EP2C8AF256I8N vs EP2C8F256I8N Perbandingan

Perbandingan bersamaan detil EP2C8AF256I8N dari Intel dan EP2C8F256I8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2C8AF256I8N EP2C8F256I8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Harga Unit (USD) $21,40 —
Family Cyclone II —
Logic Elements (LE) 8,256 —
Embedded Memory Bits 165,888 bits (162 Kbit RAM) 165,888 bits
Embedded Multipliers (18x18) 36 —
Maximum User I/O Pins 182 —
PLLs 4 2
Global Clocks 16 —
Configuration Elements Embedded SRAM, JTAG, AS, PS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) —
Process Technology 90 nm CMOS, SRAM-based 90 nm CMOS (SRAM-based)
Paket 256-ball FBGA (FineLine BGA) —
Suhu Kerja -40C to +100C (Industrial, I suffix) -40C to +85C (industrial)
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Status RoHS Lead-free (per Altera ordering code suffix) Compliant (Pb-free, lead-free reflow compatible)
Speed Grade 8 —
Status Suffix N (lead-free, Pb-free) —
Series — Cyclone II
Logic Elements (LEs) — 8,256
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
Global Clock Networks — 16
Core Supply Voltage — 1.2 V
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Configuration Method — SRAM, loaded from external EPCS flash at power-up

Spek dan Sumber

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