EP2A40B724I-7 - APEX II 40K LE FPGA 724-Pin BGA | Altera
Référence : EP2A40B724I-7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2 205,00 |
| 100 | $196 | $19 600,00 |
| 500 | $175 | $87 500,00 |
| 1 000 | $158 | $158 000,00 |
EP2A40B724I-7 Présentation
An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, and I/O pads that can be reconfigured after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are used for parallel processing, high-speed glue logic, and rapid prototyping of custom ASIC functionality. APEX II devices extend this concept with multi-core architecture (Lite, Fast, and I/O structures) suitable for high-bandwidth DSP and communications workloads.
Key features of the EP2A40B724I-7 include 4 PLLs, embedded memory blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V LVTTL/LVCMOS), and 8 clock pins per device plus 16 dedicated clock inputs. The BGA-724 package provides a 33x33 mm footprint with 1.27 mm ball pitch, enabling high pin density for high-I/O applications. Configuration is supported via Altera enhanced configuration devices, supporting fast serial or parallel modes with decompression capability.
Typical applications include telecommunications line cards, networking switches/routers, high-speed DSP pipelines, ASIC prototyping, and bus interface bridging. The high-density logic and memory make the EP2A40B724I-7 especially suitable for protocol bridging between PCI, DDR, and RapidIO domains. When designing with this device, verify that your PCB layout supports BGA fanout with microvia or via-in-pad technology, as 1.27 mm pitch BGA requires controlled-impedance routing and careful power-plane stitching to maintain signal integrity on hundreds of simultaneous switching outputs.
Alternatives de remplacement direct pour EP2A40B724I-7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40B724I-7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Speed Grade, I/O Standards Supported.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40B724I-8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$280 / unité
Voir la fiche technique →EP2A40B724C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$650 / unité
Voir la fiche technique →EP2A40B724C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$615 / unité
Voir la fiche technique →EP2A40B724C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$395.38 / unité
Voir la fiche technique →EP2A40B724CP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$71 / unité
Voir la fiche technique →EP2A40B724C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$175 / unité
Voir la fiche technique →EP2A40B724I-7 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Logic Elements | 40,000 LE |
| Embedded Memory | 1.5 Mbit (ESB) |
| Number of PLLs | 4 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -7 |
| Boîtier | BGA-724 (724-ball FineLine BGA) |
| Package Footprint | 33 x 33 mm |
| Ball Pitch | 1.27 mm |
| Type de montage | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 C |
| Configuration Mode | Enhanced configuration device / fast serial |
| I/O Standard Support | LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V |
Guide de configuration des broches du EP2A40B724I-7 33 x 33 mm
Configuration des broches du EP2A40B724I-7 (boîtier 33 x 33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40B724I-7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40B724I-7 convient pour 6 applications: Telecommunications Line Cards, Networking Switches and Routers, DSP and Signal Processing Pipelines, ASIC Prototyping and Emulation, High-Speed Bus Interface Bridging, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2A40B724I-7 fits telecommunications line cards because its 40,000 logic elements and 1.5 Mbit embedded memory provide enough capacity for protocol processing and packet buffering, while four on-chip PLLs synthesize the multiple clock domains required by telecom backplanes (typically 19.44 MHz, 38.88 MHz, 77.76 MHz). Industrial temperature grade -40C to +100C supports outdoor cabinet and central-office deployments, and the 724-ball BGA offers ample user I/O for high-density serial interfaces like LVDS and HSTL. Compared with smaller FPGAs, the device reduces BOM cost by integrating glue logic that would otherwise require separate CPLDs or bus bridges.
Recommandé
Networking Switches and Routers
In switching/routing platforms the EP2A40B724I-7 serves as the system controller FPGA, where its high user-I/O count and embedded SRAM are well-suited for table lookup, queue management, and cell/packet reassembly logic. The four PLLs generate the gigabit-rate clocks required by GMII/RGMII/SGMII interfaces, while embedded memory blocks handle small CAM/TCAM emulations. The 724-ball BGA is necessary to support simultaneous fast-Ethernet, gigabit, and 10G PHY connections plus management bus interfaces. Industrial temperature grade ensures reliability in thermally uncontrolled edge deployments.
Recommandé
DSP and Signal Processing Pipelines
The EP2A40B724I-7 supports high-throughput DSP workloads including FIR filters, FFT engines, and forward-error-correction blocks, leveraging its 1.5 Mbit embedded memory for coefficient storage and intermediate sample buffering. Speed grade -7 combined with dedicated multiplier/carry chains in the APEX II architecture delivers up to 4-8 GMACs sustained throughput for baseband and audio processing. The PLLs generate the multiple clock phases needed for parallel sample processing, while LVDS/HSTL I/O support external high-speed ADC/DAC interfaces. This is a natural fit for software-defined radio, base-station pre-processing, and medical imaging front ends.
