Altera
EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
MPN: EPF10K200SRC240-2X ⚠ Waktu Beli Terakhir
2.5 V Vdss
182 Package
200 MHz Speed
MOQ: 1 |
EPF10K200SRC240-2X Ringkasan
The Altera EPF10K200SRC240-2X is a high-density FLEX 10K-series Field Programmable Gate Array (FPGA) delivering 200,000 system gates, 9984 logic cells, and 1248 Logic Array Blocks (LABs), housed in a 240-pin PowerQuad Flat Package (RQFP/RQFP-240). It belongs to Intel/Altera's FLEX 10K family of embedded programmable logic devices (PLDs) that combine look-up table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP functions. The device supports up to 470 user I/Os in some packages and provides typical propagation delays of approximately 0.4 ns to 0.8 ns at room temperature.
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.
Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.
Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.
Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.
Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.
Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.
Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
Alternatif penggantian untuk EPF10K200SRC240-2X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K200SRC240-2X (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Operating Temperature, Speed Grade, Family, Package.
Intel
Operating Temperature: -40C to +85C (industrial)
Speed Grade: -1 (fastest)
Family: FLEX 10K Embedded Programmable Logic
Bandingkan dengan EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 µm CMOS
Package: 240-BFQFP Exposed Pad (RQFP-240)
Bandingkan dengan EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 um / 0.3 um CMOS
Operating Temperature: -40C to +85C (industrial)
Speed Grade: -1 (fastest commercial)
Bandingkan dengan EPF10K200SRC240-2X →
Intel
Process Technology: 0.42 micrometer CMOS SRAM
Operating Temperature: 0C to +70C (Commercial, TA)
Speed Grade: -2 (~80 MHz internal, typical)
Bandingkan dengan EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 um CMOS
Operating Temperature: 0 C to 70 C (Commercial)
Package: 240-BFQFP Exposed Pad (RQFP-240)
Bandingkan dengan EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 µm CMOS SRAM
Operating Temperature: 0 °C to +70 °C (Commercial)
Speed Grade: -3 (commercial)
Bandingkan dengan EPF10K200SRC240-2X →
EPF10K200SRC240-2
✅ Drop-InIntel
📦 RQFP-240
FLEX 10KS · FLEX 10KS (FLEX 10KE/10KA generation) · 9984 · 1248 · 98304 · 182 · 513000 · 2.375 V to 2.625 V (nominal 2.5 V)
Kontak untuk harga
Lihat Datasheet →EPF10K200SRC240-1X
✅ Drop-InIntel
📦 RQFP-240
FLEX-10KS · FLEX 10KS · 9984 · 200,000 · 1248 · 98,304 bits · 182 · 4
Kontak untuk harga
Lihat Datasheet →EPF10K200SRC240-1N
✅ Drop-InIntel
📦 RQFP-240
FLEX 10KE · EPF10K200 · 9,984 · 200,000 · 1,248 · 182 · 2.5 V · 250 MHz
Kontak untuk harga
Lihat Datasheet →EPF10K200SRC240-1
✅ Drop-InIntel
📦 RQFP-240
Intel (formerly Altera) · FLEX-10KS · FLEX 10K Embedded Programmable Logic · FPGA - Field Programmable Gate Array · 9984 · 1248 · 24 · 40960
Kontak untuk harga
Lihat Datasheet →EPF10K200SRC240-1X
✅ Drop-InIntel
📦 RQFP-240
FLEX-10KS · FLEX 10KS · 9984 · 200,000 · 1248 · 98,304 bits · 182 · 4
Kontak untuk harga
Lihat Datasheet →EPF10K200SRC240-2X Rating Maksimal & Karakteristik Listrik
| Series | FLEX 10KS |
| Family | FLEX 10KE |
| Logic Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Equivalent Gates | 200,000 |
| Embedded RAM (approx.) | 98 Kbits |
| User I/Os (max in family) | 470 |
| User I/Os (this package) | 182 |
| Propagation Delay | 0.4 ns to 0.8 ns |
| Max Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V (banks; 5 V tolerant inputs) |
| Paket | RQFP-240 (240-pin Power Quad Flat Pack, 34.6 x 34.6 mm, 0.5 mm pitch) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0 C to +70 C (Commercial) |
| Process Technology | CMOS |
| Configuration Method | JTAG / Passive Serial (PS) |
| Boundary-Scan (JTAG) | IEEE 1149.1 compliant |
| Speed Grade | -2X (industrial, upper-mid speed) |
Konfigurasi Pin EPF10K200SRC240-2X
| Pin produk 1 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 2 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 3 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 4 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 5 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 6 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 7 | GND — Ground |
| Pin produk 8 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 9 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 10 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 11 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 12 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 13 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 14 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 15 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 16 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 17 | GND — Ground |
| Pin produk 18 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 19 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 20 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 21 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 22 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 23 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 24 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 25 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 26 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 27 | GND — Ground |
| Pin produk 28 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 29 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 30 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 31 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 32 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 33 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 34 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 35 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 36 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 37 | GND — Ground |
| Pin produk 38 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 39 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 40 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 41 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 42 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 43 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 44 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 45 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 46 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 47 | GND — Ground |
| Pin produk 48 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 49 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 50 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 51 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 52 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 53 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 54 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 55 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 56 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 57 | GND — Ground |
| Pin produk 58 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 59 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 60 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 61 | TDI — JTAG Test Data In (dedicated) |
| Pin produk 62 | TMS — JTAG Test Mode Select (dedicated) |
| Pin produk 63 | TCK — JTAG Test Clock (dedicated) |
| Pin produk 64 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 65 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 66 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 67 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 68 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 69 | GND — Ground |
| Pin produk 70 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 71 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 72 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 73 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 74 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 75 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 76 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 77 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 78 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 79 | GND — Ground |
| Pin produk 80 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 81 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 82 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 83 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 84 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 85 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 86 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 87 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 88 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 89 | GND — Ground |
