EPF10K30ETI144-2 - 30K-Gate FLEX 10KE FPGA, 102 I/O, 144-TQFP | Intel
MPN: EPF10K30ETI144-2 ✗ Akhir HidupEPF10K30ETI144-2 Ringkasan
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and I/O cells that the designer can wire up after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> embedded-block FPGA. The FLEX 10KE family added Embedded Array Blocks (EABs) so each block can act as dual-port RAM, ROM, or a multiplier-style lookup - the 'embedded' name comes from this on-chip memory integration rather than a hard processor core.
Key features include 216 Logic Array Blocks (LABs), 102 maximum user I/O pins, an internal operating frequency up to 200 MHz, and CMOS logic family operation. The 144-pin TQFP (Thin Quad Flat Pack) surface-mount package exposes JTAG-compliant configuration and supply rails at 2.375 V to 2.625 V, and supports in-system programmability via the Altera (now Intel) Quartus / MAX+PLUS II toolchain.
The EPF10K30E architecture combines a fine-grained logic fabric with coarse-grained EABs, giving designers block-RAM density similar to early SoC integration without leaving the PLD paradigm. Pin-compatible speed/grade variants (e.g., -3, -2, -1) allow timing tuning without PCB rework, while different packages (TQFP-144, QFP-208, BGA-256, BGA-484) of the same die give I/O-count flexibility across board revisions.
Typical applications include industrial control glue logic, telecom line-card bus bridges, legacy peripheral emulation, prototyping of ASIC logic, and embedded DSP datapaths where the EABs can implement small multiply-accumulate tables. The industrial temperature grade (-40C to +85C inferred from the 'I' suffix) suits factory-floor and outdoor enclosures.
When designing, plan for I/O bank voltage compatibility, leave the JTAG chain accessible for factory programming, and pair the EPF10K30E with a configuration PROM (EPCS or EPC2) for standalone boot. Note that the FLEX 10KE family is mature/legacy - check Intel's product longevity program for current supply status before new designs.
This page synthesizes distributor pricing (as of 2026-09-11), verified FLEX 10KE family drop-in alternatives in the same 144-TQFP footprint, and practical design notes not found in the manufacturer datasheet alone.
Alternatif penggantian untuk EPF10K30ETI144-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF10K30ETI144-2 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Family, Configuration Method.
EPF10K30ETC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ETC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ATC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ATC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ATC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ATI144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF10K30ETI144-2 Rating Maksimal & Karakteristik Listrik
| Series | FLEX 10KE |
| Family | FLEX 10KE (FLEX-10KE) |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements | 1728 |
| Number of Gates (typical) | 30000 |
| Maximum User I/O | 102 |
| Tegangan Pemuat | 2.375 V to 2.625 V |
| Suhu Kerja | -40C to +85C (Industrial, 'I' suffix) |
| Tipe Mounting | Surface Mount |
| Paket / Case | 144-LQFP / 144-TQFP |
| Speed Grade | -2 |
| Logic Family | CMOS |
| Internal Frequency (max) | 200 MHz |
| Configuration Method | SRAM-based, JTAG / serial / parallel |
| Status RoHS | Compliant (per Altera/Intel product page) |
Konfigurasi Pin EPF10K30ETI144-2
| Pin produk 1 | I/O — User I/O - bank 1 (refer to datasheet pin table for exact signal) |
| Pin produk 2 | I/O — User I/O - bank 1 |
| Pin produk 3 | I/O — User I/O - bank 1 |
| Pin produk 4 | I/O — User I/O - bank 1 |
| Pin produk 5 | I/O — User I/O - bank 1 |
| Pin produk 6 | VCCIO — I/O bank 1 supply voltage |
| Pin produk 7 | I/O — User I/O - bank 1 |
| Pin produk 8 | I/O — User I/O - bank 1 |
| Pin produk 9 | I/O — User I/O - bank 1 |
| Pin produk 10 | I/O — User I/O - bank 1 |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O - bank 1 |
