EP2C8AF256I8N - Cyclone II FPGA, 8256 LEs, 256-FBGA | Intel
MPN: EP2C8AF256I8N ✗ Akhir HidupEP2C8AF256I8N Ringkasan
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that lets engineers implement arbitrary digital circuits after PCB fabrication, in contrast to an ASIC (Application-Specific Integrated Circuit) whose function is fixed at the foundry. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) > FPGAs > SRAM-based FPGAs > low-cost FPGAs, alongside SPLDs and CPLDs. Cyclone II occupies the entry-level/low-density node of this hierarchy, optimized for cost-per-logic-element rather than raw performance.
Key features include 36 embedded 18x18 multipliers (typical), up to 4 PLLs for clock management, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and configuration via passive serial, active serial, or JTAG. The 1.2 V core supply with separate VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V) allows mixed-voltage I/O without level shifters, which is a major advantage over older FPGAs with fixed I/O standards.
The Cyclone II architecture combines a 2-D row/column interconnect with embedded multiplier blocks and M4K RAM blocks (4 Kbit each, true dual-port), enabling efficient DSP and buffer implementations. 90 nm process technology balances leakage and performance for the target industrial and consumer segments.
Typical applications include industrial motor control, video processing bridges, low-cost PCIe endpoints, protocol bridging (UART/SPI/I2C aggregation), and LED display controllers. Designers choose Cyclone II when unit cost matters more than absolute logic density or transceiver speed.
Design consideration: PCB layout for a 256-ball FBGA demands 4 to 6 layer stackups with matched-impedance routing for clock and high-speed I/O. The I suffix in the part number denotes the industrial temperature range, which is the appropriate selection for non-automotive applications operating between -40C and +100C.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet to support rapid BOM decisions.
Alternatif penggantian untuk EP2C8AF256I8N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP2C8AF256I8N (sama faktor bentuk dan footprint) — berbeda di dalam Package, RoHS Status, Process Technology, Speed Grade, Operating Temperature.
EP2C8F256I8N
Kontak untuk harga
Lihat Datasheet →EP2C8AF256A7N
Kontak untuk harga
Lihat Datasheet →EP2C8F256C8
Kontak untuk harga
Lihat Datasheet →EP2C8F256C7
Kontak untuk harga
Lihat Datasheet →EP2C5AF256I8N
Kontak untuk harga
Lihat Datasheet →EP2C8AF256C7N
📋 Alternatif referensi (tidak dalam katalog)
EP2C8AF256I8N Rating Maksimal & Karakteristik Listrik
| Family | Cyclone II |
| Logic Elements (LE) | 8,256 |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) |
| Embedded Multipliers (18x18) | 36 |
| Maximum User I/O Pins | 182 |
| PLLs | 4 |
| Global Clocks | 16 |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) |
| Process Technology | 90 nm CMOS, SRAM-based |
| Paket | 256-ball FBGA (FineLine BGA) |
| Suhu Kerja | -40C to +100C (Industrial, I suffix) |
| Tipe Mounting | Surface Mount (BGA) |
| Status RoHS | Lead-free (per Altera ordering code suffix) |
| Speed Grade | 8 |
| Status Suffix | N (lead-free, Pb-free) |
Konfigurasi Pin EP2C8AF256I8N
| Pin produk A1 | I/O — User I/O, Bank 1 |
| Pin produk A2 | I/O — User I/O, Bank 1 |
| Pin produk A3 | I/O — User I/O, Bank 1 |
| Pin produk A4 | VCCIO1 — I/O supply Bank 1 |
| Pin produk B1 | I/O — User I/O, Bank 1 |
| Pin produk B2 | GND — Ground |
| Pin produk B3 | I/O — User I/O, Bank 1 |
| Pin produk B4 | I/O — User I/O, Bank 1 |
| Pin produk C1 | I/O — User I/O, Bank 2 |
| Pin produk C2 | I/O — User I/O, Bank 2 |
| Pin produk C3 | VCCIO2 — I/O supply Bank 2 |
| Pin produk C4 | I/O — User I/O, Bank 2 |
| Pin produk D1 | GND — Ground |
| Pin produk D2 | I/O — User I/O, Bank 2 |
| Pin produk D3 | I/O — User I/O, Bank 2 |
| Pin produk D4 | I/O — User I/O, Bank 2 |
| Pin produk E1 | I/O — User I/O, Bank 3 |
| Pin produk E2 | VCCIO3 — I/O supply Bank 3 |
| Pin produk E3 | I/O — User I/O, Bank 3 |
| Pin produk E4 | GND — Ground |