| Pin produk 90 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 91 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 92 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 93 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 94 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 95 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 96 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 97 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 98 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 101 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 102 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 103 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 104 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 105 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 106 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 107 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 108 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 111 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 112 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 113 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 114 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 115 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 116 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 117 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 118 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 121 | nCONFIG — Configuration start (dedicated, active-low) |
| Pin produk 122 | nSTATUS — Configuration status (dedicated, active-low) |
| Pin produk 123 | DCLK — Configuration clock (dedicated) |
| Pin produk 124 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 125 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 126 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 127 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 128 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 129 | GND — Ground |
| Pin produk 130 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 131 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 132 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 133 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 134 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 135 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 136 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 137 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 138 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 139 | GND — Ground |
| Pin produk 140 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 141 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 142 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 143 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 144 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 145 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 146 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 147 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 148 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 149 | GND — Ground |
| Pin produk 150 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 151 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 152 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 153 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 154 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 155 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 156 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 157 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 158 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 159 | GND — Ground |
| Pin produk 160 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 161 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 162 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 163 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 164 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 165 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 166 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 167 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 168 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 169 | GND — Ground |
| Pin produk 170 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 171 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 172 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 173 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 174 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 175 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 176 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 177 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 178 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 179 | GND — Ground |
| Pin produk 180 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 181 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 182 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 183 | TDO — JTAG Test Data Out (dedicated) |
| Pin produk 184 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 185 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 186 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 187 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 188 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 189 | GND — Ground |
| Pin produk 190 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 191 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 192 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 193 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 194 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 195 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 196 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 197 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 198 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 199 | GND — Ground |
| Pin produk 200 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 201 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 202 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 203 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 204 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 205 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 206 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 207 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 208 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 209 | GND — Ground |
| Pin produk 210 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 211 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 212 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 213 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 214 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 215 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 216 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 217 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 218 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 219 | GND — Ground |
| Pin produk 220 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 221 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 222 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 223 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 224 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 225 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 226 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 227 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 228 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 229 | GND — Ground |
| Pin produk 230 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 231 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 232 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 233 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pin produk 234 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 235 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 236 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 237 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 238 | I/O — User I/O (bank-dependent VCCIO) |
| Pin produk 239 | GND — Ground |
| Pin produk 240 | I/O — User I/O (bank-dependent VCCIO) |
Aplikasi Umum
EPF10K200SRC240-2X cocok untuk 6 aplikasis: Telecom Switching and Routing Equipment, ASIC Prototyping and Emulation, Industrial Control and Machine Automation, PCI/ISA Bridge and Custom Bus Architecture, Military and Aerospace Legacy Avionics, DSP Pre- and Post-Processing Pipelines.
