EP2A40B724I-7 - APEX II 40K LE FPGA 724-Pin BGA | Altera
MPN: EP2A40B724I-7 ✗ Cuối đờiEP2A40B724I-7 Tóm tắt
An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, and I/O pads that can be reconfigured after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are used for parallel processing, high-speed glue logic, and rapid prototyping of custom ASIC functionality. APEX II devices extend this concept with multi-core architecture (Lite, Fast, and I/O structures) suitable for high-bandwidth DSP and communications workloads.
Key features of the EP2A40B724I-7 include 4 PLLs, embedded memory blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V LVTTL/LVCMOS), and 8 clock pins per device plus 16 dedicated clock inputs. The BGA-724 package provides a 33x33 mm footprint with 1.27 mm ball pitch, enabling high pin density for high-I/O applications. Configuration is supported via Altera enhanced configuration devices, supporting fast serial or parallel modes with decompression capability.
Typical applications include telecommunications line cards, networking switches/routers, high-speed DSP pipelines, ASIC prototyping, and bus interface bridging. The high-density logic and memory make the EP2A40B724I-7 especially suitable for protocol bridging between PCI, DDR, and RapidIO domains. When designing with this device, verify that your PCB layout supports BGA fanout with microvia or via-in-pad technology, as 1.27 mm pitch BGA requires controlled-impedance routing and careful power-plane stitching to maintain signal integrity on hundreds of simultaneous switching outputs.
Bộ thay thế dễ dàng lắp đặt cho EP2A40B724I-7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2A40B724I-7 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Speed Grade, I/O Standards Supported.
EP2A40B724I-8
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724C7
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724C8
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724C9
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724CP
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724C7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2A40B724I-7 Tỷ lệ tối đa & tính chất điện
| Family | APEX II |
| Logic Elements | 40,000 LE |
| Embedded Memory | 1.5 Mbit (ESB) |
| Number of PLLs | 4 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -7 |
| Hộp | BGA-724 (724-ball FineLine BGA) |
| Package Footprint | 33 x 33 mm |
| Ball Pitch | 1.27 mm |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 C |
| Configuration Mode | Enhanced configuration device / fast serial |
| I/O Standard Support | LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V |
Hướng dẫn cấu hình chân EP2A40B724I-7 33 x 33 mm
Cấu hình chân cho EP2A40B724I-7 (33 x 33 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2A40B724I-7.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2A40B724I-7 phù hợp cho 6 Áp dụngs: Telecommunications Line Cards, Networking Switches and Routers, DSP and Signal Processing Pipelines, ASIC Prototyping and Emulation, High-Speed Bus Interface Bridging, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2A40B724I-7 fits telecommunications line cards because its 40,000 logic elements and 1.5 Mbit embedded memory provide enough capacity for protocol processing and packet buffering, while four on-chip PLLs synthesize the multiple clock domains required by telecom backplanes (typically 19.44 MHz, 38.88 MHz, 77.76 MHz). Industrial temperature grade -40C to +100C supports outdoor cabinet and central-office deployments, and the 724-ball BGA offers ample user I/O for high-density serial interfaces like LVDS and HSTL. Compared with smaller FPGAs, the device reduces BOM cost by integrating glue logic that would otherwise require separate CPLDs or bus bridges.
Được đề xuất
Networking Switches and Routers
In switching/routing platforms the EP2A40B724I-7 serves as the system controller FPGA, where its high user-I/O count and embedded SRAM are well-suited for table lookup, queue management, and cell/packet reassembly logic. The four PLLs generate the gigabit-rate clocks required by GMII/RGMII/SGMII interfaces, while embedded memory blocks handle small CAM/TCAM emulations. The 724-ball BGA is necessary to support simultaneous fast-Ethernet, gigabit, and 10G PHY connections plus management bus interfaces. Industrial temperature grade ensures reliability in thermally uncontrolled edge deployments.
Được đề xuất
DSP and Signal Processing Pipelines
The EP2A40B724I-7 supports high-throughput DSP workloads including FIR filters, FFT engines, and forward-error-correction blocks, leveraging its 1.5 Mbit embedded memory for coefficient storage and intermediate sample buffering. Speed grade -7 combined with dedicated multiplier/carry chains in the APEX II architecture delivers up to 4-8 GMACs sustained throughput for baseband and audio processing. The PLLs generate the multiple clock phases needed for parallel sample processing, while LVDS/HSTL I/O support external high-speed ADC/DAC interfaces. This is a natural fit for software-defined radio, base-station pre-processing, and medical imaging front ends.
