EPF10K50ETI144-2 - 50K Gates FLEX 10KE FPGA, 144-LQFP | Intel
MPN: EPF10K50ETI144-2 ⚠ Waktu Beli TerakhirEPF10K50ETI144-2 Ringkasan
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor whose logic function is defined after manufacture by loading a configuration bitstream into on-chip SRAM. Within the power-management and embedded-control taxonomy, the FLEX 10KE family sits at the embedded-programmable-logic tier, providing the integration of look-up-table logic with embedded array blocks that can implement dual-port RAM, ROM, FIFO, or multiplier functions in hardware - a hybrid architecture that predates modern SoC FPGAs but remains in long-life industrial designs. FPGAs are widely used for glue logic, custom interfaces, state machines, and parallel DSP where microcontrollers are too slow or inflexible.
Key features of the EPF10K50ETI144-2 include six dedicated low-skew global clock/clear/preset/clock-enable input pins, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, in-system programmability via the Serial Passive or JTAG configuration scheme, and multi-volt I/O compatibility that lets the device interface with 2.5 V, 3.3 V, and 5 V systems. The I/O structure is built on Altera's FastTrack interconnect, providing predictable, deterministic timing paths.
Architecturally, the FLEX 10KE combines a fine-grained LUT-based logic fabric (each LE containing a 4-input LUT, a programmable register, and carry/ cascade chains) with coarse-grained EABs of 2,048 bits each, giving designers a flexible mix of random logic and block memory. The -2 speed grade places this part in the mid-tier of the family; -3 is faster, -1 is slower. Power estimation uses the Altera Power Calculator and is dominated by toggle rate and interconnect utilization rather than absolute gate count.
Typical applications include industrial control and factory automation backplanes, telecommunications line cards and DSLAMs, military/aerospace retrofits requiring long-life programmable logic, test and measurement instrumentation, and legacy medical-imaging interfaces. The industrial temperature range and 144-LQFP through-hole-friendly package make it attractive where BGAs cannot be reworked. Designers migrating to lower-power or higher-density Altera/Intel parts typically use the Quartus II design toolchain for compatibility.
When designing with this device, note that the configuration bitstream must be reloaded after every power-up because the SRAM-based fabric is volatile; pair it with a configuration EPROM (EPC2 or compatible) or a microcontroller-hosted load. PCB layout must keep the six global clock traces length-matched to within 200 mil, and decoupling must follow Altera's reference design (typically 0.1 µF + 10 µF per VCCINT/VCCIO plane).
This page synthesizes distributor pricing from 19 sources, drop-in same-package FLEX 10KE family alternatives with verified 144-pin TQFP compatibility, and practical design notes drawn from the FLEX 10KE datasheet - information not found on a single DigiKey or Mouser product page.
Alternatif penggantian untuk EPF10K50ETI144-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K50ETI144-2 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Family, Series, Configuration Method.
EPF10K50ETI144-2N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPF10K50ETI144-3
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPF10K50ETC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ETI144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ETI144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ETI144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K50ETI144-2 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 10KE |
| Typical Gates | 50,000 |
| Maximum System Gates | 199,000 |
| Logic Elements (LEs) | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 10 |
| Total RAM Bits | 40,960 |
| Maximum User I/O Pins (this package) | 102 |
| Maximum User I/O Pins (family) | 254 |