Telecom Switching and Routing Equipment
The EPF10K200SRC240-2X is well suited to legacy telecom switching equipment where it implements custom bus arbiters, time-slot interchangers, and protocol-conversion glue logic. Its 200K-gate density and 9984 logic cells comfortably handle T1/E1 framers, HDLC controllers, and ATM cell-processing datapaths, while the 240-pin RQFP package exposes enough I/O for 32-bit parallel backplane interfaces. The 2.5 V core / 3.3 V I/O bank architecture integrates directly with late-1990s telecom ASICs without level shifters, reducing BOM cost and board area in central-office line cards and DSLAM designs.
Direkomendasikan
ASIC Prototyping and Emulation
Engineers historically used the EPF10K200SRC240-2X as an ASIC prototype vehicle, partitioning a large ASIC design across multiple FLEX 10K devices for pre-silicon validation. The 200K-gate capacity maps directly onto mid-complexity ASICs of its era, and the RQFP-240 footprint with 182 user I/Os allows full visibility into internal nets via JTAG (IEEE 1149.1) boundary-scan. The -2X speed grade delivers realistic timing correlation with the target ASIC, reducing the risk of post-silicon re-spins in custom chip programs for storage controllers and networking silicon.
Direkomendasikan
Industrial Control and Machine Automation
The EPF10K200SRC240-2X is widely deployed in PLCs, motor-control boards, and SCADA interface cards where its 200K-gate logic capacity accommodates custom state machines, encoder counters, and fieldbus protocol stacks (Profibus, DeviceNet, Modbus). The 0 C to +70 C commercial temperature range and 3.3 V I/O tolerance to 5 V inputs simplify integration with industrial sensors and 24 V optoisolated I/O. The RQFP-240's exposed pad allows direct soldering on heavy-copper industrial PCBs without heatsinks, supporting long-lifecycle machinery in factory-automation lines.
Direkomendasikan
PCI/ISA Bridge and Custom Bus Architecture
The EPF10K200SRC240-2X excels as a PCI-to-local-bus bridge and custom backplane arbiter in embedded motherboards, VME/cPCI cards, and industrial PCs. Its 182 user I/Os in RQFP-240 comfortably support 32-bit PCI signals plus local address/data buses, interrupt steering, and DMA handshaking. The 200 MHz internal Fmax and 0.4-0.8 ns propagation delay handle 33 MHz PCI timing with substantial margin, while the embedded array blocks (EABs) provide on-chip FIFOs for bus-master DMA buffers, eliminating external SRAM and reducing BOM cost.
Direkomendasikan
Military and Aerospace Legacy Avionics
The EPF10K200SRC240-2X continues to serve in military and aerospace programs requiring long-lifecycle, qualified FPGAs in MIL-PRF-grade housings. Its high gate count supports radar signal pre-processing, flight-control interface logic, and MIL-STD-1553 databus bridging, while the CMOS process technology provides radiation tolerance acceptable for non-space applications. The RQFP-240 ceramic-compatible variant withstands the thermal cycling of avionics bays, and the IEEE 1149.1 JTAG interface simplifies factory and depot-level boundary-scan test on legacy platforms.
Direkomendasikan
DSP Pre- and Post-Processing Pipelines
The EPF10K200SRC240-2X functions as a high-speed pre-/post-processor alongside dedicated DSP chips in sonar, ultrasound, and software-defined-radio front-ends. Its embedded array blocks (EABs) provide configurable multipliers, FIR filter coefficient memory, and sample-rate-conversion FIFOs that offload the host DSP, freeing CPU cycles for algorithm execution. The 2.5 V core and 200 MHz internal frequency sustain real-time decimation, interpolation, and channelization pipelines, while the RQFP-240 package's 182 I/Os interface directly to multi-channel ADC/DAC data buses without external buffers.
Direkomendasikan
Ringkasan Produk Direkomendasikan
EPF10K100EQC240-2
Altera Digunakan di dalam: Telecom Switching and Routing Equipment, PCI/ISA Bridge and Custom Bus Architecture
EPF10K130EQC240-2
Mid-density FLEX 10K FPGA for companion datapath tasks Digunakan di dalam: Telecom Switching and Routing Equipment
EPF10K200SBC600-2
Altera Digunakan di dalam: ASIC Prototyping and Emulation
EPF10K130EFC484-2
Altera Digunakan di dalam: ASIC Prototyping and Emulation, DSP Pre- and Post-Processing Pipelines
EPF10K100BQC240-2
Altera Digunakan di dalam: Industrial Control and Machine Automation
EPF10K50VRC240-2
Intel Digunakan di dalam: Industrial Control and Machine Automation
EPF10K130EQI240-2
Intel Digunakan di dalam: PCI/ISA Bridge and Custom Bus Architecture
EPF10K200EFC672-2
Intel Digunakan di dalam: Military and Aerospace Legacy Avionics
EPF10K100EQI240-2
Altera Digunakan di dalam: Military and Aerospace Legacy Avionics
EPF10K200SFC484-2
Altera Digunakan di dalam: DSP Pre- and Post-Processing Pipelines
What is the EPF10K200SRC240-2X?
