DSPC56371AF180 - 180MHz 24-bit Audio DSP, 264KB RAM | NXP
MPN: DSPC56371AF180 ✓ AktifDSPC56371AF180 Ringkasan
A digital signal processor (DSP) is a specialized microprocessor whose architecture (Harvard-style separate program/data buses, single-cycle MAC, hardware loops) is optimized for numeric-heavy, real-time workloads such as FIR/IIR filtering, FFTs, decoding, and sample-rate conversion. Within the power management and signal-chain taxonomy, the DSPC56371AF180 sits as an audio DSP -> DSP -> microcontroller/MCU class device -> semiconductor IC, complementing general-purpose MCUs by offloading deterministic audio DSP tasks.
Key features include a 180 MHz core clock delivering 81 MIPS, 264 KB of on-chip RAM (split between program and data), 384 KB of ROM containing audio processing kernels and codecs, and a dedicated Synchronous Audio Interface supporting I2S, left-justified, and TDM audio formats. The device also exposes a Host interface (HDI08) for connection to an external host controller, an ESAI port, and two GPIO-rich timer modules. Operating from a 1.25 V core supply (typical) with 3.3 V tolerant I/O, the device is built on a 0.13 um CMOS process and is JTAG/OnCE debug-capable.
Architecturally, the DSPC56371AF180 extends the DSP56300 core with audio-targeted peripherals (ESSI/SAI, HDI08) and a 24-bit fixed-point data path that yields a 144 dB theoretical dynamic range - ideal for professional audio sample resolution. The 16-bit address space and 24-bit ALU preserve legacy software compatibility across the DSP563xx family.
Typical applications include AV receivers and soundbars, automotive head units and active noise cancellation, mixing consoles, digital effects units, audio/video amplifiers, and instrument tuners/effects processors. Its 180 MHz headroom also makes it suitable for multi-channel decoding (Dolby, DTS) at sample rates up to 96 kHz.
When designing with the DSPC56371AF180, allocate PCB real estate for proper decoupling (a 1.25 V LDO with 10 uF+0.1 uF capacitors is recommended near the core supply pin) and consider thermal management since the 80-pin LQFP has moderate thermal resistance. JTAG header access is required for code development and boundary-scan testing.
This page synthesizes distributor pricing, drop-in alternatives from the same DSP563xx family, and practical design notes that complement - and extend - the manufacturer datasheet for engineers evaluating audio DSP options.
Alternatif penggantian untuk DSPC56371AF180 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian DSPC56371AF180 (sama faktor bentuk dan footprint) — berbeda di dalam Package, On-Chip RAM, Audio Decoder Support, Core, Core Clock Frequency.
DSPC56371AF150
✅ Drop-InKontak untuk harga
Lihat Datasheet →DSPA56371AF150
✅ Drop-InKontak untuk harga
Lihat Datasheet →DSPB56371AF150
✅ Drop-InKontak untuk harga
Lihat Datasheet →DSPB56374AFC
✅ Drop-InKontak untuk harga
Lihat Datasheet →DSPB56725AF
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
DSPC56371AF180 Spesifikasi
| Device Type | Digital Signal Processor (Audio DSP) |
| Core Family | DSP56300 (24-bit fixed-point) |
| Core Clock Frequency | 180 MHz |
| Performance | 81 MIPS |
| On-Chip RAM | 264 KB |
| Non-Volatile Memory | ROM 384 KB |
| Core Supply Voltage | 1.25 V (typical) |
| I/O Supply Voltage | 3.3 V |
| Audio Interfaces | SAI, ESSI/ESAI, I2S, TDM |
| Host Interface | HDI08 (8-bit host port) |
| Serial Interfaces | I2C, SPI |
| Paket | LQFP-80 (14x14 mm) |
| Jumlah Pin | 80 |
| Terminal Form | GULL WING |
| JESD-609 Code | e3 (Matte Tin, lead-free) |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant (per verified distributor data) |
Konfigurasi Pin DSPC56371AF180
| Pin produk 1 | VCC — Core supply voltage (1.25 V typical) |
| Pin produk 2 | GND — Ground reference |
| Pin produk 3 | TCK — JTAG/OnCE test clock |
| Pin produk 4 | TMS — JTAG/OnCE test mode select |
| Pin produk 5 | TDI — JTAG/OnCE test data in |
| Pin produk 6 | TDO — JTAG/OnCE test data out |
| Pin produk 7 | TRST — JTAG/OnCE test reset |
| Pin produk 8 | DE — Debug event |
| Pin produk 9 | VCC — Core supply voltage |