Recommandé
ASIC Prototyping and Emulation
For ASIC prototyping the EP2A40B724I-7 provides enough logic density, memory, and I/O to map medium-complexity ASIC RTL with reasonable timing fidelity. The 724-ball BGA exposes the full I/O count needed for chip-to-chip ASIC emulation boards, and the industrial temperature range allows use in lab and environmental chambers during bring-up. Embedded memory blocks map ASIC SRAMs 1:1, while PLLs mimic the internal clock structure of the target ASIC. Quartus II synthesis maps all APEX II features, making this part a long-standing emulator platform for ASIC design teams.
Recommandé
High-Speed Bus Interface Bridging
The EP2A40B724I-7 is well-suited for bridging between legacy parallel buses (PCI, VME, custom ASIC interfaces) and modern serial protocols. The 724-ball BGA delivers the many dedicated I/O pins required for parallel bus emulation, while embedded PLLs generate the precise clock frequencies needed for synchronous bus capture. Industrial temperature grade allows deployment in factory automation and defense systems where the part bridges FPGA co-processors to legacy I/O cards. The 40K LE capacity easily absorbs protocol state machines and FIFO logic without external memory.
Recommandé
Test and Measurement Instrumentation
Test and measurement platforms benefit from the EP2A40B724I-7's 1.5 Mbit embedded memory (for deep sample buffers), four PLLs (for arbitrary waveform clock generation), and 724-ball BGA (for dense analog front-end interfaces). Industrial temperature grade allows use in portable test equipment deployed in field environments. Compared with smaller FPGAs, the device can perform real-time FFT, digital down-conversion, and pattern generation in a single chip without external DSP co-processors. The APEX II ESB blocks store calibration coefficients and waveform LUTs on-chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40B724I-7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40B724I-8 | EP2A40B724C7 | EP2A40B724C8 | EP2A40B724C9 | EP2A40B724CP | EP2A40B724C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-724 (1.27mm pitch, 33x33mm) | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Logic Elements | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE | 40,000 LE |
| Embedded Memory | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB | 1.5 Mbit ESB |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | -7 | -8 (faster) | -7 | -8 (faster) | -9 (fastest) | varies | -7 |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
Principaux différenciateurs
- Industrial temperature grade (-40C to +100C) (vs EP2A40B724C7)
- Mature APEX II architecture with extensive Quartus II support (vs Modern Cyclone V / Stratix 10 devices)
- 724-ball BGA with full APEX II user I/O count (vs EP2A40B652 series (652-ball BGA))
Notes de conception
The BGA-724 package at 1.27 mm ball pitch requires microvia or via-in-pad PCB technology to fan out the dense ball grid. Use a minimum of 6 PCB layers with one or two solid power planes and continuous ground planes stitched with 0.2 mm ground vias on a 1.0 mm pitch around the BGA perimeter. Keep all signal traces on outer layers away from the BGA field, and route differential pairs with matched 100 ohm differential impedance to maintain signal integrity on hundreds of simultaneously switching LVDS/LVCMOS outputs.
APEX II FPGAs require multiple supply rails: VCCINT core (1.5V or 1.8V depending on speed grade), VCCIO bank I/O (1.5V/1.8V/2.5V/3.3V selectable per bank), VCC_PLL for the four PLLs, and VCCPD programming supply. Decouple each PLL ball with 0.1 uF and 10 uF ceramic caps within 5 mm of the package. Estimate (per Quartus PowerPlay): a typical 40K-LE design at 200 MHz toggling 50% of logic consumes 2-4 W; derate the PCB for 6 W worst-case and use a thermal pad or via-array under the package exposed pad to keep junction below 100C.
Common pitfalls with APEX II BGA-724 designs include: (1) leaving clock PLL filter pins (PLLx_FB, PLLx_OUT) unconnected - each PLL must have its own LC filter network per datasheet Table 3; (2) failing to enable on-chip termination (OCT) for SSTL/LVDS outputs which causes overshoot on 50-ohm traces; (3) using generic JTAG commands instead of BSDL files for boundary-scan, leading to incorrect pin mapping; (4) sharing configuration pins with user I/O without disabling the nCONFIG pull-up during operation. Always validate signal integrity with IBIS models before committing to layout.
Informations de conformité
RoHS and lead-free status for the EP2A40B724I-7 are not stated in the verified data. The package uses 220C peak reflow temperature, suggesting Pb-free reflow profile. Because the part is obsolete, official compliance certificates may no longer be available from the manufacturer. Treat as 'unknown' and request documentation from your distributor if compliance matters for your application.