The EPF10K200SRC240-2X is an Altera FLEX 10K-series FPGA with 200,000 equivalent gates, 9984 logic cells, and 1248 LABs, in a 240-pin RQFP package. According to Altera (now Intel) documentation, it supports JTAG (IEEE 1149.1) configuration and operates from a 2.5 V core supply with 3.3 V I/O banks, making it a long-life-cycle option for industrial and telecom designs.
How many user I/O pins does the EPF10K200SRC240-2X provide?
The EPF10K200SRC240-2X exposes 182 user I/O pins in its 240-pin RQFP package. The wider FLEX 10K family supports up to 470 user I/Os in larger packages, but the RQFP-240 variant is pin-limited to 182. This is sufficient for PCI, ISA, and many custom bus architectures common in the late-1990s/early-2000s design era.
What is the difference between EPF10K200SRC240-2X and EPF10K200SRC240-1N?
Both share the FLEX 10K die, RQFP-240 package, and 200K-gate density, but differ in speed grade. The -2X grade is faster than -1N (lower propagation delay and higher Fmax). According to Altera speed-grade nomenclature, -1N < -2X < -3N in performance; -2X is the upper-mid range, while -1N is the slowest. They are pin-to-pin compatible.
Where can I buy the EPF10K200SRC240-2X?
As of 2026-09-11, the EPF10K200SRC240-2X is listed at LCSC Electronics at approximately $91.56 unit, and franchised distributors such as DigiKey, Mouser, Arrow, and Rochester Electronics also carry stock or franchise listings. Because the part is in long-life-cycle/EOL phase, sourcing channels include open-market brokers and OEM excess inventory; always verify lot date code and traceability.
What is the price of the EPF10K200SRC240-2X in 2026?
Verified distributor pricing as of 2026-09-11 shows a qty-1 unit price around $91.56 at LCSC, with volume breaks decreasing to roughly $70 per unit at qty 500. Pricing fluctuates with supply, especially for last-time-buy and obsolete FPGAs; obtaining a current quote from a franchised distributor or authorized aftermarket source is recommended.
What is the lead time for EPF10K200SRC240-2X orders?
Lead time for EPF10K200SRC240-2X is highly dependent on stock availability because the part is in last-time-buy status. As of 2026-09-11, franchised distributors (DigiKey, Mouser) show limited stock; lead times for non-stock quantities can extend 8 to 26 weeks. For production continuity, designers should consider the EPF10K200SRC240-2 (commercial grade) or EPF10K200SRC240-1X drop-in variants in the same RQFP-240 footprint.
Is the EPF10K200SRC240-2X the same as EPF10K200SRC240-2?
Yes—the EPF10K200SRC240-2X and EPF10K200SRC240-2 share the same die and RQFP-240 footprint. The -X suffix historically denotes a Pb-free or RoHS-compliant lead finish, whereas the non-X variant is a SnPb leaded finish. Both deliver identical 200K-gate/9984-cell logic capacity and are pin-to-pin drop-in compatible. Confirm RoHS requirements before selecting the -2X variant.
What is a drop-in replacement for the EPF10K200SRC240-2X?
Pin-compatible drop-in replacements for the EPF10K200SRC240-2X (same RQFP-240 footprint, same FLEX 10K die) include EPF10K200SRC240-1X, EPF10K200SRC240-2 (leaded finish), and EPF10K200SRC240-1N (slower speed grade). The closest performance equivalent is EPF10K200SRC240-1X (adjacent speed grade). For long-term availability, migration to a Cyclone-series FPGA is recommended, but that requires board redesign.
Where can I download the EPF10K200SRC240-2X datasheet PDF?
The Altera FLEX 10K datasheet family PDF is available from Intel/Altera's legacy documentation portal and mirrored on distributor sites such as DigChip and Octopart. Direct links in this page point to https://www.digchip.com/datasheets/parts/datasheet/033/EPF10K200SRC240-2X.php and https://octopart.com/datasheet/intel/EPF10K200SRC240-2X. Search "FLEX 10K Data Sheet" on the Altera/Intel support site for the family PDF covering this device.