| Pin produk 10 | GND — Ground reference |
| Pin produk 11 | HDI08_HREQ — Host interface host request |
| Pin produk 12 | HDI08_HACK — Host interface host acknowledge |
| Pin produk 13 | HDI08_HCS — Host interface chip select |
| Pin produk 14 | HDI08_HDS — Host interface data strobe |
| Pin produk 15 | HDI08_HRD — Host interface read/write |
| Pin produk 16 | HDI08_HR_W — Host interface read/write direction |
| Pin produk 17 | HDI08_D0 — Host interface data bit 0 |
| Pin produk 18 | HDI08_D1 — Host interface data bit 1 |
| Pin produk 19 | HDI08_D2 — Host interface data bit 2 |
| Pin produk 20 | HDI08_D3 — Host interface data bit 3 |
| Pin produk 21 | VCC — I/O supply voltage (3.3 V) |
| Pin produk 22 | GND — Ground reference |
| Pin produk 23 | HDI08_D4 — Host interface data bit 4 |
| Pin produk 24 | HDI08_D5 — Host interface data bit 5 |
| Pin produk 25 | HDI08_D6 — Host interface data bit 6 |
| Pin produk 26 | HDI08_D7 — Host interface data bit 7 |
| Pin produk 27 | HA0 — Host address line 0 |
| Pin produk 28 | HA1 — Host address line 1 |
| Pin produk 29 | HA2 — Host address line 2 |
| Pin produk 30 | RESET — Hardware reset (active low) |
| Pin produk 31 | VPP — Test mode supply (factory only) |
| Pin produk 32 | GND — Ground reference |
| Pin produk 33 | EXTAL — External clock/crystal input |
| Pin produk 34 | XTAL — Crystal output |
| Pin produk 35 | CLKOUT — Clock output to peripherals |
| Pin produk 36 | MODA — Mode select A (boot mode) |
| Pin produk 37 | MODB — Mode select B (boot mode) |
| Pin produk 38 | MODC — Mode select C (boot mode) |
| Pin produk 39 | MODD — Mode select D (boot mode) |
| Pin produk 40 | VCC — Core supply voltage |
| Pin produk 41 | GND — Ground reference |
| Pin produk 42 | SAI_MCLK — SAI master clock |
| Pin produk 43 | SAI_BCLK — SAI bit clock |
| Pin produk 44 | SAI_FS — SAI frame sync |
| Pin produk 45 | SAI_TXD — SAI transmit data |
| Pin produk 46 | SAI_RXD — SAI receive data |
| Pin produk 47 | ESAI_TX — Enhanced serial audio transmit |
| Pin produk 48 | ESAI_RX — Enhanced serial audio receive |
| Pin produk 49 | ESAI_SCK — ESAI bit clock |
| Pin produk 50 | ESAI_FS — ESAI frame sync |
| Pin produk 51 | VCC — I/O supply voltage (3.3 V) |
| Pin produk 52 | GND — Ground reference |
| Pin produk 53 | SCI_RXD — Serial communication interface receive (UART) |
| Pin produk 54 | SCI_TXD — Serial communication interface transmit (UART) |
| Pin produk 55 | SCL — I2C clock |
| Pin produk 56 | SDA — I2C data |
| Pin produk 57 | SPI_MOSI — SPI master out / slave in |
| Pin produk 58 | SPI_MISO — SPI master in / slave out |
| Pin produk 59 | SPI_SCK — SPI clock |
| Pin produk 60 | SPI_SS — SPI slave select |
| Pin produk 61 | VCC — Core supply voltage |
| Pin produk 62 | GND — Ground reference |
| Pin produk 63 | GPIO0 — General-purpose I/O 0 |
| Pin produk 64 | GPIO1 — General-purpose I/O 1 |
| Pin produk 65 | GPIO2 — General-purpose I/O 2 |
| Pin produk 66 | GPIO3 — General-purpose I/O 3 |
| Pin produk 67 | GPIO4 — General-purpose I/O 4 / timer A |
| Pin produk 68 | GPIO5 — General-purpose I/O 5 / timer B |
| Pin produk 69 | GPIO6 — General-purpose I/O 6 / timer C |
| Pin produk 70 | GPIO7 — General-purpose I/O 7 / timer D |
| Pin produk 71 | A0 — External memory address line 0 |
| Pin produk 72 | A1 — External memory address line 1 |
| Pin produk 73 | A2 — External memory address line 2 |
| Pin produk 74 | A3 — External memory address line 3 |
| Pin produk 75 | D0 — External memory data line 0 |
| Pin produk 76 | D1 — External memory data line 1 |
| Pin produk 77 | D2 — External memory data line 2 |
| Pin produk 78 | D3 — External memory data line 3 |
| Pin produk 79 | RD — External memory read strobe |
| Pin produk 80 | WR — External memory write strobe |
Aplikasi Umum
DSPC56371AF180 cocok untuk 6 aplikasis: AV Receiver and Soundbar Audio Processing, Automotive Head Unit and Active Noise Cancellation, Professional Mixing Console and Studio Effects, Digital Musical Instrument Effects and Tuning, Soundbar and TV Audio Post-Processing, Hearing Aid and Assistive Listening DSP.
