EP2S60F484C5 - Stratix II FPGA 60K LE 484-FBGA | Altera / Intel
MPN: EP2S60F484C5 ✗ Akhir HidupEP2S60F484C5 Ringkasan
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and they are widely used for ASIC prototyping, DSP acceleration, high-speed serial interfaces, and glue logic where time-to-market or post-production flexibility justifies their higher unit cost versus fixed-function ASSPs. The Stratix II family specifically targets high-density, performance-driven applications and is architecturally positioned between older Stratix and later Stratix III/IV families within Altera's high-end product tree.
Key features of the EP2S60F484C5 include 60,440 LEs, 2,544,192 RAM bits organized into TriMatrix memory blocks, dedicated 18x18 multipliers and DSP blocks, 12 PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and JTAG-based IEEE 1149.1 boundary-scan testing. The 484-pin FC-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch, suitable for high-density multi-layer PCB designs using standard BGA assembly processes.
The Stratix II architecture uses an 8-input adaptive logic module (ALM) rather than the 4-input LUT found in earlier families, allowing more logic to be packed into each block and improving effective utilization. Combined with the 90 nm process, the architecture delivers high performance per watt while supporting up to 1 Gbps I/O on certain pins and embedded transceivers on selected package options. Designers typically use Quartus II development software to compile, synthesize, place, and route designs targeting this device.
Typical applications for EP2S60F484C5 include high-speed digital signal processing (radar, software-defined radio, baseband), telecom line-card packet processing, ASIC prototyping for ASICs in the 100K-300K gate range, high-speed data-acquisition front-ends, video and imaging pipelines, and industrial control systems requiring parallel arithmetic. Designers migrating from earlier Stratix devices benefit from the larger LE count and richer DSP/memory ratio for signal-processing-centric designs.
When designing with EP2S60F484C5, pay close attention to the FPGA's power-up sequencing requirements - VCCINT, VCCPD, and VCCA must rise monotonically within specific timing windows defined by Altera AN-351. Decoupling capacitors (typically 0.1 uF and 10 uF per rail) should be placed adjacent to each power pin, and the JTAG chain must be accessible for in-system programming. The C5 speed grade is appropriate when the design's critical path is below ~250 MHz; for higher speeds choose C6 or migrate to Stratix III/IV families.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and practical design notes not typically aggregated on a single manufacturer page - complementing the official Altera Stratix II Device Handbook.
Alternatif penggantian untuk EP2S60F484C5 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP2S60F484C5 (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Package, Operating Temperature, Family, PLLs.
EP2S60F484C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2S60F484C4N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2S60F484C4
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2S60F484C3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2S60F484C3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP2S60F484C5 Rating Maksimal & Karakteristik Listrik
| Family | Stratix II |
| Logic Elements | 60440 |
| Configurable Logic Blocks (CLBs) | 24176 |
| Logic Array Blocks (LABs) | 3022 |
| Embedded Memory (RAM bits) | 2,544,192 |
| Maximum User I/O | 334 |
| Paket | 484-pin FC-FBGA (FBGA) |
| Package Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | C5 (Commercial) |
| Maximum Internal Frequency | 609.76 MHz |
| Suhu Kerja | Commercial (0C to +85C) |
| Tipe Mounting | Surface Mount (BGA) |
| Level MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Konfigurasi Pin EP2S60F484C5
| Pin produk A1 | I/O — User I/O bank (specific pinout per device handbook) |
| Pin produk A2 | VCCINT — Core voltage 1.2V supply |
| Pin produk A3 | I/O — User I/O bank |
| Pin produk A4 | GND — Ground |
| Pin produk A5 | I/O — User I/O bank |
| Pin produk A6 | VCCIO — I/O voltage supply |
| Pin produk B1 | CLK0 — Dedicated clock input 0 |
| Pin produk B2 | I/O — User I/O bank |
| Pin produk B3 | VCCINT — Core voltage 1.2V supply |
| Pin produk B4 | I/O — User I/O bank |
| Pin produk B5 | GND — Ground |
| Pin produk B6 | I/O — User I/O bank |
| Pin produk C1 | I/O — User I/O bank |