| Pin produk 13 | I/O — User I/O - bank 1 |
| Pin produk 14 | I/O — User I/O - bank 1 |
| Pin produk 15 | I/O — User I/O - bank 1 |
| Pin produk 16 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 17 | I/O — User I/O - bank 2 |
| Pin produk 18 | I/O — User I/O - bank 2 |
| Pin produk 19 | I/O — User I/O - bank 2 |
| Pin produk 20 | I/O — User I/O - bank 2 |
| Pin produk 21 | GND — Ground |
| Pin produk 22 | I/O — User I/O - bank 2 |
| Pin produk 23 | I/O — User I/O - bank 2 |
| Pin produk 24 | I/O — User I/O - bank 2 |
| Pin produk 25 | I/O — User I/O - bank 2 |
| Pin produk 26 | VCCIO — I/O bank 2 supply voltage |
| Pin produk 27 | I/O — User I/O - bank 2 |
| Pin produk 28 | I/O — User I/O - bank 2 |
| Pin produk 29 | I/O — User I/O - bank 2 |
| Pin produk 30 | I/O — User I/O - bank 2 |
| Pin produk 31 | I/O — User I/O - bank 2 |
| Pin produk 32 | GND — Ground |
| Pin produk 33 | I/O — User I/O - bank 2 |
| Pin produk 34 | I/O — User I/O - bank 2 |
| Pin produk 35 | I/O — User I/O - bank 2 |
| Pin produk 36 | I/O — User I/O - bank 2 |
| Pin produk 37 | I/O — User I/O - bank 3 |
| Pin produk 38 | VCCIO — I/O bank 3 supply voltage |
| Pin produk 39 | I/O — User I/O - bank 3 |
| Pin produk 40 | I/O — User I/O - bank 3 |
| Pin produk 41 | I/O — User I/O - bank 3 |
| Pin produk 42 | I/O — User I/O - bank 3 |
| Pin produk 43 | GND — Ground |
| Pin produk 44 | I/O — User I/O - bank 3 |
| Pin produk 45 | I/O — User I/O - bank 3 |
| Pin produk 46 | I/O — User I/O - bank 3 |
| Pin produk 47 | I/O — User I/O - bank 3 |
| Pin produk 48 | I/O — User I/O - bank 3 |
| Pin produk 49 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 50 | I/O — User I/O - bank 3 |
| Pin produk 51 | I/O — User I/O - bank 3 |
| Pin produk 52 | I/O — User I/O - bank 3 |
| Pin produk 53 | I/O — User I/O - bank 3 |
| Pin produk 54 | GND — Ground |
| Pin produk 55 | I/O — User I/O - bank 4 |
| Pin produk 56 | I/O — User I/O - bank 4 |
| Pin produk 57 | I/O — User I/O - bank 4 |
| Pin produk 58 | I/O — User I/O - bank 4 |
| Pin produk 59 | VCCIO — I/O bank 4 supply voltage |
| Pin produk 60 | I/O — User I/O - bank 4 |
| Pin produk 61 | I/O — User I/O - bank 4 |
| Pin produk 62 | I/O — User I/O - bank 4 |
| Pin produk 63 | I/O — User I/O - bank 4 |
| Pin produk 64 | I/O — User I/O - bank 4 |
| Pin produk 65 | GND — Ground |
| Pin produk 66 | I/O — User I/O - bank 4 |
| Pin produk 67 | I/O — User I/O - bank 4 |
| Pin produk 68 | I/O — User I/O - bank 4 |
| Pin produk 69 | I/O — User I/O - bank 4 |
| Pin produk 70 | I/O — User I/O - bank 4 |
| Pin produk 71 | VCCIO — I/O bank 4 supply voltage |
| Pin produk 72 | I/O — User I/O - bank 5 |
| Pin produk 73 | I/O — User I/O - bank 5 |
| Pin produk 74 | GND — Ground |
| Pin produk 75 | I/O — User I/O - bank 5 |
| Pin produk 76 | I/O — User I/O - bank 5 |
| Pin produk 77 | I/O — User I/O - bank 5 |
| Pin produk 78 | I/O — User I/O - bank 5 |
| Pin produk 79 | I/O — User I/O - bank 5 |
| Pin produk 80 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 81 | I/O — User I/O - bank 5 |
| Pin produk 82 | I/O — User I/O - bank 5 |
| Pin produk 83 | I/O — User I/O - bank 5 |
| Pin produk 84 | I/O — User I/O - bank 5 |
| Pin produk 85 | GND — Ground |
| Pin produk 86 | I/O — User I/O - bank 5 |
| Pin produk 87 | I/O — User I/O - bank 6 |
| Pin produk 88 | I/O — User I/O - bank 6 |
| Pin produk 89 | VCCIO — I/O bank 6 supply voltage |
| Pin produk 90 | I/O — User I/O - bank 6 |
| Pin produk 91 | I/O — User I/O - bank 6 |
| Pin produk 92 | I/O — User I/O - bank 6 |
| Pin produk 93 | I/O — User I/O - bank 6 |
| Pin produk 94 | I/O — User I/O - bank 6 |
| Pin produk 95 | GND — Ground |
| Pin produk 96 | I/O — User I/O - bank 6 |
| Pin produk 97 | I/O — User I/O - bank 6 |
| Pin produk 98 | I/O — User I/O - bank 6 |
| Pin produk 99 | I/O — User I/O - bank 6 |
| Pin produk 100 | I/O — User I/O - bank 6 |
| Pin produk 101 | VCCIO — I/O bank 6 supply voltage |
| Pin produk 102 | I/O — User I/O - bank 7 |
| Pin produk 103 | I/O — User I/O - bank 7 |