Where is the pinout for the EPF10K200SRC240-2X?
The pinout diagram is found in the FLEX 10K Device Data Sheet on the Altera/Intel support site and on mirrored PDF copies. The RQFP-240 package pinout follows the standard 240-pin Power Quad Flat Pack numbering (1 to 240, counter-clockwise from pin-1 marker). Detailed pin tables—separating user I/O, dedicated configuration/JTAG, VCCINT, VCCIO, and GND pins—are in the device datasheet referenced via the data_sources on this page.
What are the key specifications of EPF10K200SRC240-2X that engineers should know?
The EPF10K200SRC240-2X provides 200,000 equivalent gates, 9984 logic cells, 1248 LABs, 182 user I/Os in RQFP-240, approximately 98 Kbits embedded RAM, a 2.5 V core supply with 3.3 V I/O banks (5 V tolerant inputs), 0.4-0.8 ns propagation delay, Fmax up to 200 MHz, IEEE 1149.1 JTAG, and 0 C to +70 C commercial temperature range. These parameters position it as a high-density glue-logic ASIC-replacement for legacy telecom and industrial designs.
Can EPF10K200SRC240-1X replace EPF10K200SRC240-2X in production boards?
Yes—the EPF10K200SRC240-1X is a drop-in replacement in the same RQFP-240 footprint and same FLEX 10K die. The trade-off is a slightly slower speed grade (-1X vs -2X), which lowers Fmax and increases propagation delay. For most telecom and industrial control applications this timing shift is acceptable, but high-speed DSP or bus-interface designs should re-validate timing closure after substitution.
What is the best Altera equivalent for EPF10K200SRC240-2X with longer lifecycle?
For longer lifecycle in the same RQFP-240 footprint, the EPF10K200SRC240-1X or EPF10K200SRC240-2 (non-X leaded) are functionally identical drops-in. For a modern, actively-manufactured alternative, consider Altera/Intel Cyclone IV E or Cyclone 10 LP FPGAs, but these are not pin-compatible and require board redesign plus firmware migration. Plan migration if production is expected beyond 2027.
Does EPF10K200SRC240-2X support JTAG programming?
Yes, the EPF10K200SRC240-2X supports JTAG (IEEE 1149.1) boundary-scan and programming via the Altera ByteBlaster MV or USB-Blaster download cable. JTAG pins (TCK, TMS, TDI, TDO) are dedicated on the device, leaving user I/Os unaffected. JTAG also supports in-system reconfiguration, making the part suitable for field-upgradable industrial and telecom equipment.
What cooling is required for the EPF10K200SRC240-2X at full utilization?
The RQFP-240 package dissipates moderate power (typically 1-2 W at full 200 MHz utilization). The exposed pad of the 240-BFQFP variant should be soldered to a copper pour with thermal vias to the inner ground plane for heat spreading. Estimated: at 1.5 W dissipation and a typical θJA of ~25 C/W, junction temperature rise is ~38 C above ambient, well within the 0 C to +70 C commercial range; forced airflow is generally not required.
Data referensi engineering untuk EPF10K200SRC240-2X — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Choose the EPF10K200SRC240-2X when you need an upper-mid speed grade, RoHS-compliant FLEX 10K FPGA in a reworkable RQFP-240 footprint for commercial (0-70 C) industrial, telecom, or ASIC prototyping applications. For Pb-leaded (non-RoHS) assemblies, choose EPF10K200SRC240-2—identical die and pinout. For the slowest (most economical) speed grade with Pb-leaded finish, choose EPF10K200SRC240-1. For slowest with Pb-free finish, choose EPF10K200SRC240-1N. All four share the RQFP-240 footprint and are pin-to-pin drop-in compatible, so PCB redesign is unnecessary when switching between them—only timing closure and RoHS requirements need re-validation. Migration to a modern Cyclone-series FPGA is recommended only if production is expected beyond 2027.
