Intel

EP20K200RC208-3 - APEX 20K 200K Gates FPGA, 208-RQFP | Intel

MPN: EP20K200RC208-3 ✗ Akhir Hidup

1.8 V Vdss 208-RQFP Exposed Pad (BFQFP) Package 167 MHz Speed 106,496 Memory

Ajukan Diskon

MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

EP20K200RC208-3 Ringkasan

The Intel (formerly Altera) EP20K200RC208-3 is a member of the APEX 20K family of Field Programmable Gate Arrays (FPGAs) delivering 200,000 system gates in a 208-pin RQFP (Exposed Pad) package. The device integrates 8,320 logic elements and 106,496 bits of embedded memory across the industry's first MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded memory blocks on a single die. Fabricated on a 0.22 µm CMOS process, the APEX 20K family supports 1.8 V core operation with LVDS-compatible I/O and a system-level operating frequency up to 167 MHz.

What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device that allows hardware logic to be programmed after manufacture. The APEX 20K family pioneered system-on-a-programmable-chip (SOPC) integration, embedding up to 1.6 Mbits of RAM directly into the fabric alongside logic and product-term resources, eliminating external SRAM in many designs. This architecture places the EP20K200RC208-3 in a hierarchy of: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit.

The MultiCore architecture combines three specialized structures: LUT-based logic for register-intensive functions, embedded array blocks (EABs) implementing memory or product-term logic, and a high-bandwidth interconnect network. The EP20K200RC208-3 supports up to 144 user I/O pins via LVDS signaling, with four phase-locked loops (PLLs) for clock management. The device supports hot-socketing, in-system programmability via IEEE 1149.1 JTAG, and operates across the industrial temperature range from -40°C to +85°C.

Typical applications include high-speed telecommunications interfaces, PCI bridge logic, DSP co-processing, and custom parallel bus controllers where the embedded memory eliminates the need for external SRAM. The 208-RQFP package provides a thermally enhanced footprint with an exposed pad for thermal dissipation, and the -3 speed grade places this part in the mid-range of APEX 20K performance options.

When designing with the EP20K200RC208-3, engineers should verify that the Quartus development toolchain (versions prior to 9.1) supports the device and that PCB thermal vias are placed under the exposed pad to maintain junction temperature under full I/O loading. Note that the APEX 20K family has reached end-of-life; consider Cyclone II or Cyclone III for new designs, and use this part only for maintenance of existing systems.

This page synthesizes distributor availability, parametric alternatives, and design considerations specific to the APEX 20K family that are not aggregated on any single manufacturer or distributor page, helping engineers evaluate lifecycle risk and replacement strategies.

Alternatif penggantian untuk EP20K200RC208-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP20K200RC208-3 (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Family, Operating Temperature, Package, Speed Grade.

EP20K200RC208-1

Intel

Family: APEX-20K

Operating Temperature: Industrial range

Package: 208-BFQFP (RQFP) with Exposed Pad, 28×28 mm