EPF10K50ETI144-2 - 50K Gates FLEX 10KE FPGA, 144-LQFP | Intel
MPN: EPF10K50ETI144-2 ⚠ Lần mua cuốiEPF10K50ETI144-2 Tóm tắt
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor whose logic function is defined after manufacture by loading a configuration bitstream into on-chip SRAM. Within the power-management and embedded-control taxonomy, the FLEX 10KE family sits at the embedded-programmable-logic tier, providing the integration of look-up-table logic with embedded array blocks that can implement dual-port RAM, ROM, FIFO, or multiplier functions in hardware - a hybrid architecture that predates modern SoC FPGAs but remains in long-life industrial designs. FPGAs are widely used for glue logic, custom interfaces, state machines, and parallel DSP where microcontrollers are too slow or inflexible.
Key features of the EPF10K50ETI144-2 include six dedicated low-skew global clock/clear/preset/clock-enable input pins, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, in-system programmability via the Serial Passive or JTAG configuration scheme, and multi-volt I/O compatibility that lets the device interface with 2.5 V, 3.3 V, and 5 V systems. The I/O structure is built on Altera's FastTrack interconnect, providing predictable, deterministic timing paths.
Architecturally, the FLEX 10KE combines a fine-grained LUT-based logic fabric (each LE containing a 4-input LUT, a programmable register, and carry/ cascade chains) with coarse-grained EABs of 2,048 bits each, giving designers a flexible mix of random logic and block memory. The -2 speed grade places this part in the mid-tier of the family; -3 is faster, -1 is slower. Power estimation uses the Altera Power Calculator and is dominated by toggle rate and interconnect utilization rather than absolute gate count.
Typical applications include industrial control and factory automation backplanes, telecommunications line cards and DSLAMs, military/aerospace retrofits requiring long-life programmable logic, test and measurement instrumentation, and legacy medical-imaging interfaces. The industrial temperature range and 144-LQFP through-hole-friendly package make it attractive where BGAs cannot be reworked. Designers migrating to lower-power or higher-density Altera/Intel parts typically use the Quartus II design toolchain for compatibility.
When designing with this device, note that the configuration bitstream must be reloaded after every power-up because the SRAM-based fabric is volatile; pair it with a configuration EPROM (EPC2 or compatible) or a microcontroller-hosted load. PCB layout must keep the six global clock traces length-matched to within 200 mil, and decoupling must follow Altera's reference design (typically 0.1 µF + 10 µF per VCCINT/VCCIO plane).
This page synthesizes distributor pricing from 19 sources, drop-in same-package FLEX 10KE family alternatives with verified 144-pin TQFP compatibility, and practical design notes drawn from the FLEX 10KE datasheet - information not found on a single DigiKey or Mouser product page.
Bộ thay thế dễ dàng lắp đặt cho EPF10K50ETI144-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K50ETI144-2 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Family, Series, Configuration Method.
EPF10K50ETI144-2N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K50ETI144-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K50ETC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETI144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETI144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K50ETI144-2 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KE |
| Typical Gates | 50,000 |
| Maximum System Gates | 199,000 |
| Logic Elements (LEs) | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 10 |
| Total RAM Bits | 40,960 |
| Maximum User I/O Pins (this package) | 102 |
| Maximum User I/O Pins (family) | 254 |