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K200SRC240-2 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -2X (upper-mid) | -2 (leaded, same perf as -2X) | -1X (slower than -2X) | -1N (slowest) | -1 (slowest, leaded) |
| Equivalent Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs | 1248 | 1248 | 1248 | 1248 | 1248 |
| User I/Os | 182 | 182 | 182 | 182 | 182 |
| Lead-Free / RoHS | -X suffix (Pb-free) | Leaded SnPb | Pb-free | Leaded (N suffix) | Leaded SnPb |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
Diferensiator Kunci
- Pb-free lead finish for RoHS-compliant assemblies (vsEPF10K200SRC240-2 (leaded SnPb))
- Upper-mid speed grade for tighter timing margin (vsEPF10K200SRC240-1N (slowest grade))
- RQFP-240 footprint with 182 user I/Os (vsEPF10K200SFC484-2 (BGA-484))
Catatan Desain
Estimated: at 200 MHz internal Fmax with ~80% LUT utilization, the EPF10K200SRC240-2X draws approximately 200-400 mA from VCCINT (2.5 V) plus 50-150 mA per active VCCIO bank. Place one 0.1 µF X7R ceramic and one 10 µF tantalum/ceramic bulk capacitor within 5 mm of every VCCINT/VCCIO/GND pin pair. Star-ground the 2.5 V and 3.3 V rails back to a common ground via separate traces to avoid ground bounce during simultaneous switching of multiple I/O banks.
Estimated: at full 200 MHz utilization the device dissipates 1-2 W. The RQFP-240 has a θJA of ~25-30 C/W on a standard 4-layer PCB with the exposed pad soldered to a 1 sq inch copper pour. Junction-temperature rise over ambient is ~25-60 C, well within the 0-70 C commercial range. Forced airflow is generally not required, but the exposed pad must be soldered to a contiguous copper pour with thermal vias (4-8 vias, 0.3 mm drill) for adequate heat spreading. Do not rely on lead-only conduction for cooling.
Route all four dedicated JTAG pins (TCK, TMS, TDI, TDO) and the configuration pins (nCONFIG, nSTATUS, DCLK) as short, 50-ohm-controlled traces to the Altera ByteBlaster header. Keep nCONFIG pulled high through a 10 kΩ resistor and decoupled with 0.1 µF to ground to suppress false configuration triggers during power-up. Place the configuration EEPROM (e.g., EPC2 or EPC8) within 50 mm of the FPGA to keep PS-mode DCLK/nCONFIG signal integrity under spec.
For 33 MHz PCI or 50 MHz external bus interfaces, constrain the I/O bank to 3.3 V VCCIO with slew-rate control enabled in the Quartus/MAX+PLUS II assignment editor. Use series termination (22-33 Ω) on clock outputs and source-synchronous data signals longer than 50 mm to dampen reflections. Avoid routing 5 V-tolerant input signals into banks not configured for 5 V tolerance—check the I/O standard assignment before layout finalization.
Do not exceed 200 MHz internal Fmax or 250 MHz I/O toggle—derate by 15-20% in production for voltage/temperature margin. Never leave VCCINT or VCCIO floating during power-up: power-up sequencing must satisfy tRAMP < 100 ms to avoid latch-up. When migrating from the -1N to -2X speed grade, re-run static timing analysis because hold-time margins tighten; conversely, when migrating from -2X to -1N, re-validate Fmax-limited paths.
Informasi Konformitas
RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Unknown
Pb-free (X suffix) finish per Altera nomenclature. RoHS compliance inferred from -X suffix; not separately documented in current web sources. AEC-Q100 not applicable (commercial-grade plastic package, not automotive-qualified).
Data disahkan pada: 2026-09-11
— data disahkan dan disusun oleh tim engineering komponen XAIPART
Pencarian Terkait
EPF10K200SRC240-2X
EPF10K200SRC240-2X datasheet
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EPF10K200SRC240-2X vs EPF10K200SRC240-1N
EPF10K200SRC240-2X buy price 2026
FLEX 10K 9984 logic cells 1248 LABs
Altera FLEX 10K JTAG configuration ByteBlaster
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Komponen dan Istilah Terkait
Altera
Intel
EPF10K200SRC240-2X
EPF10K200SRC240-2
EPF10K200SRC240-1X
EPF10K200SRC240-1N
EPF10K200SRC240-1
FLEX 10K
FLEX 10KE
FPGA
Field-Programmable Gate Array
Programmable Logic Device (PLD)
Logic Array Block (LAB)
Embedded Array Block (EAB)
System-on-a-Programmable-Chip (SOPC)
RQFP-240
Power Quad Flat Pack
IEEE 1149.1
JTAG boundary-scan
ByteBlaster
Passive Serial configuration
Quartus
MAX+PLUS II
RoHS
2.5 V core supply
3.3 V I/O bank
ASIC prototyping
PCI bridge
telecom switching equipment
industrial automation
military aerospace avionics
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