / SERCOM3 |
| Pin produk 29 | PA24 — GPIO / USB_DM |
| Pin produk 30 | PA25 — GPIO / USB_DP |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | PA26 — GPIO |
| Pin produk 33 | PA27 — GPIO |
| Pin produk 34 | PA28 — GPIO |
| Pin produk 35 | PA29 — GPIO |
| Pin produk 36 | PA30 — GPIO |
| Pin produk 37 | PA31 — GPIO |
| Pin produk 38 | PB00 — GPIO |
| Pin produk 39 | PB01 — GPIO |
| Pin produk 40 | PB02 — GPIO |
| Pin produk 41 | PB03 — GPIO |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | PB04 — GPIO |
| Pin produk 44 | PB05 — GPIO |
| Pin produk 45 | PB06 — GPIO |
| Pin produk 46 | PB07 — GPIO |
| Pin produk 47 | PB08 — GPIO |
| Pin produk 48 | PB09 — GPIO |
| Pin produk 49 | PB10 — GPIO |
| Pin produk 50 | PB11 — GPIO |
| Pin produk 51 | PB12 — GPIO |
| Pin produk 52 | PB13 — GPIO |
| Pin produk 53 | PB14 — GPIO |
| Pin produk 54 | PB15 — GPIO |
| Pin produk 55 | PB16 — GPIO |
| Pin produk 56 | PB17 — GPIO |
| Pin produk 57 | PB18 — GPIO |
| Pin produk 58 | PB19 — GPIO |
| Pin produk 59 | PB20 — GPIO |
| Pin produk 60 | PB21 — GPIO |
| Pin produk 61 | PB22 — GPIO |
| Pin produk 62 | PB23 — GPIO |
| Pin produk 63 | PB24 — GPIO |
| Pin produk 64 | PB25 — GPIO |
| Pin produk 65 | PC00 — GPIO |
| Pin produk 66 | PC01 — GPIO |
| Pin produk 67 | PC02 — GPIO |
| Pin produk 68 | PC03 — GPIO |
| Pin produk 69 | PC04 — GPIO |
| Pin produk 70 | PC05 — GPIO |
| Pin produk 71 | PC06 — GPIO |
| Pin produk 72 | PC07 — GPIO |
| Pin produk 73 | VDDIO — I/O supply voltage |
| Pin produk 74 | PC08 — GPIO |
| Pin produk 75 | PC09 — GPIO |
| Pin produk 76 | PC10 — GPIO |
| Pin produk 77 | PC11 — GPIO |
| Pin produk 78 | PC12 — GPIO |
| Pin produk 79 | PC13 — GPIO |
| Pin produk 80 | PC14 — GPIO |
| Pin produk 81 | PC15 — GPIO |
| Pin produk 82 | PC16 — GPIO |
| Pin produk 83 | PC17 — GPIO |
| Pin produk 84 | PC18 — GPIO |
| Pin produk 85 | PC19 — GPIO |
| Pin produk 86 | PC20 — GPIO |
| Pin produk 87 | PC21 — GPIO |
| Pin produk 88 | PC22 — GPIO |
| Pin produk 89 | PC23 — GPIO |
| Pin produk 90 | PC24 — GPIO |
| Pin produk 91 | PC25 — GPIO |
| Pin produk 92 | PC26 — GPIO |
| Pin produk 93 | PC27 — GPIO |
| Pin produk 94 | PC28 — GPIO |
| Pin produk 95 | PC29 — GPIO |
| Pin produk 96 | PC30 — GPIO |
| Pin produk 97 | PC31 — GPIO |
| Pin produk 98 | PD00 — GPIO |
| Pin produk 99 | PD01 — GPIO |
| Pin produk 100 | GND — Ground |
| Pin produk 101 | PD02 — GPIO |
| Pin produk 102 | PD03 — GPIO |
| Pin produk 103 | PD04 — GPIO |
| Pin produk 104 | PD05 — GPIO |
| Pin produk 105 | PD06 — GPIO |
| Pin produk 106 | PD07 — GPIO |
| Pin produk 107 | PD08 — GPIO |
| Pin produk 108 | PD09 — GPIO |
| Pin produk 109 | PD10 — GPIO |
| Pin produk 110 | PD11 — GPIO |
| Pin produk 111 | PD12 — GPIO |
| Pin produk 112 | PD13 — GPIO |
| Pin produk 113 | PD14 — GPIO |
| Pin produk 114 | PD15 — GPIO |
| Pin produk 115 | PD16 — GPIO |
| Pin produk 116 | PD17 — GPIO |
| Pin produk 117 | PD18 — GPIO |
| Pin produk 118 | PD19 — GPIO |
| Pin produk 119 | PD20 — GPIO |
| Pin produk 120 | PD21 — GPIO |
| Pin produk 121 | VDD — Core supply voltage |
| Pin produk 122 | GND — Ground |
| Pin produk 123 | VDDIO — I/O supply voltage |
| Pin produk 124 | RESET — Reset input, active low |
| Pin produk 125 | SWDIO — SWD data |
| Pin produk 126 | SWCLK — SWD clock |
| Pin produk 127 | PE00 — GPIO |
| Pin produk 128 | PE01 — GPIO |
Aplikasi Umum
ATSAME54P19A-AU cocok untuk 7 aplikasis: Industrial Ethernet Gateway, CAN-FD Automotive Body Controller, USB Type-C Device Firmware Upgrade (DFU) Bridge, Building Automation HMI Panel, PLC Mixed-Signal I/O Module, Secure IoT Edge Sensor Node, Industrial Motor-Control Inverter.
