Altera

EP20K200RC208-3N - APEX 20K FPGA 200K Gates 8320 Cells 167MHz | Altera

MPN: EP20K200RC208-3N ✗ Akhir Hidup

2.5 V Vdss 208-RQFP / BFQFP with exposed pad Package 167 MHz Speed 106,496 bits Memory

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EP20K200RC208-3N Ringkasan

The Altera (now Intel) EP20K200RC208-3N is a member of the APEX-20K family of programmable logic devices, integrating 200,000 system gates, 8,320 logic elements (cells), and 106,496 bits of embedded memory into a single MultiCore architecture die. Housed in a 208-pin RQFP / BFQFP package with exposed thermal pad, this device combines look-up table (LUT) logic, product-term logic, and embedded memory blocks on one silicon substrate, embodying the system-on-a-programmable-chip (SOPC) concept that defined late-1990s high-density PLD design.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device whose interconnect and logic resources are configured by the customer after manufacture using a hardware description language (HDL) and a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy - above simple PLDs, CPLDs, and structured ASICs - and are widely used to implement glue logic, custom processor peripherals, DSP pipelines, and prototype ASICs. The APEX-20K family in particular pioneered the integration of dedicated memory blocks (ESBs) with general-purpose LUT logic, allowing system-on-chip functionality before true SoC ASICs were widely available.

Key features include 144 user I/O pins, 4 dedicated inputs, a maximum operating frequency of 167 MHz, CMOS process technology at 0.22 micrometer geometry, and a 2.5V core supply with LVDS-compatible I/O capability. The 'N' suffix indicates an industrial temperature grade of 0C to +85C, while the '3' speed grade places this part in a moderate performance bin suitable for designs that do not require the highest possible internal clock rate.

From an architectural standpoint, the EP20K200RC208-3N uses Altera's MultiCore architecture, which interleaves logic array blocks (LABs), embedded system blocks (ESBs) for memory, and FastTrack interconnect. This design lets the device serve both register-intensive datapath logic and high-density memory functions such as FIFOs and dual-port RAMs without external SRAM. The exposed thermal pad on the BFQFP package aids heat extraction for sustained high-utilization designs.

Typical applications include telecommunications line cards, industrial control and instrumentation, glue logic for DSP boards, custom peripheral controllers, and ASIC prototyping. Designers select this device when they need high gate density plus on-chip memory in a proven, mature silicon process with abundant Quartus II design-tool support.

When designing with the EP20K200RC208-3N, ensure the 208-pin BFQFP land pattern includes the exposed thermal pad soldered to a copper pour to meet thermal and electrical grounding requirements. Quartus II (legacy MAX+PLUS II for older designs) is the supported development environment; configuration bitstreams are loaded via the ByteBlaster or compatible JTAG programmer.

This page synthesizes distributor stock levels, verified drop-in alternatives, and practical design notes that complement the official APEX-20K datasheet family specification.

Alternatif penggantian untuk EP20K200RC208-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP20K200RC208-3N (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Family, Operating Temperature, Package, Speed Grade.

EP20K200RC208-1

Intel

Process Technology: 0.22 µm CMOS

Operating Temperature: Industrial range

Package: 208-BFQFP (RQFP) with Exposed Pad, 28×28 mm