| Core Voltage (VCCINT) | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Hộp | 144-LQFP (TQFP), 22 x 22 mm, 0.5 mm pitch |
| Configuration Method | Serial Passive / JTAG (IEEE 1149.1) |
| Speed Grade | -2 (mid) |
Cấu hình chân EPF10K50ETI144-2
| Chân 1 | I/O — User I/O pin (bank 1) |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | I/O — User I/O pin (bank 1) |
| Chân 4 | I/O — User I/O pin (bank 1) |
| Chân 5 | I/O — User I/O pin (bank 1) |
| Chân 6 | I/O — User I/O pin (bank 1) |
| Chân 7 | VCCINT — Core supply, 2.5 V |
| Chân 8 | I/O — User I/O pin (bank 1) |
| Chân 9 | I/O — User I/O pin (bank 1) |
| Chân 10 | I/O — User I/O pin (bank 1) |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O pin (bank 1) |
| Chân 13 | I/O — User I/O pin (bank 1) |
| Chân 14 | I/O — User I/O pin (bank 1) |
| Chân 15 | I/O — User I/O pin (bank 1) |
| Chân 16 | I/O — User I/O pin (bank 1) |
| Chân 17 | I/O — User I/O pin (bank 1) |
| Chân 18 | I/O — User I/O pin (bank 1) |
| Chân 19 | I/O — User I/O pin (bank 1) |
| Chân 20 | I/O — User I/O pin (bank 1) |
| Chân 21 | VCCIO1 — I/O supply bank 1 |
| Chân 22 | I/O — User I/O pin (bank 1) |
| Chân 23 | GND — Ground |
| Chân 24 | I/O — User I/O pin (bank 2) |
| Chân 25 | I/O — User I/O pin (bank 2) |
| Chân 26 | I/O — User I/O pin (bank 2) |
| Chân 27 | I/O — User I/O pin (bank 2) |
| Chân 28 | I/O — User I/O pin (bank 2) |
| Chân 29 | I/O — User I/O pin (bank 2) |
| Chân 30 | I/O — User I/O pin (bank 2) |
| Chân 31 | GND — Ground |
| Chân 32 | I/O — User I/O pin (bank 2) |
| Chân 33 | I/O — User I/O pin (bank 2) |
| Chân 34 | I/O — User I/O pin (bank 2) |
| Chân 35 | I/O — User I/O pin (bank 2) |
| Chân 36 | I/O — User I/O pin (bank 2) |
| Chân 37 | I/O — User I/O pin (bank 2) |
| Chân 38 | I/O — User I/O pin (bank 2) |
| Chân 39 | I/O — User I/O pin (bank 2) |
| Chân 40 | I/O — User I/O pin (bank 2) |
| Chân 41 | I/O — User I/O pin (bank 2) |
| Chân 42 | I/O — User I/O pin (bank 2) |
| Chân 43 | VCCIO2 — I/O supply bank 2 |
| Chân 44 | I/O — User I/O pin (bank 2) |
| Chân 45 | GND — Ground |
| Chân 46 | I/O — User I/O pin (bank 3) |
| Chân 47 | I/O — User I/O pin (bank 3) |
| Chân 48 | I/O — User I/O pin (bank 3) |
| Chân 49 | I/O — User I/O pin (bank 3) |
| Chân 50 | I/O — User I/O pin (bank 3) |
| Chân 51 | I/O — User I/O pin (bank 3) |
| Chân 52 | GND — Ground |
| Chân 53 | I/O — User I/O pin (bank 3) |
| Chân 54 | I/O — User I/O pin (bank 3) |
| Chân 55 | I/O — User I/O pin (bank 3) |
| Chân 56 | I/O — User I/O pin (bank 3) |
| Chân 57 | I/O — User I/O pin (bank 3) |
| Chân 58 | I/O — User I/O pin (bank 3) |
| Chân 59 | I/O — User I/O pin (bank 3) |
| Chân 60 | I/O — User I/O pin (bank 3) |
| Chân 61 | I/O — User I/O pin (bank 3) |
| Chân 62 | I/O — User I/O pin (bank 3) |
| Chân 63 | I/O — User I/O pin (bank 3) |
| Chân 64 | I/O — User I/O pin (bank 3) |
| Chân 65 | VCCIO3 — I/O supply bank 3 |
| Chân 66 | I/O — User I/O pin (bank 3) |
| Chân 67 | GND — Ground |
| Chân 68 | I/O — User I/O pin (bank 4) |
| Chân 69 | I/O — User I/O pin (bank 4) |
| Chân 70 | I/O — User I/O pin (bank 4) |
| Chân 71 | I/O — User I/O pin (bank 4) |
| Chân 72 | I/O — User I/O pin (bank 4) |
| Chân 73 | GND — Ground |
| Chân 74 | I/O — User I/O pin (bank 4) |
| Chân 75 | I/O — User I/O pin (bank 4) |
| Chân 76 | I/O — User I/O pin (bank 4) |
| Chân 77 | I/O — User I/O pin (bank 4) |
| Chân 78 | I/O — User I/O pin (bank 4) |
| Chân 79 | I/O — User I/O pin (bank 4) |
| Chân 80 | I/O — User I/O pin (bank 4) |
| Chân 81 | I/O — User I/O pin (bank 4) |
| Chân 82 | I/O — User I/O pin (bank 4) |
| Chân 83 | I/O — User I/O pin (bank 4) |
| Chân 84 | I/O — User I/O pin (bank 4) |
| Chân 85 | I/O — User I/O pin (bank 4) |
| Chân 86 | I/O — User I/O pin (bank 4) |
| Chân 87 | VCCIO4 — I/O supply bank 4 |
| Chân 88 | I/O — User I/O pin (bank 4) |
| Chân 89 | GND — Ground |
| Chân 90 | I/O — User I/O pin (bank 4) |
| Chân 91 | I/O — User I/O pin (bank 4) |
| Chân 92 | nCONFIG — Configuration control (active-low) |