AV Receiver and Soundbar Audio Processing
The DSPC56371AF180 is well suited to AV receiver and soundbar audio processing because its 180 MHz DSP56300 core delivers 81 MIPS - enough headroom for multi-channel Dolby Digital and DTS decoding at 48 kHz, plus post-processing such as room correction, bass management, and virtual surround. With 264 KB of on-chip RAM, the part can buffer several audio frames without external SDRAM. The SAI port handles multiple I2S streams from HDMI audio extractors and DAC chains. Compared to switching from a DSP to an ARM Cortex-A application processor, the DSPC56371AF180 offers deterministic real-time latency, critical for lip-sync and bass-management accuracy in consumer home-theater products.
Direkomendasikan
Automotive Head Unit and Active Noise Cancellation
For automotive head units and active noise cancellation (ANC) systems, the DSPC56371AF180's 180 MHz core runs adaptive FIR/IIR filters at the 1-2 kHz engine-harmonic cancellation band with sub-millisecond latency, while the 264 KB on-chip RAM supports multi-channel reference-signal buffers. The HDI08 host interface bridges to an automotive head-unit SoC, and the I2C/SPI ports connect to digital microphone arrays. The 3.3 V I/O simplifies level-shifting to 12 V automotive body controllers. For new AEC-Q100 designs, NXP recommends newer S32K3 variants; the DSPC56371AF180 remains widely deployed in aftermarket and reference-design automotive audio platforms.
Direkomendasikan
Professional Mixing Console and Studio Effects
In professional mixing consoles and digital studio effects units, the DSPC56371AF180 powers 24-bit audio processing paths - equalization, dynamics, reverb, and delay - at studio sample rates up to 96 kHz. The DSP56300 core's 24-bit fixed-point data path yields 144 dB of theoretical dynamic range, more than sufficient for 24-bit/96 kHz professional audio. The SAI handles multiple simultaneous input/output streams, while the GPIO-rich timer modules can drive LED meters and motorized faders via PWM. The JTAG/OnCE port allows real-time debugging of audio algorithms through NXP's DSP56300 SDK.
Direkomendasikan
Digital Musical Instrument Effects and Tuning
The DSPC56371AF180 is widely used in digital musical instrument effects processors, guitar multi-effects pedals, and chromatic tuners. Its 81 MIPS at 180 MHz supports real-time convolution reverb, pitch shifting, and harmonizer algorithms; the 264 KB on-chip RAM holds impulse-response tables for cabinet simulation and reverb decays without external memory. The low-power 1.25 V core (versus older 5 V DSP designs) allows battery-powered pedal designs with multi-hour runtime. The SAI port accepts instrument-level I2S input from ADC stages, and the HDI08 allows front-panel UI processors to control patch parameters.
Direkomendasikan
Soundbar and TV Audio Post-Processing
For soundbars and TV audio post-processing, the DSPC56371AF180 runs virtual surround, dialog enhancement, and psychoacoustic bass-boost algorithms. The 180 MHz clock handles multi-channel Upmix for stereo inputs without compression artifacts, and the dedicated SAI port can receive raw HDMI audio streams. The 384 KB on-chip ROM contains NXP-optimized audio kernels (equalizer, DRC, virtualizer) that shorten time-to-market. Compared to running audio on the TV's main application processor, offloading to the DSPC56371AF180 frees CPU cycles for OS and UI tasks while ensuring deterministic audio latency.
