DSPC56371AF180 - 180MHz 24-bit Audio DSP, 264KB RAM | NXP
Référence : DSPC56371AF180 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.4 | $884,00 |
| 100 | $79.5 | $7 950,00 |
| 500 | $72 | $36 000,00 |
| 1 000 | $66 | $66 000,00 |
DSPC56371AF180 Présentation
A digital signal processor (DSP) is a specialized microprocessor whose architecture (Harvard-style separate program/data buses, single-cycle MAC, hardware loops) is optimized for numeric-heavy, real-time workloads such as FIR/IIR filtering, FFTs, decoding, and sample-rate conversion. Within the power management and signal-chain taxonomy, the DSPC56371AF180 sits as an audio DSP -> DSP -> microcontroller/MCU class device -> semiconductor IC, complementing general-purpose MCUs by offloading deterministic audio DSP tasks.
Key features include a 180 MHz core clock delivering 81 MIPS, 264 KB of on-chip RAM (split between program and data), 384 KB of ROM containing audio processing kernels and codecs, and a dedicated Synchronous Audio Interface supporting I2S, left-justified, and TDM audio formats. The device also exposes a Host interface (HDI08) for connection to an external host controller, an ESAI port, and two GPIO-rich timer modules. Operating from a 1.25 V core supply (typical) with 3.3 V tolerant I/O, the device is built on a 0.13 um CMOS process and is JTAG/OnCE debug-capable.
Architecturally, the DSPC56371AF180 extends the DSP56300 core with audio-targeted peripherals (ESSI/SAI, HDI08) and a 24-bit fixed-point data path that yields a 144 dB theoretical dynamic range - ideal for professional audio sample resolution. The 16-bit address space and 24-bit ALU preserve legacy software compatibility across the DSP563xx family.
Typical applications include AV receivers and soundbars, automotive head units and active noise cancellation, mixing consoles, digital effects units, audio/video amplifiers, and instrument tuners/effects processors. Its 180 MHz headroom also makes it suitable for multi-channel decoding (Dolby, DTS) at sample rates up to 96 kHz.
When designing with the DSPC56371AF180, allocate PCB real estate for proper decoupling (a 1.25 V LDO with 10 uF+0.1 uF capacitors is recommended near the core supply pin) and consider thermal management since the 80-pin LQFP has moderate thermal resistance. JTAG header access is required for code development and boundary-scan testing.
This page synthesizes distributor pricing, drop-in alternatives from the same DSP563xx family, and practical design notes that complement - and extend - the manufacturer datasheet for engineers evaluating audio DSP options.
Alternatives de remplacement direct pour DSPC56371AF180 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPC56371AF180 (même facteur de forme et même empreinte) — différant par Package, On-Chip RAM, Audio Decoder Support, Core, Core Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPC56371AF150
✅ Remplacement direct✓ En stock
$18.75 / unité
Voir la fiche technique →DSPA56371AF150
✅ Remplacement direct✓ En stock
$8.6 / unité
Voir la fiche technique →DSPB56371AF150
✅ Remplacement direct✓ En stock
$13.9 / unité
Voir la fiche technique →DSPB56374AFC
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →DSPB56725AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPC56371AF180 Spécifications
| Device Type | Digital Signal Processor (Audio DSP) |
| Core Family | DSP56300 (24-bit fixed-point) |
| Core Clock Frequency | 180 MHz |
| Performance | 81 MIPS |
| On-Chip RAM | 264 KB |
| Non-Volatile Memory | ROM 384 KB |
| Core Supply Voltage | 1.25 V (typical) |
| I/O Supply Voltage | 3.3 V |
| Audio Interfaces | SAI, ESSI/ESAI, I2S, TDM |
| Host Interface | HDI08 (8-bit host port) |
| Serial Interfaces | I2C, SPI |
| Boîtier | LQFP-80 (14x14 mm) |
| Nombre de broches | 80 |
| Terminal Form | GULL WING |
| JESD-609 Code | e3 (Matte Tin, lead-free) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per verified distributor data) |
Configuration des broches de DSPC56371AF180
| Broche 1 | VCC — Core supply voltage (1.25 V typical) |
| Broche 2 | GND — Ground reference |