| Pin produk C2 | GND — Ground |
| Pin produk C3 | I/O — User I/O bank |
| Pin produk C4 | VCCIO — I/O voltage supply |
| Pin produk C5 | I/O — User I/O bank |
| Pin produk C6 | CLK1 — Dedicated clock input 1 |
| Pin produk D1 | nCONFIG — Configuration control (active low) |
| Pin produk D2 | I/O — User I/O bank |
| Pin produk D3 | GND — Ground |
| Pin produk D4 | I/O — User I/O bank |
| Pin produk D5 | nSTATUS — Configuration status (active low) |
| Pin produk D6 | I/O — User I/O bank |
| Pin produk E1 | I/O — User I/O bank |
| Pin produk E2 | VCCINT — Core voltage 1.2V supply |
| Pin produk E3 | I/O — User I/O bank |
| Pin produk E4 | CONF_DONE — Configuration complete indicator |
| Pin produk E5 | I/O — User I/O bank |
| Pin produk E6 | VCCPD — Pre-driver voltage supply |
| Pin produk F1 | TDI — JTAG test data input |
| Pin produk F2 | I/O — User I/O bank |
| Pin produk F3 | GND — Ground |
| Pin produk F4 | I/O — User I/O bank |
| Pin produk F5 | VCCIO — I/O voltage supply |
| Pin produk F6 | TCK — JTAG test clock |
| Pin produk G1 | I/O — User I/O bank |
| Pin produk G2 | TMS — JTAG test mode select |
| Pin produk G3 | I/O — User I/O bank |
| Pin produk G4 | TDO — JTAG test data output |
| Pin produk G5 | I/O — User I/O bank |
| Pin produk G6 | VCCINT — Core voltage 1.2V supply |
| Pin produk H1 | VCCIO — I/O voltage supply |
| Pin produk H2 | I/O — User I/O bank |
| Pin produk H3 | GND — Ground |
| Pin produk H4 | I/O — User I/O bank |
| Pin produk H5 | VCCA — PLL analog voltage supply |
| Pin produk H6 | I/O — User I/O bank |
| Pin produk J1 | I/O — User I/O bank |
| Pin produk J2 | VCCINT — Core voltage 1.2V supply |
| Pin produk J3 | I/O — User I/O bank |
| Pin produk J4 | CLK2 — Dedicated clock input 2 |
| Pin produk J5 | I/O — User I/O bank |
| Pin produk J6 | GND — Ground |
| Pin produk K1 | I/O — User I/O bank |
| Pin produk K2 | GND — Ground |
| Pin produk K3 | I/O — User I/O bank |
| Pin produk K4 | VCCIO — I/O voltage supply |
| Pin produk K5 | I/O — User I/O bank |
| Pin produk K6 | CLK3 — Dedicated clock input 3 |
| Pin produk L1 | I/O — User I/O bank |
| Pin produk L2 | VCCINT — Core voltage 1.2V supply |
| Pin produk L3 | I/O — User I/O bank |
| Pin produk L4 | GND — Ground |
| Pin produk L5 | I/O — User I/O bank |
| Pin produk L6 | VCCPD — Pre-driver voltage supply |
| Pin produk M1 | GND — Ground |
| Pin produk M2 | I/O — User I/O bank |
| Pin produk M3 | VCCIO — I/O voltage supply |
| Pin produk M4 | I/O — User I/O bank |
| Pin produk M5 | VCCINT — Core voltage 1.2V supply |
| Pin produk M6 | I/O — User I/O bank |
| Pin produk N1 | I/O — User I/O bank |
| Pin produk N2 | CLK4 — Dedicated clock input 4 |
| Pin produk N3 | I/O — User I/O bank |
| Pin produk N4 | GND — Ground |
| Pin produk N5 | I/O — User I/O bank |
| Pin produk N6 | VCCIO — I/O voltage supply |
| Pin produk P1 | I/O — User I/O bank |
| Pin produk P2 | VCCINT — Core voltage 1.2V supply |
| Pin produk P3 | I/O — User I/O bank |
| Pin produk P4 | CLK5 — Dedicated clock input 5 |
| Pin produk P5 | I/O — User I/O bank |
| Pin produk P6 | GND — Ground |
| Pin produk R1 | I/O — User I/O bank |
| Pin produk R2 | GND — Ground |
| Pin produk R3 | I/O — User I/O bank |
| Pin produk R4 | VCCIO — I/O voltage supply |
| Pin produk R5 | I/O — User I/O bank |
| Pin produk R6 | CLK6 — Dedicated clock input 6 |
| Pin produk T1 | I/O — User I/O bank |
| Pin produk T2 | VCCINT — Core voltage 1.2V supply |
| Pin produk T3 | I/O — User I/O bank |
| Pin produk T4 | GND — Ground |
| Pin produk T5 | I/O — User I/O bank |
| Pin produk T6 | VCCPD — Pre-driver voltage supply |
| Pin produk U1 | MSEL0 — Configuration mode select 0 |
| Pin produk U2 | I/O — User I/O bank |
| Pin produk U3 | MSEL1 — Configuration mode select 1 |
| Pin produk U4 | I/O — User I/O bank |
| Pin produk U5 | VCCIO — I/O voltage supply |
| Pin produk U6 | I/O — User I/O bank |
| Pin produk V1 | I/O — User I/O bank |
| Pin produk V2 | GND — Ground |
| Pin produk V3 | I/O — User I/O bank |
| Pin produk V4 | CLK7 — Dedicated clock input 7 |
| Pin produk V5 | I/O — User I/O bank |
| Pin produk V6 | VCCINT — Core voltage 1.2V supply |
Aplikasi Umum
EP2S60F484C5 cocok untuk 6 aplikasis: High-Speed Digital Signal Processing (Radar / SDR), Telecom Line-Card Packet Processing, ASIC Prototyping for Mid-Density ASICs (100K-300K gates), High-Speed Data Acquisition Front-End, Video and Imaging Pipeline Processing, Industrial Control and Motor Drive Systems.