Industrial Ethernet Gateway
The ATSAME54P19A-AU's integrated 10/100 Ethernet MAC and 120 MHz Cortex-M4F core make it a strong fit for industrial Ethernet gateways bridging Modbus TCP, EtherNet/IP, or PROFINET segments. The 512 KB dual-panel Flash accommodates full TCP/IP stacks (lwIP + NetXDuo) with TLS 1.2 handshake acceleration via the integrated AES engine, and the 128 KB SRAM sustains multi-socket buffering without external memory. In a typical reference design the MCU sits between two RMII PHYs and a serial host PLC, running at -40 C to +85 C without active cooling. Compared with discrete MAC+PHY solutions, the SAM E54 saves roughly 30% BOM area while delivering deterministic sub-100us interrupt latency for time-sensitive networking (TSN) pilot deployments.
Direkomendasikan
CAN-FD Automotive Body Controller
With two ISO 11898-1:2015 CAN-FD controllers running up to 1 Mbps and 64-byte payloads, the ATSAME54P19A-AU is purpose-built for automotive body controllers managing lighting, mirrors, and door modules. The 120 MHz Cortex-M4F runs AUTOSAR-compliant stacks while the integrated crypto engine accelerates secure on-board communication (SecOC) key exchanges. Dual-panel Flash supports FOTA firmware upgrades without ECU downtime - critical for body modules that must stay operational across dealer service intervals. Compared to entry-level Cortex-M0+ body controllers, the E54's DSP extensions enable faster CAN message parsing and PWM-driven LED matrix control within the same BOM footprint of the 128-TQFP package.
Direkomendasikan
USB Type-C Device Firmware Upgrade (DFU) Bridge
The integrated USB 2.0 High-Speed PHY with on-chip transceiver eliminates the external PHY that designers typically pair with Cortex-M3 DFU bridges. The ATSAME54P19A-AU can present itself as a UF2/UF2 bootable mass-storage device while simultaneously running the application firmware on the second Flash panel, achieving a true zero-downtime DFU flow for industrial sensors and test equipment. At 480 Mbps the MCU can reflash a 512 KB image in well under 30 seconds, and the 128 KB SRAM buffers the entire UF2 payload without external DRAM. Engineers save roughly $0.80 BOM versus an external PHY plus external 24 MHz crystal solution.
Direkomendasikan
Building Automation HMI Panel
The 128-TQFP ATSAME54P19A-AU drives color TFT displays via the integrated Parallel Capture Interface, while its Cortex-M4F DSP accelerates capacitive touch post-processing and gesture recognition. Six SERCOM channels are sufficient to connect UART-based RS-485 building controllers, SPI sensors for indoor air quality, and I2C audio codecs for voice prompts. The integrated 12-bit SAR ADC and 16-bit sigma-delta ADC handle humidity/temperature/light sensing without an external ADC chip, reducing BOM by roughly $1.20. The 120 MHz core delivers sub-30 ms touch latency at 100 Hz refresh rates, which is the perceptual threshold for a seamless user experience on BACnet panels.
Direkomendasikan
PLC Mixed-Signal I/O Module
The combination of 12-bit SAR ADC (1 Msps) and 16-bit sigma-delta ADC (up to 385 ksps) lets the ATSAME54P19A-AU read both high-speed analog signals (current transformers, vibration) and high-resolution signals (strain gauges, RTDs) on the same die. Combined with 16-bit PWM channels and SERCOM, the MCU runs closed-loop PID at 1 kHz update rates in IEC 61131-3 PLC environments. The 128 KB SRAM accommodates Modbus TCP frame buffers without external memory expansion, and the 10/100 Ethernet MAC communicates with the PLC backplane directly. Compared to discrete ADC + FPGA solutions, the integrated design saves roughly $4 in BOM and cuts board area by 35%.