| Broche 3 | TCK — JTAG/OnCE test clock |
| Broche 4 | TMS — JTAG/OnCE test mode select |
| Broche 5 | TDI — JTAG/OnCE test data in |
| Broche 6 | TDO — JTAG/OnCE test data out |
| Broche 7 | TRST — JTAG/OnCE test reset |
| Broche 8 | DE — Debug event |
| Broche 9 | VCC — Core supply voltage |
| Broche 10 | GND — Ground reference |
| Broche 11 | HDI08_HREQ — Host interface host request |
| Broche 12 | HDI08_HACK — Host interface host acknowledge |
| Broche 13 | HDI08_HCS — Host interface chip select |
| Broche 14 | HDI08_HDS — Host interface data strobe |
| Broche 15 | HDI08_HRD — Host interface read/write |
| Broche 16 | HDI08_HR_W — Host interface read/write direction |
| Broche 17 | HDI08_D0 — Host interface data bit 0 |
| Broche 18 | HDI08_D1 — Host interface data bit 1 |
| Broche 19 | HDI08_D2 — Host interface data bit 2 |
| Broche 20 | HDI08_D3 — Host interface data bit 3 |
| Broche 21 | VCC — I/O supply voltage (3.3 V) |
| Broche 22 | GND — Ground reference |
| Broche 23 | HDI08_D4 — Host interface data bit 4 |
| Broche 24 | HDI08_D5 — Host interface data bit 5 |
| Broche 25 | HDI08_D6 — Host interface data bit 6 |
| Broche 26 | HDI08_D7 — Host interface data bit 7 |
| Broche 27 | HA0 — Host address line 0 |
| Broche 28 | HA1 — Host address line 1 |
| Broche 29 | HA2 — Host address line 2 |
| Broche 30 | RESET — Hardware reset (active low) |
| Broche 31 | VPP — Test mode supply (factory only) |
| Broche 32 | GND — Ground reference |
| Broche 33 | EXTAL — External clock/crystal input |
| Broche 34 | XTAL — Crystal output |
| Broche 35 | CLKOUT — Clock output to peripherals |
| Broche 36 | MODA — Mode select A (boot mode) |
| Broche 37 | MODB — Mode select B (boot mode) |
| Broche 38 | MODC — Mode select C (boot mode) |
| Broche 39 | MODD — Mode select D (boot mode) |
| Broche 40 | VCC — Core supply voltage |
| Broche 41 | GND — Ground reference |
| Broche 42 | SAI_MCLK — SAI master clock |
| Broche 43 | SAI_BCLK — SAI bit clock |
| Broche 44 | SAI_FS — SAI frame sync |
| Broche 45 | SAI_TXD — SAI transmit data |
| Broche 46 | SAI_RXD — SAI receive data |
| Broche 47 | ESAI_TX — Enhanced serial audio transmit |
| Broche 48 | ESAI_RX — Enhanced serial audio receive |
| Broche 49 | ESAI_SCK — ESAI bit clock |
| Broche 50 | ESAI_FS — ESAI frame sync |
| Broche 51 | VCC — I/O supply voltage (3.3 V) |
| Broche 52 | GND — Ground reference |
| Broche 53 | SCI_RXD — Serial communication interface receive (UART) |
| Broche 54 | SCI_TXD — Serial communication interface transmit (UART) |
| Broche 55 | SCL — I2C clock |
| Broche 56 | SDA — I2C data |
| Broche 57 | SPI_MOSI — SPI master out / slave in |
| Broche 58 | SPI_MISO — SPI master in / slave out |
| Broche 59 | SPI_SCK — SPI clock |
| Broche 60 | SPI_SS — SPI slave select |
| Broche 61 | VCC — Core supply voltage |
| Broche 62 | GND — Ground reference |
| Broche 63 | GPIO0 — General-purpose I/O 0 |
| Broche 64 | GPIO1 — General-purpose I/O 1 |
| Broche 65 | GPIO2 — General-purpose I/O 2 |
| Broche 66 | GPIO3 — General-purpose I/O 3 |
| Broche 67 | GPIO4 — General-purpose I/O 4 / timer A |
| Broche 68 | GPIO5 — General-purpose I/O 5 / timer B |
| Broche 69 | GPIO6 — General-purpose I/O 6 / timer C |
| Broche 70 | GPIO7 — General-purpose I/O 7 / timer D |
| Broche 71 | A0 — External memory address line 0 |
| Broche 72 | A1 — External memory address line 1 |
| Broche 73 | A2 — External memory address line 2 |
| Broche 74 | A3 — External memory address line 3 |
| Broche 75 | D0 — External memory data line 0 |
| Broche 76 | D1 — External memory data line 1 |
| Broche 77 | D2 — External memory data line 2 |
| Broche 78 | D3 — External memory data line 3 |
| Broche 79 | RD — External memory read strobe |
| Broche 80 | WR — External memory write strobe |
Applications typiques
DSPC56371AF180 convient pour 6 applications: AV Receiver and Soundbar Audio Processing, Automotive Head Unit and Active Noise Cancellation, Professional Mixing Console and Studio Effects, Digital Musical Instrument Effects and Tuning, Soundbar and TV Audio Post-Processing, Hearing Aid and Assistive Listening DSP.