High-Speed Digital Signal Processing (Radar / SDR)
The EP2S60F484C5's 60,440 LEs combined with embedded 18x18 multipliers and DSP blocks deliver the parallel arithmetic throughput required for radar pulse-Doppler processing and software-defined radio (SDR) baseband. With 2,544,192 bits of TriMatrix memory, designers can stage FFT windows and channelization filters on-chip without external SRAM, while 334 user I/Os support multiple parallel ADC/DAC lanes. The 609 MHz Fmax and C5 speed grade are well-matched to intermediate-frequency (IF) sampling rates in the 100-200 MHz range common in defense and wireless infrastructure designs.
Direkomendasikan
Telecom Line-Card Packet Processing
The EP2S60F484C5 was widely adopted in metro Ethernet and OTN line cards where packet classification, policing, and queuing require parallel lookup engines. The TriMatrix memory supports 32-bit and 64-bit TCAM emulation with sustained multi-Gbps throughput, and the 12 on-chip PLLs allow independent clock domains for fabric, NPU, and SERDES interfaces. Its 484-FBGA footprint fits within standard AdvancedTCA/AMC line-card area constraints, and the 1.2 V core voltage suits legacy multi-rail power designs common in telecom infrastructure.
Direkomendasikan
ASIC Prototyping for Mid-Density ASICs (100K-300K gates)
Designers prototyping ASICs in the 100,000-300,000 gate range leverage the EP2S60F484C5's 60,440 LE count and Quartus II synthesis flow to validate RTL before committing to mask NRE. The Stratix II architecture's 8-input ALM provides better logic packing than older 4-LUT devices, allowing closer ASIC-to-FPGA gate mapping. Multi-FPGA partitioning tools (such as Synopsys Certify or Mentor Graphics Precision) can split larger ASICs across multiple EP2S60 devices on a single prototype board, accelerating pre-silicon software development.
Direkomendasikan
High-Speed Data Acquisition Front-End
The EP2S60F484C5 suits multi-channel data acquisition systems sampling at 100-200 MSPS per channel, where 334 user I/Os support 8-16 parallel LVDS ADC lanes with on-chip synchronization. The TriMatrix memory buffers acquisition bursts while a host CPU or DMA engine drains the data over PCIe or Gigabit Ethernet. DSP blocks implement digital down-conversion (DDC) and decimation filters directly in the FPGA, reducing downstream DSP processor load. The C5 speed grade comfortably meets typical DDC filter Fmax requirements.
Direkomendasikan
Video and Imaging Pipeline Processing
Broadcast video routers, multi-viewer systems, and medical imaging devices use the EP2S60F484C5 for real-time video processing at HD and 4K resolutions. The 60,440 LEs support multiple parallel video processing pipelines (color space conversion, scaling, frame rate conversion), while the 2.5 Mbit embedded RAM serves as line buffers and lookup-table storage for gamma correction. LVDS I/O support enables direct interfacing with HDMI receivers and serializer/deserializer (SerDes) chips without external glue logic.
