EP2A40B724I-7 - APEX II 40K LE FPGA 724-Pin BGA | Altera
MPN: EP2A40B724I-7 ✗ Akhir HidupEP2A40B724I-7 Ringkasan
An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, and I/O pads that can be reconfigured after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are used for parallel processing, high-speed glue logic, and rapid prototyping of custom ASIC functionality. APEX II devices extend this concept with multi-core architecture (Lite, Fast, and I/O structures) suitable for high-bandwidth DSP and communications workloads.
Key features of the EP2A40B724I-7 include 4 PLLs, embedded memory blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V LVTTL/LVCMOS), and 8 clock pins per device plus 16 dedicated clock inputs. The BGA-724 package provides a 33x33 mm footprint with 1.27 mm ball pitch, enabling high pin density for high-I/O applications. Configuration is supported via Altera enhanced configuration devices, supporting fast serial or parallel modes with decompression capability.
Typical applications include telecommunications line cards, networking switches/routers, high-speed DSP pipelines, ASIC prototyping, and bus interface bridging. The high-density logic and memory make the EP2A40B724I-7 especially suitable for protocol bridging between PCI, DDR, and RapidIO domains. When designing with this device, verify that your PCB layout supports BGA fanout with microvia or via-in-pad technology, as 1.27 mm pitch BGA requires controlled-impedance routing and careful power-plane stitching to maintain signal integrity on hundreds of simultaneous switching outputs.
Alternatif penggantian untuk EP2A40B724I-7 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP2A40B724I-7 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Speed Grade, I/O Standards Supported.
EP2A40B724I-8
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724C7
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724C8
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724C9
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724CP
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724C7N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP2A40B724I-7 Rating Maksimal & Karakteristik Listrik
| Family | APEX II |
| Logic Elements | 40,000 LE |
| Embedded Memory | 1.5 Mbit (ESB) |
| Number of PLLs | 4 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -7 |
| Paket | BGA-724 (724-ball FineLine BGA) |
| Package Footprint | 33 x 33 mm |
| Ball Pitch | 1.27 mm |
| Tipe Mounting | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 C |
| Configuration Mode | Enhanced configuration device / fast serial |
| I/O Standard Support | LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V |
EP2A40B724I-7 33 x 33 mm Diamant Konfigurasi Panduan
Konfigurasi pin untuk EP2A40B724I-7 (33 x 33 mm pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk EP2A40B724I-7.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
EP2A40B724I-7 cocok untuk 6 aplikasis: Telecommunications Line Cards, Networking Switches and Routers, DSP and Signal Processing Pipelines, ASIC Prototyping and Emulation, High-Speed Bus Interface Bridging, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2A40B724I-7 fits telecommunications line cards because its 40,000 logic elements and 1.5 Mbit embedded memory provide enough capacity for protocol processing and packet buffering, while four on-chip PLLs synthesize the multiple clock domains required by telecom backplanes (typically 19.44 MHz, 38.88 MHz, 77.76 MHz). Industrial temperature grade -40C to +100C supports outdoor cabinet and central-office deployments, and the 724-ball BGA offers ample user I/O for high-density serial interfaces like LVDS and HSTL. Compared with smaller FPGAs, the device reduces BOM cost by integrating glue logic that would otherwise require separate CPLDs or bus bridges.
Direkomendasikan
Networking Switches and Routers
In switching/routing platforms the EP2A40B724I-7 serves as the system controller FPGA, where its high user-I/O count and embedded SRAM are well-suited for table lookup, queue management, and cell/packet reassembly logic. The four PLLs generate the gigabit-rate clocks required by GMII/RGMII/SGMII interfaces, while embedded memory blocks handle small CAM/TCAM emulations. The 724-ball BGA is necessary to support simultaneous fast-Ethernet, gigabit, and 10G PHY connections plus management bus interfaces. Industrial temperature grade ensures reliability in thermally uncontrolled edge deployments.
Direkomendasikan
DSP and Signal Processing Pipelines
The EP2A40B724I-7 supports high-throughput DSP workloads including FIR filters, FFT engines, and forward-error-correction blocks, leveraging its 1.5 Mbit embedded memory for coefficient storage and intermediate sample buffering. Speed grade -7 combined with dedicated multiplier/carry chains in the APEX II architecture delivers up to 4-8 GMACs sustained throughput for baseband and audio processing. The PLLs generate the multiple clock phases needed for parallel sample processing, while LVDS/HSTL I/O support external high-speed ADC/DAC interfaces. This is a natural fit for software-defined radio, base-station pre-processing, and medical imaging front ends.