| Chân 93 | nSTATUS — Configuration status (active-low) |
| Chân 94 | CONF_DONE — Configuration done |
| Chân 95 | DCLK — Configuration clock input |
| Chân 96 | DATA0 — Configuration data input |
| Chân 97 | TDI — JTAG test data in |
| Chân 98 | TMS — JTAG test mode select |
| Chân 99 | TCK — JTAG test clock |
| Chân 100 | TDO — JTAG test data out |
| Chân 101 | GND — Ground |
| Chân 102 | DEV_CLRn — Device-wide clear (active-low, dedicated input) |
| Chân 103 | DEV_OE — Device-wide output enable (dedicated input) |
| Chân 104 | CLK0 — Global clock input 0 (dedicated) |
| Chân 105 | CLK1 — Global clock input 1 (dedicated) |
| Chân 106 | CLK2 — Global clock input 2 (dedicated) |
| Chân 107 | CLK3 — Global clock input 3 (dedicated) |
| Chân 108 | GND — Ground |
| Chân 109 | I/O — User I/O pin (bank 1) |
| Chân 110 | I/O — User I/O pin (bank 1) |
| Chân 111 | I/O — User I/O pin (bank 1) |
| Chân 112 | I/O — User I/O pin (bank 1) |
| Chân 113 | I/O — User I/O pin (bank 1) |
| Chân 114 | I/O — User I/O pin (bank 1) |
| Chân 115 | I/O — User I/O pin (bank 1) |
| Chân 116 | I/O — User I/O pin (bank 1) |
| Chân 117 | I/O — User I/O pin (bank 1) |
| Chân 118 | I/O — User I/O pin (bank 1) |
| Chân 119 | I/O — User I/O pin (bank 1) |
| Chân 120 | I/O — User I/O pin (bank 1) |
| Chân 121 | I/O — User I/O pin (bank 1) |
| Chân 122 | I/O — User I/O pin (bank 1) |
| Chân 123 | I/O — User I/O pin (bank 1) |
| Chân 124 | I/O — User I/O pin (bank 1) |
| Chân 125 | VCCINT — Core supply, 2.5 V |
| Chân 126 | I/O — User I/O pin (bank 1) |
| Chân 127 | I/O — User I/O pin (bank 1) |
| Chân 128 | GND — Ground |
| Chân 129 | I/O — User I/O pin (bank 1) |
| Chân 130 | I/O — User I/O pin (bank 1) |
| Chân 131 | I/O — User I/O pin (bank 1) |
| Chân 132 | I/O — User I/O pin (bank 1) |
| Chân 133 | I/O — User I/O pin (bank 1) |
| Chân 134 | I/O — User I/O pin (bank 1) |
| Chân 135 | I/O — User I/O pin (bank 1) |
| Chân 136 | I/O — User I/O pin (bank 1) |
| Chân 137 | I/O — User I/O pin (bank 1) |
| Chân 138 | I/O — User I/O pin (bank 1) |
| Chân 139 | I/O — User I/O pin (bank 1) |
| Chân 140 | I/O — User I/O pin (bank 1) |
| Chân 141 | I/O — User I/O pin (bank 1) |
| Chân 142 | I/O — User I/O pin (bank 1) |
| Chân 143 | VCCIO1 — I/O supply bank 1 |
| Chân 144 | I/O — User I/O pin (bank 1) |
Ứng dụng tiêu biểu
EPF10K50ETI144-2 phù hợp cho 6 Áp dụngs: Industrial Control Backplane Logic, Telecommunications Line-Card Interface, Test and Measurement Instrumentation, Legacy Medical Imaging Interface, Military / Aerospace Retrofit Designs, DSP / Parallel Math Accelerator.
Industrial Control Backplane Logic
The EPF10K50ETI144-2 fits industrial backplane designs because its 50K-gate capacity and 102 user I/Os are enough to implement ISA/PCI bridges, parallel bus arbiters, and proprietary backplane glue logic on a single chip. Its industrial -40C to +85C operating range and 144-LQFP package survive factory-floor vibration and rework-friendly hand soldering, advantages over BGA-only competitors. The 2.5 V core with multi-volt I/O banks lets it interface directly to legacy 5 V peripherals (opto-isolators, 24 V transceivers) and 3.3 V microcontrollers without level shifters. Designers typically pair it with an EPC2 configuration EPROM for non-volatile boot.
Được đề xuất
Telecommunications Line-Card Interface
The EPF10K50ETI144-2 is well-suited to legacy telecom line cards where it implements TDM framers, HDLC controllers, and Utopia-class interfaces between network processors and PHY devices. Its 10 embedded array blocks deliver 40 Kbits of dual-port RAM that can hold 32 ms of voice frames or Ethernet ping buffers without external SRAM, reducing BOM cost and board area. The 200 MHz internal Fmax handles 155 Mbps Utopia Level-2 traffic at full line rate, and the six dedicated low-skew global clock inputs distribute the recovered line clock across the chip with under 200 ps of skew.