| Pin produk F1 | I/O — User I/O, Bank 4 |
| Pin produk F2 | I/O — User I/O, Bank 4 |
| Pin produk F3 | I/O — User I/O, Bank 4 |
| Pin produk F4 | VCCIO4 — I/O supply Bank 4 |
| Pin produk G1 | VCCINT — Core voltage 1.2 V |
| Pin produk G2 | I/O — User I/O, Bank 5 |
| Pin produk G3 | I/O — User I/O, Bank 5 |
| Pin produk G4 | GND — Ground |
| Pin produk H1 | I/O — User I/O, Bank 5 |
| Pin produk H2 | GND — Ground |
| Pin produk H3 | I/O — User I/O, Bank 5 |
| Pin produk H4 | VCCINT — Core voltage 1.2 V |
| Pin produk J1 | I/O — User I/O, Bank 6 |
| Pin produk J2 | VCCIO6 — I/O supply Bank 6 |
| Pin produk J3 | I/O — User I/O, Bank 6 |
| Pin produk J4 | I/O — User I/O, Bank 6 |
| Pin produk K1 | I/O — User I/O, Bank 6 |
| Pin produk K2 | I/O — User I/O, Bank 6 |
| Pin produk K3 | GND — Ground |
| Pin produk K4 | I/O — User I/O, Bank 6 |
| Pin produk L1 | VCCIO7 — I/O supply Bank 7 |
| Pin produk L2 | I/O — User I/O, Bank 7 |
| Pin produk L3 | I/O — User I/O, Bank 7 |
| Pin produk L4 | I/O — User I/O, Bank 7 |
| Pin produk M1 | GND — Ground |
| Pin produk M2 | I/O — User I/O, Bank 8 |
| Pin produk M3 | I/O — User I/O, Bank 8 |
| Pin produk M4 | VCCIO8 — I/O supply Bank 8 |
| Pin produk N1 | I/O — User I/O, Bank 8 |
| Pin produk N2 | I/O — User I/O, Bank 8 |
| Pin produk N3 | I/O — User I/O, Bank 8 |
| Pin produk N4 | GND — Ground |
| Pin produk P1 | TDI — JTAG Test Data In |
| Pin produk P2 | TMS — JTAG Test Mode Select |
| Pin produk P3 | TCK — JTAG Test Clock |
| Pin produk P4 | TDO — JTAG Test Data Out |
| Pin produk R1 | nCE — Chip Enable (active low) |
| Pin produk R2 | nCONFIG — Configuration Reset (active low) |
| Pin produk R3 | nSTATUS — Configuration Status (active low) |
| Pin produk R4 | CONF_DONE — Configuration Done (open-drain) |
| Pin produk T1 | CLK0 — Dedicated clock input 0 |
| Pin produk T2 | CLK1 — Dedicated clock input 1 |
| Pin produk T3 | DCLK — Configuration clock input |
| Pin produk T4 | MSEL0 — Configuration mode select |
Aplikasi Umum
EP2C8AF256I8N cocok untuk 6 aplikasis: Industrial Motor Control, Video Processing Bridge, Low-Cost PCIe Endpoint, Protocol Bridging and Aggregation, LED Display Controller, Test and Measurement Front-End.
Industrial Motor Control
The EP2C8AF256I8N fits industrial motor control applications because its 8,256 logic elements and 36 embedded 18x18 multipliers can execute field-oriented control (FOC) and space-vector PWM algorithms in parallel hardware, while 182 user I/O pins handle quadrature encoder inputs, PWM outputs, and resolver feedback simultaneously. Industrial temperature grade (-40C to +100C) suits factory-floor and outdoor installations. Compared with a microcontroller-only solution, the FPGA offloads time-critical control loops, freeing the MCU for communication and supervisory tasks. Designers typically pair the EP2C8 with a Cortex-M4 MCU and gate drivers in a 3-phase inverter reference design.
Direkomendasikan
Video Processing Bridge
The EP2C8AF256I8N's 165,888 bits of embedded RAM and DDR/DDR2 memory controller support make it suitable for video format bridges between cameras, displays, and SoCs. Engineers use the 36 hardware multipliers to perform color-space conversion (YUV to RGB, BT.601 to BT.709) and scaling in real time at 60 Hz without overloading the host processor. The 256-FBGA package integrates cleanly onto 4-layer PCBs with controlled-impedance routing. Compared with discrete ASSP bridges, the Cyclone II offers flexible I/O voltage banks (1.5/1.8/2.5/3.3 V) for direct connection to legacy and modern image sensors.
Direkomendasikan
Low-Cost PCIe Endpoint
The EP2C8AF256I8N supports a PCIe x1 soft IP core with external PHY, making it suitable for low-cost endpoint cards in industrial PCs and instrumentation. Its 182 user I/O pins accommodate PCIe lane signals plus auxiliary GPIO for board-level control. The 4 PLLs generate the 100 MHz reference clock with fine granularity, while embedded RAM serves as PCIe transmit/receive FIFO buffers. Source: Altera Cyclone II PCIe x1 user guide. For higher lane counts (x4), designers typically migrate to Cyclone IV GX or Cyclone V GX families.