AV Receiver and Soundbar Audio Processing
The DSPC56371AF180 is well suited to AV receiver and soundbar audio processing because its 180 MHz DSP56300 core delivers 81 MIPS - enough headroom for multi-channel Dolby Digital and DTS decoding at 48 kHz, plus post-processing such as room correction, bass management, and virtual surround. With 264 KB of on-chip RAM, the part can buffer several audio frames without external SDRAM. The SAI port handles multiple I2S streams from HDMI audio extractors and DAC chains. Compared to switching from a DSP to an ARM Cortex-A application processor, the DSPC56371AF180 offers deterministic real-time latency, critical for lip-sync and bass-management accuracy in consumer home-theater products.
Recommandé
Automotive Head Unit and Active Noise Cancellation
For automotive head units and active noise cancellation (ANC) systems, the DSPC56371AF180's 180 MHz core runs adaptive FIR/IIR filters at the 1-2 kHz engine-harmonic cancellation band with sub-millisecond latency, while the 264 KB on-chip RAM supports multi-channel reference-signal buffers. The HDI08 host interface bridges to an automotive head-unit SoC, and the I2C/SPI ports connect to digital microphone arrays. The 3.3 V I/O simplifies level-shifting to 12 V automotive body controllers. For new AEC-Q100 designs, NXP recommends newer S32K3 variants; the DSPC56371AF180 remains widely deployed in aftermarket and reference-design automotive audio platforms.
Recommandé
Professional Mixing Console and Studio Effects
In professional mixing consoles and digital studio effects units, the DSPC56371AF180 powers 24-bit audio processing paths - equalization, dynamics, reverb, and delay - at studio sample rates up to 96 kHz. The DSP56300 core's 24-bit fixed-point data path yields 144 dB of theoretical dynamic range, more than sufficient for 24-bit/96 kHz professional audio. The SAI handles multiple simultaneous input/output streams, while the GPIO-rich timer modules can drive LED meters and motorized faders via PWM. The JTAG/OnCE port allows real-time debugging of audio algorithms through NXP's DSP56300 SDK.
Recommandé
Digital Musical Instrument Effects and Tuning
The DSPC56371AF180 is widely used in digital musical instrument effects processors, guitar multi-effects pedals, and chromatic tuners. Its 81 MIPS at 180 MHz supports real-time convolution reverb, pitch shifting, and harmonizer algorithms; the 264 KB on-chip RAM holds impulse-response tables for cabinet simulation and reverb decays without external memory. The low-power 1.25 V core (versus older 5 V DSP designs) allows battery-powered pedal designs with multi-hour runtime. The SAI port accepts instrument-level I2S input from ADC stages, and the HDI08 allows front-panel UI processors to control patch parameters.
Recommandé
Soundbar and TV Audio Post-Processing
For soundbars and TV audio post-processing, the DSPC56371AF180 runs virtual surround, dialog enhancement, and psychoacoustic bass-boost algorithms. The 180 MHz clock handles multi-channel Upmix for stereo inputs without compression artifacts, and the dedicated SAI port can receive raw HDMI audio streams. The 384 KB on-chip ROM contains NXP-optimized audio kernels (equalizer, DRC, virtualizer) that shorten time-to-market. Compared to running audio on the TV's main application processor, offloading to the DSPC56371AF180 frees CPU cycles for OS and UI tasks while ensuring deterministic audio latency.
