Intel

EP4SGX530NF45C4 - Stratix IV GX 531K LE FPGA, 920 I/O | Intel

MPN: EP4SGX530NF45C4 ✗ Akhir Hidup

0.9 V Vdss 1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm Package 800 MHz Speed 28,033,024 (28 Mb) Memory

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EP4SGX530NF45C4 Ringkasan

The Intel (formerly Altera) EP4SGX530NF45C4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 531,200 logic elements, 21,248 Logic Array Blocks (LABs), and 28,033,024 bits of embedded memory in a 1932-ball Flip-Chip BGA (FC-FBGA) package. Manufactured on a 40 nm process with a 0.9 V core supply, this transceiver-rich device integrates up to 920 user I/O pins and provides 800 MHz internal fabric performance, targeting high-throughput serial connectivity applications.

A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines configurable logic blocks (LABs/LEs), programmable interconnect, dedicated DSP blocks, on-chip memory, and (in GX variants) multi-gigabit transceivers. Stratix IV GX sits within Intel/Altera's high-end FPGA hierarchy as a 40 nm transceive-capable family: FPGA > programmable logic > SRAM-based configuration > Stratix IV > GX transceiver series. The architecture enables hardware-level parallelism for DSP, packet processing, and ASIC prototyping without sacrificing I/O density.

Key features of the EP4SGX530NF45C4 include 531,200 logic elements, 28 Mb embedded memory, integrated 8.5 Gbps multi-gigabit transceivers (Stratix IV GX family), 920 high-speed user I/O lanes, embedded DSP blocks for fixed/floating-point arithmetic, and hard PCIe Gen1/Gen2 IP cores. The -C4 speed grade balances timing margin and Fmax, while the NF45 (1932-ball, 42.5 x 42.5 mm) package maximizes I/O density for line-card and backplane designs.

Typical applications include 40G/100G optical transport line cards, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, XAUI, SFI), ASIC prototyping, broadcast video processing, radar and signal-intelligence front-ends, and high-performance computing (HPC) fabric. Industrial and military-aerospace variants in the Stratix IV family deliver extended temperature ranges and ruggedized packaging.

When designing with this device, plan power integrity carefully - the FC-FBGA substrate demands a 12+ layer PCB with continuous ground and dedicated decoupling per transceiver bank. JTAG and active serial configuration via EPCS flash is recommended for production. Lead-free and RoHS compliant per Intel product declaration.

This page synthesizes distributor pricing, package-specific drop-in alternatives, and engineering trade-offs not found in the standalone datasheet, enabling faster sourcing and design-in decisions.

Alternatif penggantian untuk EP4SGX530NF45C4 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP4SGX530NF45C4 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.

EP4SGX530NF45C2

Intel

Package: 1932-ball FCBGA (NF45) 42.5 x 42.5 mm

Process Technology: 40 nm

Operating Temperature: 0 C to 85 C (Commercial)