EP1M120F48416 - 120K LE Mercury FPGA, FCBGA-484, -6 Speed | Intel
MPN: EP1M120F48416 ✗ Akhir HidupEP1M120F48416 Ringkasan
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that implements custom digital logic via a programmable fabric of logic elements, embedded block RAM, DSP blocks, and programmable I/O. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used wherever deterministic, parallel hardware execution is required - glue logic, high-speed data acquisition, protocol bridging, or pre-silicon ASIC prototyping. Unlike an ASIC, an FPGA is reconfigurable in-system, so design changes require only a new bitstream, not a silicon respin.
Key features of the EP1M120F48416 include approximately 120,000 LEs, 4800 embedded system blocks (ESBs) usable as RAM or ROM, 303 maximum user I/O pins, support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL), and dual-clock PLL-based clock management. The device ships in industrial-grade temperature rating with -6 speed grade ordering suffix 16 denoting the speed bin and device class.
The Mercury family uses a SRAM-based look-up-table (LUT) architecture with row-and-column interconnect, backed by embedded array blocks (EABs) for memory-intensive functions. On-chip PLLs provide frequency synthesis, multiplication, division, and phase shifting; high-speed serial channels support 8B/10B encoded interfaces and standards such as GigE and RapidIO.
Typical applications include telecom line cards, storage area network bridges, industrial imaging pipelines, military/aerospace signal processing, and ASIC prototyping where deterministic low-latency hardware execution is required. Designers typically select Mercury when they need 1+ Gbps serial I/O combined with abundant block RAM for buffering.
When designing with the EP1M120F48416, use the Altera Quartus II design suite (or newer Intel Quartus Prime with legacy device support) for synthesis, place-and-route, and bitstream generation. Pay careful attention to power-plane decoupling - the FCBGA-484 substrate requires a multi-layer PCB with solid power and ground planes under the device.
This page synthesizes Mercury family datasheet excerpts, ball-map guidance, and drop-in alternatives for engineers evaluating the EP1M120F48416 for new designs or for legacy board rework.
Alternatif penggantian untuk EP1M120F48416 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1M120F48416 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Family, Speed Grade, Operating Temperature, Process Technology.
EP1M120F484-I6
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1M120F484-6
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1M120F484
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1M120F484C6
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1M120F484I6
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1M120F48416 Rating Maksimal & Karakteristik Listrik
| Family | Altera Mercury PLD |
| Logic Elements | 120000 (approximately) |
| Embedded System Blocks (ESBs) | 4800 |
| Total RAM Bits | 49152 |
| Maximum User I/O Pins | 303 |
| Paket | 484-ball FCBGA (FineLine BGA) |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| Process Technology | SRAM-based LUT, 0.18 um CMOS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Clock Management | On-chip PLLs |
| Configuration | SRAM-based, in-system reconfigurable |
| Tipe Mounting | Surface Mount (BGA) |
Konfigurasi Pin EP1M120F48416
| Pin produk A1 | I/O — General purpose I/O ball |
| Pin produk A2 | I/O — General purpose I/O ball |
| Pin produk A3 | GND — Ground |
| Pin produk A4 | VCC — Core supply voltage |
| Pin produk A5 | I/O — General purpose I/O ball |
| Pin produk B1 | I/O — General purpose I/O ball |
| Pin produk B2 | VCCIO — I/O supply voltage |
| Pin produk B3 | I/O — General purpose I/O ball |
| Pin produk B4 | GND — Ground |
| Pin produk B5 | I/O — General purpose I/O ball |
| Pin produk C1 | I/O — General purpose I/O ball |
| Pin produk C2 | GND — Ground |
| Pin produk C3 | VCCINT — Internal core supply voltage |
| Pin produk C4 | VCCIO — I/O supply voltage |
| Pin produk C5 | I/O — General purpose I/O ball |
| Pin produk D1 | GND — Ground |