Direkomendasikan
Industrial Control and Motor Drive Systems
The EP2S60F484C5 is deployed in industrial servo drives and CNC controllers where deterministic, low-latency logic execution is critical. The 12 on-chip PLLs synchronize motor PWM switching frequencies (typically 8-32 kHz) with encoder feedback sampling and fieldbus communication (EtherCAT, PROFINET). DSP blocks execute field-oriented control (FOC) algorithms with sub-microsecond loop times, while 334 I/Os accommodate multiple encoder, Hall-sensor, and gate-driver interfaces. The industrial temperature variants (-40C to +100C) are available in I-grade suffixes.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP2S60F484C5 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP2S60F484C5N | EP2S60F484C4N | EP2S60F484C4 | EP2S60F484C3N | EP2S60F484C3 |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C5 | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) |
| RoHS / Lead-free | Standard (non-Pb-free) | Pb-free (RoHS compliant) | Pb-free (RoHS compliant) | Standard | Pb-free (RoHS compliant) | Standard |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O Count | 334 | 334 | 334 | 334 | 334 | 334 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
Diferensiator Kunci
- Mid-density 60K LE Stratix II with TriMatrix memory and DSP blocks (vsEP2S30F484C5)
- C5 speed grade offers balance of performance and cost (vsEP2S60F484C3N)
- Lead-free variant available (C5N) for RoHS markets (vsEP2S60F484C5 (standard))
- High I/O count (334) in compact 23x23 mm package (vsLower-density FPGAs in larger packages)
Catatan Desain
The EP2S60F484C5 requires three primary power rails: VCCINT (1.2 V core), VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V bank-dependent I/O), and VCCPD (3.3 V pre-driver). According to Altera application note AN-351, all three rails must rise monotonically within 100 ms and reach their nominal voltages within the timing window specified in the Stratix II handbook. Use a TI TPS5420 or equivalent DC-DC converter with power-good output to drive POR (power-on-reset) sequencing. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor within 5 mm of the package; VCCIO and VCCPD require similar decoupling ratios.
Estimated: At typical utilization (60% LEs, 50% DSP blocks, 100 MHz clock), the EP2S60F484C5 dissipates approximately 3-5 W depending on toggle rate. Designers should provide a continuous ground plane on layer 2 of the PCB and thermal vias under the BGA thermal balls to spread heat to inner copper layers. For applications above 75% utilization or sustained high toggle rates, an external heatsink with thermal interface material is recommended. Always verify junction temperature against the 0C to +85C commercial range (or -40C to +100C for I-grade) in the worst-case corner.
The 484-FBGA package uses 1.0 mm ball pitch which is compatible with standard 0.5 oz copper PCB processes using laser-drilled microvias (HDI technology). According to IPC-7351 guidelines, the BGA land pad should be NSMD (non-solder-mask-defined) with a diameter of 0.5 mm (0.020 in). Use a 4 mil solder paste stencil with apertures 0.4 mm in diameter for assembly. Signal escape routing on the top layer requires microvia-in-pad; allocate at least 6 PCB layers for the full Stratix II design including JTAG, clock, and configuration signal routing.
Route differential clock inputs (CLK[0:11]) using 100 ohm differential impedance with matched length to within 10 mils. Place the configuration memory (typically EPCS16 or EPCS64 serial flash) within 50 mm of the FPGA with impedance-controlled traces on the DATA, DCLK, nCS, and ASDO lines. Per Altera's Stratix II handbook, MSEL[2:0] pins select the configuration scheme (AS, PS, JTAG, FPP) and must be tied to VCCPD or GND through 1 kohm resistors - never left floating. Place the JTAG header on the board edge for in-system programming access.
Common pitfalls when designing with the EP2S60F484C5 include: (1) leaving unused I/O banks floating - all banks must have VCCIO supplied even when unused, per Altera AN-358; (2) violating configuration mode timing by toggling nCONFIG during power-up; (3) exceeding LVDS data rate limits when the design uses LVDS channels at >1 Gbps without proper PCB stackup design; (4) failing to instantiate the altsyncram megafunction with proper initialization files - TriMatrix memory blocks require explicit .mif or .hex files; (5) confusing the C5 speed grade with the I5 industrial speed grade - C5 = commercial temperature, I5 = industrial temperature.
Informasi Konformitas
EP2S60F484C5 is standard (non-Pb-free) ball composition. For RoHS-compliant designs choose EP2S60F484C5N (lead-free variant, RoHS compliant per Altera/Intel documentation). AEC-Q100 not applicable - this is an industrial/commercial FPGA. REACH compliance per manufacturer documentation.