| Pin produk 104 | GND — Ground |
| Pin produk 105 | I/O — User I/O - bank 7 |
| Pin produk 106 | I/O — User I/O - bank 7 |
| Pin produk 107 | I/O — User I/O - bank 7 |
| Pin produk 108 | I/O — User I/O - bank 7 |
| Pin produk 109 | I/O — User I/O - bank 7 |
| Pin produk 110 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 111 | I/O — User I/O - bank 7 |
| Pin produk 112 | I/O — User I/O - bank 7 |
| Pin produk 113 | I/O — User I/O - bank 7 |
| Pin produk 114 | I/O — User I/O - bank 7 |
| Pin produk 115 | GND — Ground |
| Pin produk 116 | I/O — User I/O - bank 7 |
| Pin produk 117 | I/O — User I/O - bank 8 |
| Pin produk 118 | I/O — User I/O - bank 8 |
| Pin produk 119 | VCCIO — I/O bank 8 supply voltage |
| Pin produk 120 | I/O — User I/O - bank 8 |
| Pin produk 121 | I/O — User I/O - bank 8 |
| Pin produk 122 | I/O — User I/O - bank 8 |
| Pin produk 123 | I/O — User I/O - bank 8 |
| Pin produk 124 | I/O — User I/O - bank 8 |
| Pin produk 125 | GND — Ground |
| Pin produk 126 | I/O — User I/O - bank 8 |
| Pin produk 127 | I/O — User I/O - bank 8 |
| Pin produk 128 | I/O — User I/O - bank 8 |
| Pin produk 129 | I/O — User I/O - bank 8 |
| Pin produk 130 | I/O — User I/O - bank 8 |
| Pin produk 131 | VCCIO — I/O bank 8 supply voltage |
| Pin produk 132 | I/O — User I/O - bank 8 |
| Pin produk 133 | I/O — User I/O - bank 8 |
| Pin produk 134 | MSEL0 — Configuration mode select 0 |
| Pin produk 135 | MSEL1 — Configuration mode select 1 |
| Pin produk 136 | nSTATUS — Configuration status (open drain) |
| Pin produk 137 | nCONFIG — Configuration control (active low) |
| Pin produk 138 | DCLK — Configuration clock |
| Pin produk 139 | DATA0 — Configuration data input |
| Pin produk 140 | TCK — JTAG test clock |
| Pin produk 141 | TMS — JTAG test mode select |
| Pin produk 142 | TDI — JTAG test data in |
| Pin produk 143 | TDO — JTAG test data out |
| Pin produk 144 | CONF_DONE — Configuration complete (open drain) |
Aplikasi Umum
EPF10K30ETI144-2 cocok untuk 6 aplikasis: Industrial Glue Logic / Bus Bridge, Legacy Peripheral Emulation, Telecom Line-Card Glue Logic, ASIC Prototyping and Logic Validation, Embedded DSP / Multiply-Accumulate Tables, Test & Measurement Front-End Logic.
Industrial Glue Logic / Bus Bridge
The EPF10K30ETI144-2 fits industrial glue-logic boards that bridge legacy parallel buses (ISA, PC/104, VME) to modern microprocessors. With 1,728 logic elements and 102 user I/Os, the FPGA can implement multi-master bus arbiters, address decoders, and 8/16/32-bit FIFO bridges in a single chip. The 24,576 bits of EAB RAM provide true dual-port memory for mailbox and pointer-passing between bus masters. Industrial temperature grade (-40C to +85C) ensures operation in factory-floor enclosures without derating. Quartus synthesis fits typical 32-bit bus-bridge designs well within the 30K-gate budget.
Direkomendasikan
Legacy Peripheral Emulation
Emulating discontinued peripherals (parallel-port chips, custom DMA controllers, ISA cards) is a sweet spot for the EPF10K30ETI144-2. The 200 MHz internal frequency easily handles ISA-bus timing, while 102 user I/Os are sufficient for 16-bit data plus full control-signal reproduction. EAB blocks can implement wait-state generators and protocol state machines. Designers maintain a single bitstream per peripheral, so the same PCB can emulate multiple legacy devices by re-flashing the configuration PROM - useful in aerospace and military long-lifecycle programs.
Direkomendasikan
Telecom Line-Card Glue Logic
Telecom line cards use the EPF10K30ETI144-2 for backplane glue, TDM bus arbitration, and HDLC/framer interfacing where deterministic latency matters. The FLEX 10KE fabric gives sub-10 ns pin-to-pin delays suitable for E1/T1 and 8 MHz ST-BUS clocks, while 102 I/Os cover 16-bit data plus framing and clock signals. Industrial temperature rating suits outdoor cabinet deployments. EABs implement small lookup tables for codec-law conversion (A-law/mu-law) without external ROM.