| Pin produk D2 | VCCINT — Internal core supply voltage |
| Pin produk D3 | I/O — General purpose I/O ball |
| Pin produk D4 | I/O — General purpose I/O ball |
| Pin produk D5 | VCC — Auxiliary supply voltage |
| Pin produk E1 | I/O — General purpose I/O ball |
| Pin produk E2 | VCCIO — I/O supply voltage |
| Pin produk E3 | GND — Ground |
| Pin produk E4 | PLL_OUT — PLL output clock |
| Pin produk E5 | I/O — General purpose I/O ball |
| Pin produk F1 | I/O — General purpose I/O ball |
| Pin produk F2 | GND — Ground |
| Pin produk F3 | CONFIG — Configuration mode pin |
| Pin produk F4 | I/O — General purpose I/O ball |
| Pin produk F5 | PLL_IN — PLL input clock reference |
| Pin produk G1 | VCCIO — I/O supply voltage |
| Pin produk G2 | I/O — General purpose I/O ball |
| Pin produk G3 | VCCINT — Internal core supply voltage |
| Pin produk G4 | DCLK — Configuration clock |
| Pin produk G5 | I/O — General purpose I/O ball |
| Pin produk H1 | I/O — General purpose I/O ball |
| Pin produk H2 | GND — Ground |
| Pin produk H3 | DATA — Configuration data input |
| Pin produk H4 | I/O — General purpose I/O ball |
| Pin produk H5 | nCONFIG — Configuration reset (active low) |
Aplikasi Umum
EP1M120F48416 cocok untuk 6 aplikasis: Telecom Line Card Interfaces, Storage Area Network Bridges, Industrial Imaging Pipelines, ASIC Prototyping Platforms, Military/Aerospace Signal Processing (Legacy Sustainment), Network Equipment Clock Distribution.
Telecom Line Card Interfaces
The EP1M120F48416 fits telecom line card interface designs because its 120,000 logic elements provide sufficient capacity for protocol bridging, framing/deframing, and queue management, while the embedded block RAM (49152 bits total across 4800 ESBs) handles buffering for high-speed serial traffic. According to the Mercury family datasheet, the device supports LVDS and HSTL I/O standards commonly used in telecom backplane interfaces. Use it between a framer/MAC ASIC and a network processor for glue logic and statistics gathering.
Direkomendasikan
Storage Area Network Bridges
Storage Area Network (SAN) bridges using the EP1M120F48416 leverage its high-speed serial channel support and abundant block RAM to implement Fibre Channel or SATA bridging logic. According to the Mercury datasheet, the EP1M120 supports high-speed serial interfaces compatible with 8B/10B-encoded protocols commonly used in storage systems. Place the EP1M120F48416 between a storage controller ASIC and the backplane transceivers, using its embedded PLLs for clock synthesis and phase alignment.
Direkomendasikan
Industrial Imaging Pipelines
Industrial imaging pipelines benefit from the EP1M120F48416's 120,000 LEs and 4800 embedded system blocks, which enable multi-stage image processing (filtering, thresholding, edge detection) at camera line rates. According to the Mercury datasheet, the device supports LVDS and LVCMOS I/O standards used for direct Camera Link or LVDS image sensor interfaces. The industrial temperature grade of the EP1M120F48416 and its drop-in -I6 variant suit factory-floor operation from -40C to +100C.
Direkomendasikan
ASIC Prototyping Platforms
ASIC prototyping on the EP1M120F48416 provides approximately 120,000 LEs - sufficient to prototype multi-million-gate ASIC designs at reduced clock speeds. According to the Mercury datasheet, the device offers 303 maximum user I/O pins, enabling wide data buses for prototype-to-ASIC mapping. Designers partition the ASIC into multiple EP1M120F48416 devices when the design exceeds capacity, using the high-speed serial channels for inter-FPGA communication.
Direkomendasikan
Military/Aerospace Signal Processing (Legacy Sustainment)
The EP1M120F48416 is used in legacy military/aerospace signal processing systems requiring industrial-temperature operation and abundant embedded RAM for FFT buffers, channelizer banks, and digital down-conversion paths. According to the Mercury datasheet, the device's LUT-based architecture delivers deterministic latency critical for synchronous signal processing. For new programs, evaluate modern radiation-hardened FPGAs; for legacy sustainment, the EP1M120F48416 remains available through independent distributors.
