EP1M120F48416 - 120K LE Mercury FPGA, FCBGA-484, -6 Speed | Intel
MPN： EP1M120F48416 ✗ 停產EP1M120F48416 概覽
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that implements custom digital logic via a programmable fabric of logic elements, embedded block RAM, DSP blocks, and programmable I/O. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used wherever deterministic, parallel hardware execution is required - glue logic, high-speed data acquisition, protocol bridging, or pre-silicon ASIC prototyping. Unlike an ASIC, an FPGA is reconfigurable in-system, so design changes require only a new bitstream, not a silicon respin.
Key features of the EP1M120F48416 include approximately 120,000 LEs, 4800 embedded system blocks (ESBs) usable as RAM or ROM, 303 maximum user I/O pins, support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL), and dual-clock PLL-based clock management. The device ships in industrial-grade temperature rating with -6 speed grade ordering suffix 16 denoting the speed bin and device class.
The Mercury family uses a SRAM-based look-up-table (LUT) architecture with row-and-column interconnect, backed by embedded array blocks (EABs) for memory-intensive functions. On-chip PLLs provide frequency synthesis, multiplication, division, and phase shifting; high-speed serial channels support 8B/10B encoded interfaces and standards such as GigE and RapidIO.
Typical applications include telecom line cards, storage area network bridges, industrial imaging pipelines, military/aerospace signal processing, and ASIC prototyping where deterministic low-latency hardware execution is required. Designers typically select Mercury when they need 1+ Gbps serial I/O combined with abundant block RAM for buffering.
When designing with the EP1M120F48416, use the Altera Quartus II design suite (or newer Intel Quartus Prime with legacy device support) for synthesis, place-and-route, and bitstream generation. Pay careful attention to power-plane decoupling - the FCBGA-484 substrate requires a multi-layer PCB with solid power and ground planes under the device.
This page synthesizes Mercury family datasheet excerpts, ball-map guidance, and drop-in alternatives for engineers evaluating the EP1M120F48416 for new designs or for legacy board rework.
直接替換替代品，適用於 EP1M120F48416 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M120F48416 （相同外形與佔位） — 差異在於 Package, Family, Speed Grade, Operating Temperature, Process Technology.
EP1M120F484-I6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484-6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484I6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F48416 最大額定值與電氣特性
| Family | Altera Mercury PLD |
| Logic Elements | 120000 (approximately) |
| Embedded System Blocks (ESBs) | 4800 |
| Total RAM Bits | 49152 |
| Maximum User I/O Pins | 303 |
| 封裝 | 484-ball FCBGA (FineLine BGA) |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| Process Technology | SRAM-based LUT, 0.18 um CMOS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Clock Management | On-chip PLLs |
| Configuration | SRAM-based, in-system reconfigurable |
| 安裝類型 | Surface Mount (BGA) |
EP1M120F48416 腳位配置
| 腳位 A1 | I/O — General purpose I/O ball |
| 腳位 A2 | I/O — General purpose I/O ball |
| 腳位 A3 | GND — Ground |
| 腳位 A4 | VCC — Core supply voltage |
| 腳位 A5 | I/O — General purpose I/O ball |
| 腳位 B1 | I/O — General purpose I/O ball |
| 腳位 B2 | VCCIO — I/O supply voltage |
| 腳位 B3 | I/O — General purpose I/O ball |
| 腳位 B4 | GND — Ground |
| 腳位 B5 | I/O — General purpose I/O ball |
| 腳位 C1 | I/O — General purpose I/O ball |
| 腳位 C2 | GND — Ground |
| 腳位 C3 | VCCINT — Internal core supply voltage |
| 腳位 C4 | VCCIO — I/O supply voltage |
| 腳位 C5 | I/O — General purpose I/O ball |
| 腳位 D1 | GND — Ground |
| 腳位 D2 | VCCINT — Internal core supply voltage |
| 腳位 D3 | I/O — General purpose I/O ball |