Recommandé
Hearing Aid and Assistive Listening DSP
Although dedicated hearing-aid DSPs exist, the DSPC56371AF180's 1.25 V low-power core and 24-bit data path make it suitable for assistive listening devices, OTC hearing aids, and PSAPs (Personal Sound Amplification Products). The core runs WDRC (Wide Dynamic Range Compression), feedback cancellation, and directionality algorithms at low MHz levels when active. The 264 KB on-chip RAM handles audio-frame buffering, and the 3.3 V I/O simplifies connection to digital MEMS microphone arrays. Designers should verify the operating temperature range for body-worn applications and consult local FDA/regulatory requirements for hearing-aid product classifications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPC56371AF180 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPC56371AF150 | DSPA56371AF150 | DSPB56371AF150 | DSPB56374AFC | DSPB56725AF |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-80 (14x14 mm) | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same | LQFP-80 (14x14 mm) - same |
| Core Family | DSP56300 (24-bit fixed-point) | DSP56300 | DSP56300 | DSP56300 | DSP56300 | DSP56700 (24-bit, dual-core) |
| Pin Count | 80 | 80 | 80 | 80 | 80 | 80 |
Principaux différenciateurs
- Highest clock speed in the DSP56371 LQFP-80 family (vs DSPC56371AF150)
- Audio-specialized peripheral mix with SAI + ESAI (vs DSPB56725AF)
- 264 KB on-chip RAM - among the highest in DSP563xx LQFP-80 family (vs DSPB56374AFC)
Notes de conception
The DSPC56371AF180 requires a clean 1.25 V core supply capable of at least 200 mA during active DSP processing. Use a low-noise LDO (such as NXP's PF0100 or a discrete LP38690-class regulator) placed within 25 mm of the VCC pins, with a 10 uF bulk + 0.1 uF high-frequency bypass capacitor pair at every VCC ball. The 3.3 V I/O supply can be derived from a TPS7A30xx LDO off the 5 V rail. Avoid sharing the 1.25 V core plane with switching converters - ground bounce from the core's ~150 mA peak transients can couple into audio paths.
The 80-pin LQFP package has a theta_JA of approximately 50 C/W on a 4-layer PCB with 1 oz copper. Estimated: at 1.25 V x 200 mA core current, the dissipation is ~0.25 W which yields a 12.5 C junction temperature rise above ambient - well within the 125 C maximum. However, surface-mount designs in enclosed enclosures with limited airflow should add a copper pour or thermal vias beneath the exposed thermal pad footprint to keep Tj below 105 C for long-term reliability. Operating temperature range should be verified against the verified datasheet, which is marked [DATA_NEEDED] for this parameter.
Place the DSPC56371AF180 so the JTAG/OnCE pins (TCK, TMS, TDI, TDO, TRST) are accessible at a 0.1 inch header at the board edge for code development. Keep the EXTAL/XTAL traces short and surrounded by a ground guard ring; the 180 MHz clock is sensitive to capacitive loading. Decouple every VCC pin individually with 100 nF X7R capacitors, and route the 1.25 V and 3.3 V supplies as separate planes. Maintain continuous ground reference under all SAI/ESAI differential pairs to preserve signal integrity for 192 kHz/24-bit streams.
Common pitfalls when designing with the DSPC56371AF180 include: (1) forgetting to terminate the unused JTAG/OnCE TRST pin to keep the device out of test mode at reset; (2) relying on the 264 KB on-chip RAM for code AND data - the DSP56300 Harvard architecture splits these so concurrent audio+control workloads can exhaust memory quickly; (3) driving the 1.25 V core with a switching regulator that introduces audio-band noise - always use an LDO for the core; (4) forgetting to provision the MODA/MODB/MODC/MODD bootstrap configuration for the desired boot mode (external ROM vs HDI08).
Informations de conformité
JESD-609 Code e3 indicates Matte Tin (lead-free) terminal finish per the verified Vyrian/Partstack datasheet. RoHS compliance confirmed via JLCPCB/LCSC listings. AEC-Q100 not qualified - use automotive-grade NXP parts for new vehicle programs. REACH and halogen-free status not explicitly listed in the verified distributor data.