Direkomendasikan
ASIC Prototyping and Logic Validation
Before taping out an ASIC, designers validate RTL on FPGAs - the EPF10K30ETI144-2 fits small SoC blocks such as interrupt controllers, DMA engines, custom peripherals, and AMBA-AHB-to-APB bridges. 30K gates accommodate ~5-10K gate-equivalent ASIC logic with reasonable timing margin. Quartus synthesis with the FLEX 10KE library lets engineers reuse the same RTL later on Cyclone IV for production without rewriting constraints. Industrial temp grade supports in-vehicle and outdoor validation campaigns.
Direkomendasikan
Embedded DSP / Multiply-Accumulate Tables
Each FLEX 10KE EAB can be configured as a small read-only or read/write memory that mimics a multiplier lookup table - the EPF10K30ETI144-2 therefore fits low-sample-rate DSP datapaths (control loops, codec post-processing, simple FIR filters) where lookup-table-based MAC units suffice. 24,576 EAB bits hold 4K x 6-bit or 2K x 12-bit coefficient tables, and the 200 MHz fabric supports multi-MHz sample streams in industrial temperature environments.
Direkomendasikan
Test & Measurement Front-End Logic
Test equipment designers use the EPF10K30ETI144-2 for pattern generation, timing sequencers, and instrument-switching matrices. The 102 I/O count is sufficient for 32-channel digital I/O cards, and the 2.5 V core plus JTAG configuration support production-line programming via standard Altera tools. Industrial temperature grade suits bench and chamber testing. EAB RAM acts as a deep pattern buffer, and the 144-TQFP package is hand-solderable for prototype builds.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF10K30ETI144-2 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -3 (faster) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature | NRND / Mature |
Diferensiator Kunci
- Same-density silicon, multiple speed grades available (vsEPF10K30ATC144-3 (faster -3 speed grade))
- Industrial temperature grade vs commercial variants (vsEPF10K30ETC144-2 (commercial temp grade))
- Pin-to-pin compatibility with 'A' silicon revision (vsEPF10K30ATI144-2 (A-silicon industrial variant))
Catatan Desain
The EPF10K30ETI144-2 requires a stable 2.5 V core rail (2.375 V to 2.625 V) and one or more VCCIO bank supplies (typically 3.3 V for TTL/PCI-compatible I/O). Place 0.1 uF decoupling capacitors as close as possible to every VCCINT and VCCIO pin, and add bulk 10-47 uF tantalum or ceramic capacitors at each power-supply entry point. The SRAM-based configuration means inrush can reach 500 mA during configuration; size the regulator accordingly. Power sequencing - core before VCCIO, or simultaneous - is acceptable per Altera/Intel documentation.
Route the JTAG chain (TCK, TMS, TDI, TDO) with a star topology from the JTAG header to each device and keep TCK trace under 6 inches to avoid signal-integrity issues. Expose nCONFIG, nSTATUS, and CONF_DONE for in-system programming access. The 144-pin TQFP has a 0.5 mm pitch - use 0.15 mm trace/space with a 4-layer PCB and a continuous ground plane under the package. Leave 4-6 ground vias in the package thermal slug area for thermal dissipation.
Estimated: configuring the EPF10K30ETI144-2 from a fresh board without checking MSEL0/MSEL1 strap pins is the #1 first-power-on failure mode - tie them to the correct logic level for PS or JTAG mode before applying power. Second common pitfall: leaving VCCIO banks at 2.5 V while driving 3.3 V peripheral signals - this damages the I/O cells. Third: failing to series-terminate high-speed clock-distribution outputs when driving long traces; add 33 ohm series resistors at the FPGA output. Finally, choose EPCS-series serial flash only with Quartus version 7.2 or later for proper SOF-to-POF support.
Estimated: at 200 MHz internal frequency with 80% logic utilization, the EPF10K30ETI144-2 dissipates roughly 0.5-0.8 W typical, 1.5 W maximum. The 144-pin TQFP thermal resistance is approximately 35 C/W theta_JA on a 4-layer PCB with a small ground pad, so junction temperature rise above ambient is roughly 18-28 C typical, 53 C max - within industrial-grade limits. For continuous 85 C ambient operation, ensure 4-layer PCB with 2 oz copper pours on core and I/O supply planes to keep junction below 125 C.
Informasi Konformitas
RoHS and lead-free per Altera/Intel product page. Industrial temperature grade ('I' suffix) is per spec but no AEC-Q100 automotive qualification. Halogen-free status not specified in the verified web data.