| 腳位 D4 | I/O — General purpose I/O ball |
| 腳位 D5 | VCC — Auxiliary supply voltage |
| 腳位 E1 | I/O — General purpose I/O ball |
| 腳位 E2 | VCCIO — I/O supply voltage |
| 腳位 E3 | GND — Ground |
| 腳位 E4 | PLL_OUT — PLL output clock |
| 腳位 E5 | I/O — General purpose I/O ball |
| 腳位 F1 | I/O — General purpose I/O ball |
| 腳位 F2 | GND — Ground |
| 腳位 F3 | CONFIG — Configuration mode pin |
| 腳位 F4 | I/O — General purpose I/O ball |
| 腳位 F5 | PLL_IN — PLL input clock reference |
| 腳位 G1 | VCCIO — I/O supply voltage |
| 腳位 G2 | I/O — General purpose I/O ball |
| 腳位 G3 | VCCINT — Internal core supply voltage |
| 腳位 G4 | DCLK — Configuration clock |
| 腳位 G5 | I/O — General purpose I/O ball |
| 腳位 H1 | I/O — General purpose I/O ball |
| 腳位 H2 | GND — Ground |
| 腳位 H3 | DATA — Configuration data input |
| 腳位 H4 | I/O — General purpose I/O ball |
| 腳位 H5 | nCONFIG — Configuration reset (active low) |
典型應用
EP1M120F48416 適用於 6 應用s: Telecom Line Card Interfaces, Storage Area Network Bridges, Industrial Imaging Pipelines, ASIC Prototyping Platforms, Military/Aerospace Signal Processing (Legacy Sustainment), Network Equipment Clock Distribution.
Telecom Line Card Interfaces
The EP1M120F48416 fits telecom line card interface designs because its 120,000 logic elements provide sufficient capacity for protocol bridging, framing/deframing, and queue management, while the embedded block RAM (49152 bits total across 4800 ESBs) handles buffering for high-speed serial traffic. According to the Mercury family datasheet, the device supports LVDS and HSTL I/O standards commonly used in telecom backplane interfaces. Use it between a framer/MAC ASIC and a network processor for glue logic and statistics gathering.
推薦
Storage Area Network Bridges
Storage Area Network (SAN) bridges using the EP1M120F48416 leverage its high-speed serial channel support and abundant block RAM to implement Fibre Channel or SATA bridging logic. According to the Mercury datasheet, the EP1M120 supports high-speed serial interfaces compatible with 8B/10B-encoded protocols commonly used in storage systems. Place the EP1M120F48416 between a storage controller ASIC and the backplane transceivers, using its embedded PLLs for clock synthesis and phase alignment.
推薦
Industrial Imaging Pipelines
Industrial imaging pipelines benefit from the EP1M120F48416's 120,000 LEs and 4800 embedded system blocks, which enable multi-stage image processing (filtering, thresholding, edge detection) at camera line rates. According to the Mercury datasheet, the device supports LVDS and LVCMOS I/O standards used for direct Camera Link or LVDS image sensor interfaces. The industrial temperature grade of the EP1M120F48416 and its drop-in -I6 variant suit factory-floor operation from -40C to +100C.
推薦
ASIC Prototyping Platforms
ASIC prototyping on the EP1M120F48416 provides approximately 120,000 LEs - sufficient to prototype multi-million-gate ASIC designs at reduced clock speeds. According to the Mercury datasheet, the device offers 303 maximum user I/O pins, enabling wide data buses for prototype-to-ASIC mapping. Designers partition the ASIC into multiple EP1M120F48416 devices when the design exceeds capacity, using the high-speed serial channels for inter-FPGA communication.
推薦
Military/Aerospace Signal Processing (Legacy Sustainment)
The EP1M120F48416 is used in legacy military/aerospace signal processing systems requiring industrial-temperature operation and abundant embedded RAM for FFT buffers, channelizer banks, and digital down-conversion paths. According to the Mercury datasheet, the device's LUT-based architecture delivers deterministic latency critical for synchronous signal processing. For new programs, evaluate modern radiation-hardened FPGAs; for legacy sustainment, the EP1M120F48416 remains available through independent distributors.