Được đề xuất
ASIC Prototyping and Emulation
For ASIC prototyping the EP2A40B724I-7 provides enough logic density, memory, and I/O to map medium-complexity ASIC RTL with reasonable timing fidelity. The 724-ball BGA exposes the full I/O count needed for chip-to-chip ASIC emulation boards, and the industrial temperature range allows use in lab and environmental chambers during bring-up. Embedded memory blocks map ASIC SRAMs 1:1, while PLLs mimic the internal clock structure of the target ASIC. Quartus II synthesis maps all APEX II features, making this part a long-standing emulator platform for ASIC design teams.
Được đề xuất
High-Speed Bus Interface Bridging
The EP2A40B724I-7 is well-suited for bridging between legacy parallel buses (PCI, VME, custom ASIC interfaces) and modern serial protocols. The 724-ball BGA delivers the many dedicated I/O pins required for parallel bus emulation, while embedded PLLs generate the precise clock frequencies needed for synchronous bus capture. Industrial temperature grade allows deployment in factory automation and defense systems where the part bridges FPGA co-processors to legacy I/O cards. The 40K LE capacity easily absorbs protocol state machines and FIFO logic without external memory.
Được đề xuất
Test and Measurement Instrumentation
Test and measurement platforms benefit from the EP2A40B724I-7's 1.5 Mbit embedded memory (for deep sample buffers), four PLLs (for arbitrary waveform clock generation), and 724-ball BGA (for dense analog front-end interfaces). Industrial temperature grade allows use in portable test equipment deployed in field environments. Compared with smaller FPGAs, the device can perform real-time FFT, digital down-conversion, and pattern generation in a single chip without external DSP co-processors. The APEX II ESB blocks store calibration coefficients and waveform LUTs on-chip.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2A40B724I-7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2A40B724I-8 | EP2A40B724C7 | EP2A40B724C8 | EP2A40B724C9 | EP2A40B724CP | EP2A40B724C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-724 (1.27mm pitch, 33x33mm) | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Logic Elements | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE |
| Embedded Memory | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | -7 | -8 (faster) | -7 | -8 (faster) | -9 (fastest) | varies | -7 |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
Bảo phân biệt quan trọng
- Industrial temperature grade (-40C to +100C) (vsEP2A40B724C7)
- Mature APEX II architecture with extensive Quartus II support (vsModern Cyclone V / Stratix 10 devices)
- 724-ball BGA with full APEX II user I/O count (vsEP2A40B652 series (652-ball BGA))
Ghi chú thiết kế
The BGA-724 package at 1.27 mm ball pitch requires microvia or via-in-pad PCB technology to fan out the dense ball grid. Use a minimum of 6 PCB layers with one or two solid power planes and continuous ground planes stitched with 0.2 mm ground vias on a 1.0 mm pitch around the BGA perimeter. Keep all signal traces on outer layers away from the BGA field, and route differential pairs with matched 100 ohm differential impedance to maintain signal integrity on hundreds of simultaneously switching LVDS/LVCMOS outputs.
APEX II FPGAs require multiple supply rails: VCCINT core (1.5V or 1.8V depending on speed grade), VCCIO bank I/O (1.5V/1.8V/2.5V/3.3V selectable per bank), VCC_PLL for the four PLLs, and VCCPD programming supply. Decouple each PLL ball with 0.1 uF and 10 uF ceramic caps within 5 mm of the package. Estimate (per Quartus PowerPlay): a typical 40K-LE design at 200 MHz toggling 50% of logic consumes 2-4 W; derate the PCB for 6 W worst-case and use a thermal pad or via-array under the package exposed pad to keep junction below 100C.
Common pitfalls with APEX II BGA-724 designs include: (1) leaving clock PLL filter pins (PLLx_FB, PLLx_OUT) unconnected - each PLL must have its own LC filter network per datasheet Table 3; (2) failing to enable on-chip termination (OCT) for SSTL/LVDS outputs which causes overshoot on 50-ohm traces; (3) using generic JTAG commands instead of BSDL files for boundary-scan, leading to incorrect pin mapping; (4) sharing configuration pins with user I/O without disabling the nCONFIG pull-up during operation. Always validate signal integrity with IBIS models before committing to layout.
Thông tin tuân thủ
RoHS and lead-free status for the EP2A40B724I-7 are not stated in the verified data. The package uses 220C peak reflow temperature, suggesting Pb-free reflow profile. Because the part is obsolete, official compliance certificates may no longer be available from the manufacturer. Treat as 'unknown' and request documentation from your distributor if compliance matters for your application.