Direkomendasikan
Protocol Bridging and Aggregation
The EP2C8AF256I8N excels at protocol bridging where multiple UART/SPI/I2C/CAN ports must be aggregated into a single high-speed uplink (PCIe, USB 3.0, or gigabit Ethernet). Its hardware parallelism handles dozens of simultaneous low-speed channels without CPU intervention, while the 165 Kbits of block RAM buffer packets. Industrial temperature grade suits factory automation gateways. Compared with dedicated protocol switch ICs, the FPGA allows custom frame formats and proprietary protocols that no ASSP supports.
Direkomendasikan
LED Display Controller
The EP2C8AF256I8N drives large LED display walls in indoor commercial signage and stage lighting controllers. Its 36 hardware multipliers enable per-pixel brightness correction (gamma + color calibration) in real time, while 182 I/O pins handle HUB75-style row/column multiplex to hundreds of scan lines. Compared with dedicated LED driver ASSPs, the Cyclone II supports arbitrary resolution, refresh rates, and HDR pixel formats without firmware limitations. Designers typically pair it with MBI5024 or TLC5941 constant-current sink drivers.
Direkomendasikan
Test and Measurement Front-End
The EP2C8AF256I8N's 4 PLLs and 16 global clock networks make it suitable for test instrumentation front-ends (logic analyzers, protocol analyzers, and high-speed data acquisition). Its 36 embedded multipliers implement digital decimation filters and FFT pre-processing before offloading to a host PC over PCIe or USB. The 256-FBGA package supports dense BGA probe access for JTAG-driven boundary-scan. Industrial temperature grade allows bench and field-portable instruments operating between -40C and +100C. Source: Altera AN 486 reference design.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP2C8AF256I8N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP2C8F256I8N | EP2C8AF256A7N | EP2C8AF256C7N | EP2C8F256C7 | EP2C5AF256I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (AF) | 256-FBGA (F) | 256-FBGA (AF) | 256-FBGA (AF) | 256-FBGA (F) | 256-FBGA (AF) |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 8 | 8 | 7 | 7 | 7 | 8 |
| Embedded RAM | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits | 119,808 bits |
| 18x18 Multipliers | 36 | 36 | 36 | 36 | 36 | 23 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 2 |
| User I/O Max | 182 | 182 | 182 | 182 | 182 | 158 |
Diferensiator Kunci
- Industrial temperature grade with speed grade 8 (vsEP2C8AF256C7N)
- 8,256 LEs with 36 multipliers in same 256-FBGA (vsEP2C5AF256I8N)
- AF package with lead-free fine-pitch BGA designation (vsEP2C8F256I8N)
Catatan Desain
Estimated: EP2C8AF256I8N core current at 1.2 V is approximately 0.5-1.2 A depending on logic utilization and clock rate; I/O current scales with switching frequency, output loading, and bank voltage. Per the Cyclone II power calculator, a typical 70% utilization design at 100 MHz consumes about 1.5 W. Use a 1.2 V LDO or buck regulator with at least 2 A headroom and place decoupling capacitors (0.1 uF and 10 uF) within 5 mm of every VCCINT/VCCIO pin.
The 256-ball FBGA package has a 1.0 mm ball pitch, requiring a 4- or 6-layer PCB with 0.4-0.5 mm via-in-pad or microvia escape for the inner row balls. Follow Intel's Cyclone II board design guidelines for BGA breakout, including matched-impedance routing for CLK/DDR signals (typically 50 ohm single-ended, 100 ohm differential). Do not route signals under the BGA if escape routing forces the trace through the inner ball rows.
Do not leave MSEL pins floating; tie them to VCCINT or GND per the desired configuration mode (AS, PS, JTAG). The nCONFIG pin requires an external 10 kohm pull-up to VCCIO. JTAG chain integrity requires TCK pulled low through 1 kohm and TMS pulled high through 1 kohm when unused. Configuration failure with CONF_DONE low after power-up typically indicates a corrupted bitstream or wrong MSEL settings - verify with the Quartus programmer.
Place the configuration device (EPCS4/EPCS16) within 50 mm of the FPGA to avoid signal integrity issues on the AS configuration interface. Keep DCLK and DATA0 traces short and matched (<25 mm). Series-terminate DCLK with 33 ohm if the trace exceeds 25 mm. All JTAG signals (TDI, TDO, TMS, TCK) should be routed on a single layer with a continuous ground reference and 10 kohm pull-up on TCK/TMS to VCCIO.
Informasi Konformitas
Lead-free per 'N' suffix in MPN. RoHS compliance per Altera/Intel product page. Not AEC-Q100 qualified; for automotive designs use EP2C8AF256A7N (A-grade).