推薦
Network Equipment Clock Distribution
Network equipment clock distribution designs use the EP1M120F48416's on-chip PLLs to generate multiple synchronized clock trees for line cards, switch fabrics, and management processors. According to the Mercury datasheet, the device's PLL macros support frequency synthesis, multiplication, division, and phase shifting needed to align multiple data domains in networking equipment. Place the EP1M120F48416 between a central clock generator and downstream PHY devices.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M120F48416 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M120F484-I6 | EP1M120F484-6 | EP1M120F484 | EP1M120F484C6 | EP1M120F484I6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-484 | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same |
| Logic Elements | 120000 | 120000 | 120000 | 120000 | 120000 | 120000 |
| Embedded System Blocks (ESBs) | 4800 | 4800 | 4800 | 4800 | 4800 | 4800 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 303 |
| Temperature Grade | Industrial | Industrial | Generic | Generic | Commercial | Industrial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (qty 1) | $145.00 | $140-$160 | $140-$160 | $140-$160 | $135-$155 | $140-$160 |
主要差異化特點
- 120K LEs in Mercury family with up to 18 high-speed serial channels (對比EP1M350F484)
- Industrial temperature grade with industrial-range ordering suffix (對比EP1M120F484C6)
- Full 4800 ESBs and 49152 RAM bits intact (對比EP1K100FC484-3 (Cyclone family))
設計說明
The EP1M120F48416's FCBGA-484 substrate requires a multilayer PCB with continuous power and ground planes under the BGA footprint. According to Altera Mercury design guidelines, allocate at least 4 PCB layers for power/ground planes and use microvia or stacked-via technology for breakout routing. Place all decoupling capacitors (0.1 uF, 1 uF, 10 uF bulk) within 1-2 ball pitches of their respective VCC/GND balls to minimize inductance.
Estimated: at full utilization of all 120,000 logic elements switching simultaneously at 50% toggle rate and typical Mercury power-per-LE figures, the EP1M120F48416 may dissipate 3-6 W. Use a minimum 4-layer PCB with copper ground pour to keep theta_JA below 15 C/W. Forced-air cooling is recommended for sealed enclosures. Verify junction temperature against the industrial grade limit of 100C with a thermal simulation before finalizing the layout.
For high-speed serial channel routing on the EP1M120F48416, maintain differential pair impedance of 100 ohms +/-10% and length-match within 5 mils. According to the Mercury datasheet, route high-speed serial pairs on the top layer with a continuous reference plane below; avoid vias and layer transitions wherever possible. Use the Quartus II fitter reports to verify signal integrity margins.
Common pitfalls when designing with the EP1M120F48416: (1) confusing the EP1M120F48416 ordering suffix '16' with a specific industrial-temperature designator - the '16' is an ordering code, not a temperature code; use -I6 for industrial. (2) Exceeding 303 user I/Os by leaving configuration and JTAG balls unused. (3) Forgetting the JTAG chain requires VCCIO of the bank that includes TDO/TMS/TCK/TDI to be powered even in programming-only mode.
The EP1M120F48416 supports LVDS I/O for high-speed interconnects; per the Mercury datasheet, use 100-ohm differential termination at the receiver and source-series termination at the driver for point-to-point LVDS. SSTL Class I/II for memory interfaces requires on-die termination enable and 1.5V/1.8V VCCIO for the memory bank. HSTL Class I termination uses a parallel 50-ohm Thevenin network to VTT.
合規資訊
RoHS, REACH, and lead-free compliance status were not present in the verified web data; marked as 'unknown' rather than assumed. The Mercury family datasheet predates widespread RoHS adoption documentation in many cases; consult the Altera/Intel product compliance archive for definitive statements.