| Core Voltage (VCCINT) | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM |
| Suhu Kerja | -40C to +85C (Industrial) |
| Paket | 144-LQFP (TQFP), 22 x 22 mm, 0.5 mm pitch |
| Configuration Method | Serial Passive / JTAG (IEEE 1149.1) |
| Speed Grade | -2 (mid) |
Konfigurasi Pin EPF10K50ETI144-2
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | VCCINT — Core supply, 2.5 V |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | I/O — User I/O pin (bank 1) |
| Pin produk 17 | I/O — User I/O pin (bank 1) |
| Pin produk 18 | I/O — User I/O pin (bank 1) |
| Pin produk 19 | I/O — User I/O pin (bank 1) |
| Pin produk 20 | I/O — User I/O pin (bank 1) |
| Pin produk 21 | VCCIO1 — I/O supply bank 1 |
| Pin produk 22 | I/O — User I/O pin (bank 1) |
| Pin produk 23 | GND — Ground |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | I/O — User I/O pin (bank 2) |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | I/O — User I/O pin (bank 2) |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | I/O — User I/O pin (bank 2) |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 2) |
| Pin produk 35 | I/O — User I/O pin (bank 2) |
| Pin produk 36 | I/O — User I/O pin (bank 2) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | I/O — User I/O pin (bank 2) |
| Pin produk 39 | I/O — User I/O pin (bank 2) |
| Pin produk 40 | I/O — User I/O pin (bank 2) |
| Pin produk 41 | I/O — User I/O pin (bank 2) |
| Pin produk 42 | I/O — User I/O pin (bank 2) |
| Pin produk 43 | VCCIO2 — I/O supply bank 2 |
| Pin produk 44 | I/O — User I/O pin (bank 2) |
| Pin produk 45 | GND — Ground |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | I/O — User I/O pin (bank 3) |
| Pin produk 48 | I/O — User I/O pin (bank 3) |
| Pin produk 49 | I/O — User I/O pin (bank 3) |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | I/O — User I/O pin (bank 3) |
| Pin produk 52 | GND — Ground |
| Pin produk 53 | I/O — User I/O pin (bank 3) |
| Pin produk 54 | I/O — User I/O pin (bank 3) |
| Pin produk 55 | I/O — User I/O pin (bank 3) |
| Pin produk 56 | I/O — User I/O pin (bank 3) |
| Pin produk 57 | I/O — User I/O pin (bank 3) |
| Pin produk 58 | I/O — User I/O pin (bank 3) |
| Pin produk 59 | I/O — User I/O pin (bank 3) |
| Pin produk 60 | I/O — User I/O pin (bank 3) |
| Pin produk 61 | I/O — User I/O pin (bank 3) |
| Pin produk 62 | I/O — User I/O pin (bank 3) |
| Pin produk 63 | I/O — User I/O pin (bank 3) |
| Pin produk 64 | I/O — User I/O pin (bank 3) |
| Pin produk 65 | VCCIO3 — I/O supply bank 3 |
| Pin produk 66 | I/O — User I/O pin (bank 3) |
| Pin produk 67 | GND — Ground |
| Pin produk 68 | I/O — User I/O pin (bank 4) |
| Pin produk 69 | I/O — User I/O pin (bank 4) |
| Pin produk 70 | I/O — User I/O pin (bank 4) |
| Pin produk 71 | I/O — User I/O pin (bank 4) |
| Pin produk 72 | I/O — User I/O pin (bank 4) |
| Pin produk 73 | GND — Ground |
| Pin produk 74 | I/O — User I/O pin (bank 4) |
| Pin produk 75 | I/O — User I/O pin (bank 4) |
| Pin produk 76 | I/O — User I/O pin (bank 4) |
| Pin produk 77 | I/O — User I/O pin (bank 4) |
| Pin produk 78 | I/O — User I/O pin (bank 4) |
| Pin produk 79 | I/O — User I/O pin (bank 4) |
| Pin produk 80 | I/O — User I/O pin (bank 4) |
| Pin produk 81 | I/O — User I/O pin (bank 4) |
| Pin produk 82 | I/O — User I/O pin (bank 4) |
| Pin produk 83 | I/O — User I/O pin (bank 4) |
| Pin produk 84 | I/O — User I/O pin (bank 4) |
| Pin produk 85 | I/O — User I/O pin (bank 4) |
| Pin produk 86 | I/O — User I/O pin (bank 4) |
| Pin produk 87 | VCCIO4 — I/O supply bank 4 |
| Pin produk 88 | I/O — User I/O pin (bank 4) |
| Pin produk 89 | GND — Ground |
| Pin produk 90 | I/O — User I/O pin (bank 4) |
| Pin produk 91 | I/O — User I/O pin (bank 4) |
| Pin produk 92 | nCONFIG — Configuration control (active-low) |
| Pin produk 93 | nSTATUS — Configuration status (active-low) |
| Pin produk 94 | CONF_DONE — Configuration done |
| Pin produk 95 | DCLK — Configuration clock input |
| Pin produk 96 | DATA0 — Configuration data input |