Direkomendasikan
ASIC Prototyping and Emulation
For ASIC prototyping the EP2A40B724I-7 provides enough logic density, memory, and I/O to map medium-complexity ASIC RTL with reasonable timing fidelity. The 724-ball BGA exposes the full I/O count needed for chip-to-chip ASIC emulation boards, and the industrial temperature range allows use in lab and environmental chambers during bring-up. Embedded memory blocks map ASIC SRAMs 1:1, while PLLs mimic the internal clock structure of the target ASIC. Quartus II synthesis maps all APEX II features, making this part a long-standing emulator platform for ASIC design teams.
Direkomendasikan
High-Speed Bus Interface Bridging
The EP2A40B724I-7 is well-suited for bridging between legacy parallel buses (PCI, VME, custom ASIC interfaces) and modern serial protocols. The 724-ball BGA delivers the many dedicated I/O pins required for parallel bus emulation, while embedded PLLs generate the precise clock frequencies needed for synchronous bus capture. Industrial temperature grade allows deployment in factory automation and defense systems where the part bridges FPGA co-processors to legacy I/O cards. The 40K LE capacity easily absorbs protocol state machines and FIFO logic without external memory.
Direkomendasikan
Test and Measurement Instrumentation
Test and measurement platforms benefit from the EP2A40B724I-7's 1.5 Mbit embedded memory (for deep sample buffers), four PLLs (for arbitrary waveform clock generation), and 724-ball BGA (for dense analog front-end interfaces). Industrial temperature grade allows use in portable test equipment deployed in field environments. Compared with smaller FPGAs, the device can perform real-time FFT, digital down-conversion, and pattern generation in a single chip without external DSP co-processors. The APEX II ESB blocks store calibration coefficients and waveform LUTs on-chip.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP2A40B724I-7 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP2A40B724I-8 | EP2A40B724C7 | EP2A40B724C8 | EP2A40B724C9 | EP2A40B724CP | EP2A40B724C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-724 (1.27mm pitch, 33x33mm) | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Logic Elements | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE |
| Embedded Memory | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | -7 | -8 (faster) | -7 | -8 (faster) | -9 (fastest) | varies | -7 |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
Diferensiator Kunci
- Industrial temperature grade (-40C to +100C) (vsEP2A40B724C7)
- Mature APEX II architecture with extensive Quartus II support (vsModern Cyclone V / Stratix 10 devices)
- 724-ball BGA with full APEX II user I/O count (vsEP2A40B652 series (652-ball BGA))
Catatan Desain
The BGA-724 package at 1.27 mm ball pitch requires microvia or via-in-pad PCB technology to fan out the dense ball grid. Use a minimum of 6 PCB layers with one or two solid power planes and continuous ground planes stitched with 0.2 mm ground vias on a 1.0 mm pitch around the BGA perimeter. Keep all signal traces on outer layers away from the BGA field, and route differential pairs with matched 100 ohm differential impedance to maintain signal integrity on hundreds of simultaneously switching LVDS/LVCMOS outputs.
APEX II FPGAs require multiple supply rails: VCCINT core (1.5V or 1.8V depending on speed grade), VCCIO bank I/O (1.5V/1.8V/2.5V/3.3V selectable per bank), VCC_PLL for the four PLLs, and VCCPD programming supply. Decouple each PLL ball with 0.1 uF and 10 uF ceramic caps within 5 mm of the package. Estimate (per Quartus PowerPlay): a typical 40K-LE design at 200 MHz toggling 50% of logic consumes 2-4 W; derate the PCB for 6 W worst-case and use a thermal pad or via-array under the package exposed pad to keep junction below 100C.
Common pitfalls with APEX II BGA-724 designs include: (1) leaving clock PLL filter pins (PLLx_FB, PLLx_OUT) unconnected - each PLL must have its own LC filter network per datasheet Table 3; (2) failing to enable on-chip termination (OCT) for SSTL/LVDS outputs which causes overshoot on 50-ohm traces; (3) using generic JTAG commands instead of BSDL files for boundary-scan, leading to incorrect pin mapping; (4) sharing configuration pins with user I/O without disabling the nCONFIG pull-up during operation. Always validate signal integrity with IBIS models before committing to layout.
Informasi Konformitas
RoHS and lead-free status for the EP2A40B724I-7 are not stated in the verified data. The package uses 220C peak reflow temperature, suggesting Pb-free reflow profile. Because the part is obsolete, official compliance certificates may no longer be available from the manufacturer. Treat as 'unknown' and request documentation from your distributor if compliance matters for your application.