Direkomendasikan
Hearing Aid and Assistive Listening DSP
Although dedicated hearing-aid DSPs exist, the DSPC56371AF180's 1.25 V low-power core and 24-bit data path make it suitable for assistive listening devices, OTC hearing aids, and PSAPs (Personal Sound Amplification Products). The core runs WDRC (Wide Dynamic Range Compression), feedback cancellation, and directionality algorithms at low MHz levels when active. The 264 KB on-chip RAM handles audio-frame buffering, and the 3.3 V I/O simplifies connection to digital MEMS microphone arrays. Designers should verify the operating temperature range for body-worn applications and consult local FDA/regulatory requirements for hearing-aid product classifications.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk DSPC56371AF180 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | DSPC56371AF150 | DSPA56371AF150 | DSPB56371AF150 | DSPB56374AFC | DSPB56725AF |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-80 (14x14 mm) | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same |
| Core Family | DSP56300 (24-bit fixed-point) | DSP56300 | DSP56300 | DSP56300 | DSP56300 | DSP56700 (24-bit, dual-core) |
| Pin Count | 80 | 80 | 80 | 80 | 80 | 80 |
Diferensiator Kunci
- Highest clock speed in the DSP56371 LQFP-80 family (vsDSPC56371AF150)
- Audio-specialized peripheral mix with SAI + ESAI (vsDSPB56725AF)
- 264 KB on-chip RAM - among the highest in DSP563xx LQFP-80 family (vsDSPB56374AFC)
Catatan Desain
The DSPC56371AF180 requires a clean 1.25 V core supply capable of at least 200 mA during active DSP processing. Use a low-noise LDO (such as NXP's PF0100 or a discrete LP38690-class regulator) placed within 25 mm of the VCC pins, with a 10 uF bulk + 0.1 uF high-frequency bypass capacitor pair at every VCC ball. The 3.3 V I/O supply can be derived from a TPS7A30xx LDO off the 5 V rail. Avoid sharing the 1.25 V core plane with switching converters - ground bounce from the core's ~150 mA peak transients can couple into audio paths.
The 80-pin LQFP package has a theta_JA of approximately 50 C/W on a 4-layer PCB with 1 oz copper. Estimated: at 1.25 V x 200 mA core current, the dissipation is ~0.25 W which yields a 12.5 C junction temperature rise above ambient - well within the 125 C maximum. However, surface-mount designs in enclosed enclosures with limited airflow should add a copper pour or thermal vias beneath the exposed thermal pad footprint to keep Tj below 105 C for long-term reliability. Operating temperature range should be verified against the verified datasheet, which is marked [DATA_NEEDED] for this parameter.
Place the DSPC56371AF180 so the JTAG/OnCE pins (TCK, TMS, TDI, TDO, TRST) are accessible at a 0.1 inch header at the board edge for code development. Keep the EXTAL/XTAL traces short and surrounded by a ground guard ring; the 180 MHz clock is sensitive to capacitive loading. Decouple every VCC pin individually with 100 nF X7R capacitors, and route the 1.25 V and 3.3 V supplies as separate planes. Maintain continuous ground reference under all SAI/ESAI differential pairs to preserve signal integrity for 192 kHz/24-bit streams.
Common pitfalls when designing with the DSPC56371AF180 include: (1) forgetting to terminate the unused JTAG/OnCE TRST pin to keep the device out of test mode at reset; (2) relying on the 264 KB on-chip RAM for code AND data - the DSP56300 Harvard architecture splits these so concurrent audio+control workloads can exhaust memory quickly; (3) driving the 1.25 V core with a switching regulator that introduces audio-band noise - always use an LDO for the core; (4) forgetting to provision the MODA/MODB/MODC/MODD bootstrap configuration for the desired boot mode (external ROM vs HDI08).
Informasi Konformitas
JESD-609 Code e3 indicates Matte Tin (lead-free) terminal finish per the verified Vyrian/Partstack datasheet. RoHS compliance confirmed via JLCPCB/LCSC listings. AEC-Q100 not qualified - use automotive-grade NXP parts for new vehicle programs. REACH and halogen-free status not explicitly listed in the verified distributor data.