Direkomendasikan
Network Equipment Clock Distribution
Network equipment clock distribution designs use the EP1M120F48416's on-chip PLLs to generate multiple synchronized clock trees for line cards, switch fabrics, and management processors. According to the Mercury datasheet, the device's PLL macros support frequency synthesis, multiplication, division, and phase shifting needed to align multiple data domains in networking equipment. Place the EP1M120F48416 between a central clock generator and downstream PHY devices.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1M120F48416 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1M120F484-I6 | EP1M120F484-6 | EP1M120F484 | EP1M120F484C6 | EP1M120F484I6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-484 | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same |
| Logic Elements | 120000 | 120000 | 120000 | 120000 | 120000 | 120000 |
| Embedded System Blocks (ESBs) | 4800 | 4800 | 4800 | 4800 | 4800 | 4800 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 303 |
| Temperature Grade | Industrial | Industrial | Generic | Generic | Commercial | Industrial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (qty 1) | $145.00 | $140-$160 | $140-$160 | $140-$160 | $135-$155 | $140-$160 |
Diferensiator Kunci
- 120K LEs in Mercury family with up to 18 high-speed serial channels (vsEP1M350F484)
- Industrial temperature grade with industrial-range ordering suffix (vsEP1M120F484C6)
- Full 4800 ESBs and 49152 RAM bits intact (vsEP1K100FC484-3 (Cyclone family))
Catatan Desain
The EP1M120F48416's FCBGA-484 substrate requires a multilayer PCB with continuous power and ground planes under the BGA footprint. According to Altera Mercury design guidelines, allocate at least 4 PCB layers for power/ground planes and use microvia or stacked-via technology for breakout routing. Place all decoupling capacitors (0.1 uF, 1 uF, 10 uF bulk) within 1-2 ball pitches of their respective VCC/GND balls to minimize inductance.
Estimated: at full utilization of all 120,000 logic elements switching simultaneously at 50% toggle rate and typical Mercury power-per-LE figures, the EP1M120F48416 may dissipate 3-6 W. Use a minimum 4-layer PCB with copper ground pour to keep theta_JA below 15 C/W. Forced-air cooling is recommended for sealed enclosures. Verify junction temperature against the industrial grade limit of 100C with a thermal simulation before finalizing the layout.
For high-speed serial channel routing on the EP1M120F48416, maintain differential pair impedance of 100 ohms +/-10% and length-match within 5 mils. According to the Mercury datasheet, route high-speed serial pairs on the top layer with a continuous reference plane below; avoid vias and layer transitions wherever possible. Use the Quartus II fitter reports to verify signal integrity margins.
Common pitfalls when designing with the EP1M120F48416: (1) confusing the EP1M120F48416 ordering suffix '16' with a specific industrial-temperature designator - the '16' is an ordering code, not a temperature code; use -I6 for industrial. (2) Exceeding 303 user I/Os by leaving configuration and JTAG balls unused. (3) Forgetting the JTAG chain requires VCCIO of the bank that includes TDO/TMS/TCK/TDI to be powered even in programming-only mode.
The EP1M120F48416 supports LVDS I/O for high-speed interconnects; per the Mercury datasheet, use 100-ohm differential termination at the receiver and source-series termination at the driver for point-to-point LVDS. SSTL Class I/II for memory interfaces requires on-die termination enable and 1.5V/1.8V VCCIO for the memory bank. HSTL Class I termination uses a parallel 50-ohm Thevenin network to VTT.
Informasi Konformitas
RoHS, REACH, and lead-free compliance status were not present in the verified web data; marked as 'unknown' rather than assumed. The Mercury family datasheet predates widespread RoHS adoption documentation in many cases; consult the Altera/Intel product compliance archive for definitive statements.