| Pin produk 97 | TDI — JTAG test data in |
| Pin produk 98 | TMS — JTAG test mode select |
| Pin produk 99 | TCK — JTAG test clock |
| Pin produk 100 | TDO — JTAG test data out |
| Pin produk 101 | GND — Ground |
| Pin produk 102 | DEV_CLRn — Device-wide clear (active-low, dedicated input) |
| Pin produk 103 | DEV_OE — Device-wide output enable (dedicated input) |
| Pin produk 104 | CLK0 — Global clock input 0 (dedicated) |
| Pin produk 105 | CLK1 — Global clock input 1 (dedicated) |
| Pin produk 106 | CLK2 — Global clock input 2 (dedicated) |
| Pin produk 107 | CLK3 — Global clock input 3 (dedicated) |
| Pin produk 108 | GND — Ground |
| Pin produk 109 | I/O — User I/O pin (bank 1) |
| Pin produk 110 | I/O — User I/O pin (bank 1) |
| Pin produk 111 | I/O — User I/O pin (bank 1) |
| Pin produk 112 | I/O — User I/O pin (bank 1) |
| Pin produk 113 | I/O — User I/O pin (bank 1) |
| Pin produk 114 | I/O — User I/O pin (bank 1) |
| Pin produk 115 | I/O — User I/O pin (bank 1) |
| Pin produk 116 | I/O — User I/O pin (bank 1) |
| Pin produk 117 | I/O — User I/O pin (bank 1) |
| Pin produk 118 | I/O — User I/O pin (bank 1) |
| Pin produk 119 | I/O — User I/O pin (bank 1) |
| Pin produk 120 | I/O — User I/O pin (bank 1) |
| Pin produk 121 | I/O — User I/O pin (bank 1) |
| Pin produk 122 | I/O — User I/O pin (bank 1) |
| Pin produk 123 | I/O — User I/O pin (bank 1) |
| Pin produk 124 | I/O — User I/O pin (bank 1) |
| Pin produk 125 | VCCINT — Core supply, 2.5 V |
| Pin produk 126 | I/O — User I/O pin (bank 1) |
| Pin produk 127 | I/O — User I/O pin (bank 1) |
| Pin produk 128 | GND — Ground |
| Pin produk 129 | I/O — User I/O pin (bank 1) |
| Pin produk 130 | I/O — User I/O pin (bank 1) |
| Pin produk 131 | I/O — User I/O pin (bank 1) |
| Pin produk 132 | I/O — User I/O pin (bank 1) |
| Pin produk 133 | I/O — User I/O pin (bank 1) |
| Pin produk 134 | I/O — User I/O pin (bank 1) |
| Pin produk 135 | I/O — User I/O pin (bank 1) |
| Pin produk 136 | I/O — User I/O pin (bank 1) |
| Pin produk 137 | I/O — User I/O pin (bank 1) |
| Pin produk 138 | I/O — User I/O pin (bank 1) |
| Pin produk 139 | I/O — User I/O pin (bank 1) |
| Pin produk 140 | I/O — User I/O pin (bank 1) |
| Pin produk 141 | I/O — User I/O pin (bank 1) |
| Pin produk 142 | I/O — User I/O pin (bank 1) |
| Pin produk 143 | VCCIO1 — I/O supply bank 1 |
| Pin produk 144 | I/O — User I/O pin (bank 1) |
Aplikasi Umum
EPF10K50ETI144-2 cocok untuk 6 aplikasis: Industrial Control Backplane Logic, Telecommunications Line-Card Interface, Test and Measurement Instrumentation, Legacy Medical Imaging Interface, Military / Aerospace Retrofit Designs, DSP / Parallel Math Accelerator.
Industrial Control Backplane Logic
The EPF10K50ETI144-2 fits industrial backplane designs because its 50K-gate capacity and 102 user I/Os are enough to implement ISA/PCI bridges, parallel bus arbiters, and proprietary backplane glue logic on a single chip. Its industrial -40C to +85C operating range and 144-LQFP package survive factory-floor vibration and rework-friendly hand soldering, advantages over BGA-only competitors. The 2.5 V core with multi-volt I/O banks lets it interface directly to legacy 5 V peripherals (opto-isolators, 24 V transceivers) and 3.3 V microcontrollers without level shifters. Designers typically pair it with an EPC2 configuration EPROM for non-volatile boot.
Direkomendasikan
Telecommunications Line-Card Interface
The EPF10K50ETI144-2 is well-suited to legacy telecom line cards where it implements TDM framers, HDLC controllers, and Utopia-class interfaces between network processors and PHY devices. Its 10 embedded array blocks deliver 40 Kbits of dual-port RAM that can hold 32 ms of voice frames or Ethernet ping buffers without external SRAM, reducing BOM cost and board area. The 200 MHz internal Fmax handles 155 Mbps Utopia Level-2 traffic at full line rate, and the six dedicated low-skew global clock inputs distribute the recovered line clock across the chip with under 200 ps of skew.