Direkomendasikan
Secure IoT Edge Sensor Node
The integrated AES-256/SHA-2 hardware accelerator, TRNG, and secure boot on the ATSAME54P19A-AU deliver PSA Level 1 certifiable security for IoT edge nodes without an external secure element. Combined with 512 KB dual-panel Flash for signed OTA updates and 128 KB ECC-protected SRAM, the MCU can run TLS 1.3 handshakes in under 200 ms while still streaming 10 kHz sensor data over Ethernet or CAN-FD. Power consumption is roughly 30 mA at 120 MHz active, and the 128-TQFP industrial -40 C to +85 C grade survives outdoor enclosures. Compared to adding an external ATECC608B secure element, the integrated design saves approximately $0.90 BOM and reduces firmware complexity.
Direkomendasikan
Industrial Motor-Control Inverter
The 120 MHz Cortex-M4F DSP extensions on the ATSAME54P19A-AU drive field-oriented control (FOC) loops for brushless DC and PMSM motors at 20 kHz switching rates, well within industrial inverter control bandwidth. The integrated PWM timers support complementary outputs with programmable dead-time insertion, and the 16-bit sigma-delta ADC samples phase currents with 1 mA resolution. The 128-TQFP exposes enough GPIO for encoder inputs, hall sensors, and a CAN-FD link to the upstream inverter controller. Compared to microcontrollers without DSP extensions, the E54 reduces FOC execution time by approximately 40% and frees CPU cycles for grid-synchronization logic in solar pump inverters.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk ATSAME54P19A-AU — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | ATSAME54P20A-AU | ATSAME54P19A-AU-EFP | ATSAME54P19A-AUT | ATSAMD51P19A-AU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 128-TQFP (14x14) | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same |
| Core | ARM Cortex-M4F | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same |
| Maximum Frequency | 120 MHz | 120 MHz - same | 120 MHz - same | 120 MHz - same | 120 MHz - same |
| Flash | 512 KB | 1 MB | 512 KB - same | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 256 KB | 128 KB - same | 128 KB - same | 128 KB - same |
| CAN-FD | 2 controllers | 2 controllers - same | 2 controllers - same | 2 controllers - same | 0 (SAM D51 has no CAN-FD) |
| Ethernet MAC | 10/100 integrated | 10/100 integrated - same | 10/100 integrated - same | 10/100 integrated - same | 10/100 integrated - same |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (EFP qualifier) | -40 C to +85 C - same | -40 C to +85 C - same |
Diferensiator Kunci
- Dual CAN-FD controllers in Cortex-M4F class (vsATSAMD51P19A-AU)
- Integrated USB 2.0 High-Speed PHY (vsATSAME54P19A-AF)
- 1 MB dual-panel Flash upgrade path (vsATSAME54P20A-AU)
Catatan Desain
The ATSAME54P19A-AU has separate VDD (core) and VDDIO (I/O) rails. Place a 1 uF + 100 nF ceramic decoupling pair within 5 mm of every VDD/VDDIO pin pair, with vias stitching the GND return directly to the inner ground plane. The 120 MHz peak current demand is roughly 60 mA active and 20 mA in standby; bulk decoupling of 10 uF on each rail prevents 100 mV dips during Ethernet PHY bursts. Estimated: based on Microchip SAM E54 datasheet typical-current figures.
Route the 50 MHz RMII reference clock to the Ethernet PHY with 50 ohm controlled impedance and keep total length below 25 mm to avoid jitter. Place the PHY within 50 mm of the SAM E54 MAC pins. The USB 2.0 High-Speed D+/D- differential pair also requires 90 ohm differential impedance and a maximum of 8 mm trace length per the USB 2.0 specification. Estimated routing distances based on standard high-speed layout guidelines.
The dual-panel Flash architecture requires the bootloader region to be locked to a specific Flash address block; if you do not configure FCR.ICACHE and FCR.DCACHE correctly before enabling the Ethernet MAC, the DMA may stall for 8-20 us during cache misses, causing spurious CAN-FD timing overruns. Microchip's Harmony 3 config tool automates this, but bare-metal projects must manually set up the cache. Also note that the SDADC pins are shared with AIN0-AIN3 and require careful analog mux configuration.
At full-load 120 MHz with Ethernet, USB, and CAN-FD active, the ATSAME54P19A-AU dissipates approximately 0.6 W in the 128-TQFP package. With a theta-JA of roughly 50 C/W on a 4-layer FR-4 PCB, junction temperature rise is approximately 30 C above ambient. Below 70 C ambient the part remains comfortably within the +85 C industrial limit; above 70 C, add a thermal copper pour or use the -AUT variant's tape-and-reel flow for a tighter solder-joint thermal path.
Informasi Konformitas
Per Master Electronics listing the ATSAME54P19A-AU is RoHS Compliant. Industrial temperature grade only; for AEC-Q100 automotive qualification choose parts from the SAM E54x family that are explicitly automotive-qualified.