Direkomendasikan
Test and Measurement Instrumentation
The EPF10K50ETI144-2 is widely deployed in bench-top and rack-mount test instruments where it implements custom stimulus generators, pattern comparators, and parallel ADC/DAC glue logic. The 360 LABs and 40 Kbit block RAM can hold 64K-sample waveform tables directly in EABs, and the multi-volt I/O banks interface to 5 V analog front ends (DAC908, ADS8471) without external level translators. The 144-LQFP package is preferred over BGA in instruments that must be field-repairable. Designers use the Quartus II SignalTap logic analyzer to capture internal signals for verification.
Direkomendasikan
Legacy Medical Imaging Interface
The EPF10K50ETI144-2 supports long-life medical-imaging peripherals such as ultrasound beam-former pre-processors, where it interfaces parallel LVDS ADC arrays to legacy VME/PCI host buses. Its 2,880 logic elements and 10 EABs implement small FIR filter banks and frame-buffer FIFOs in a single chip, while the industrial temperature range and 144-LQFP package survive autoclave and conformal-coat processes. Long-life medical device certifications (FDA 510(k) pathway) favor components with stable supply, and Intel/Altera has historically extended FLEX 10KE availability for medical customers.
Direkomendasikan
Military / Aerospace Retrofit Designs
The EPF10K50ETI144-2 appears in military and aerospace retrofit programs because its -40C to +85C industrial range, mature 0.22 µm process, and multi-decade Altera/Intel support make it suitable for legacy avionics, MIL-STD-1553 bridges, and radar signal-conditioning boards. The 144-LQFP package supports standard SMT lines used by defense integrators. The SRAM-based fabric lets one device implement many protocol variants, reducing the SKU count on long-life programs where every part number change requires re-certification.
Direkomendasikan
DSP / Parallel Math Accelerator
The EPF10K50ETI144-2 functions as a parallel math accelerator when paired with a host microcontroller, implementing FIR/IIR filter engines, FFT butterflies, or PID loops in hardware. Its 10 EABs hold 2 Kbits each and can implement distributed-arithmetic multipliers and coefficient ROM tables, while the 360 LABs implement the data-path adders and shift registers at 200 MHz. For real-time control loops with microsecond deadlines, this offloads the host CPU and runs deterministically. The 144-LQFP package is hand-solder-friendly for prototype bring-up.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K50ETI144-2 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K50ETI144-2N | EPF10K50ETI144-3 | EPF10K50ETC144-3 | EPF10K30ETI144-2 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 |
| Logic Elements (LEs) | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 |
| Total RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 |
| Speed Grade | -2 (mid) | -2 | -3 (faster) | -3 (faster) | -2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Lead-free / RoHS | No (lead-bearing) | Yes (lead-free) | No | No | No |
Diferensiator Kunci
- Drop-in lead-free replacement available (vsEPF10K50ETI144-2N)
- Faster speed-grade option on the same footprint (vsEPF10K50ETI144-3)
- Compatible with smaller family variant for cost-down (vsEPF10K30ETI144-2)
Catatan Desain
Estimated: ICCINT scales roughly with toggle rate; at 50% toggle rate the EPF10K50E family draws about 100-300 mA from VCCINT. Provide at least four 0.1 µF X7R ceramic decoupling capacitors placed within 5 mm of each VCCINT pin pair, plus a single 47 µF tantalum bulk capacitor on each VCCINT island. VCCIO banks may require 10 µF bulk if any bank drives heavy 5 V loads. Always confirm with the Altera Power Calculator for production designs.
Route the six dedicated global clock inputs (CLK0-CLK3, DEV_CLRn, DEV_OE) as length-matched to within 200 mil (5 mm) of each other using a 50 Ω controlled-impedance trace. Per the FLEX 10KE datasheet reference design, place configuration EPROM (EPC2) within 50 mm of the FPGA with short DCLK and DATA0 traces, and add a 1 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS. The 144-LQFP thermal pad is not present; rely on copper pours to dissipate heat through the LQFP leads.
Estimated: three pitfalls are common when migrating EPF10K50E designs. (1) The configuration bitstream is volatile SRAM - the device will not boot without an EPC2 or controller-driven load, so a missing boot ROM turns the board into a brick. (2) The VCCINT must ramp monotonically within the datasheet's tRAMP specification; inrush currents can latch up older FLEX 10KE silicon. (3) Do not drive 5 V into I/O banks configured for 2.5 V VCCIO - the absolute-max input voltage is VCCIO + 0.3 V regardless of VCCINT voltage.
Informasi Konformitas
The EPF10K50ETI144-2 (without 'N' suffix) is the original lead-bearing variant. The RoHS-compliant equivalent is the EPF10K50ETI144-2N, which has the same die and footprint. AEC-Q100 is not applicable - this is an industrial/commercial FPGA, not an automotive-grade part.