Được đề xuất
Test and Measurement Instrumentation
The EPF10K50ETI144-2 is widely deployed in bench-top and rack-mount test instruments where it implements custom stimulus generators, pattern comparators, and parallel ADC/DAC glue logic. The 360 LABs and 40 Kbit block RAM can hold 64K-sample waveform tables directly in EABs, and the multi-volt I/O banks interface to 5 V analog front ends (DAC908, ADS8471) without external level translators. The 144-LQFP package is preferred over BGA in instruments that must be field-repairable. Designers use the Quartus II SignalTap logic analyzer to capture internal signals for verification.
Được đề xuất
Legacy Medical Imaging Interface
The EPF10K50ETI144-2 supports long-life medical-imaging peripherals such as ultrasound beam-former pre-processors, where it interfaces parallel LVDS ADC arrays to legacy VME/PCI host buses. Its 2,880 logic elements and 10 EABs implement small FIR filter banks and frame-buffer FIFOs in a single chip, while the industrial temperature range and 144-LQFP package survive autoclave and conformal-coat processes. Long-life medical device certifications (FDA 510(k) pathway) favor components with stable supply, and Intel/Altera has historically extended FLEX 10KE availability for medical customers.
Được đề xuất
Military / Aerospace Retrofit Designs
The EPF10K50ETI144-2 appears in military and aerospace retrofit programs because its -40C to +85C industrial range, mature 0.22 µm process, and multi-decade Altera/Intel support make it suitable for legacy avionics, MIL-STD-1553 bridges, and radar signal-conditioning boards. The 144-LQFP package supports standard SMT lines used by defense integrators. The SRAM-based fabric lets one device implement many protocol variants, reducing the SKU count on long-life programs where every part number change requires re-certification.
Được đề xuất
DSP / Parallel Math Accelerator
The EPF10K50ETI144-2 functions as a parallel math accelerator when paired with a host microcontroller, implementing FIR/IIR filter engines, FFT butterflies, or PID loops in hardware. Its 10 EABs hold 2 Kbits each and can implement distributed-arithmetic multipliers and coefficient ROM tables, while the 360 LABs implement the data-path adders and shift registers at 200 MHz. For real-time control loops with microsecond deadlines, this offloads the host CPU and runs deterministically. The 144-LQFP package is hand-solder-friendly for prototype bring-up.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K50ETI144-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K50ETI144-2N | EPF10K50ETI144-3 | EPF10K50ETC144-3 | EPF10K30ETI144-2 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 |
| Logic Elements (LEs) | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 |
| Total RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 |
| Speed Grade | -2 (mid) | -2 | -3 (faster) | -3 (faster) | -2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Lead-free / RoHS | No (lead-bearing) | Yes (lead-free) | No | No | No |
Bảo phân biệt quan trọng
- Drop-in lead-free replacement available (vsEPF10K50ETI144-2N)
- Faster speed-grade option on the same footprint (vsEPF10K50ETI144-3)
- Compatible with smaller family variant for cost-down (vsEPF10K30ETI144-2)
Ghi chú thiết kế
Estimated: ICCINT scales roughly with toggle rate; at 50% toggle rate the EPF10K50E family draws about 100-300 mA from VCCINT. Provide at least four 0.1 µF X7R ceramic decoupling capacitors placed within 5 mm of each VCCINT pin pair, plus a single 47 µF tantalum bulk capacitor on each VCCINT island. VCCIO banks may require 10 µF bulk if any bank drives heavy 5 V loads. Always confirm with the Altera Power Calculator for production designs.
Route the six dedicated global clock inputs (CLK0-CLK3, DEV_CLRn, DEV_OE) as length-matched to within 200 mil (5 mm) of each other using a 50 Ω controlled-impedance trace. Per the FLEX 10KE datasheet reference design, place configuration EPROM (EPC2) within 50 mm of the FPGA with short DCLK and DATA0 traces, and add a 1 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS. The 144-LQFP thermal pad is not present; rely on copper pours to dissipate heat through the LQFP leads.
Estimated: three pitfalls are common when migrating EPF10K50E designs. (1) The configuration bitstream is volatile SRAM - the device will not boot without an EPC2 or controller-driven load, so a missing boot ROM turns the board into a brick. (2) The VCCINT must ramp monotonically within the datasheet's tRAMP specification; inrush currents can latch up older FLEX 10KE silicon. (3) Do not drive 5 V into I/O banks configured for 2.5 V VCCIO - the absolute-max input voltage is VCCIO + 0.3 V regardless of VCCINT voltage.
Thông tin tuân thủ
The EPF10K50ETI144-2 (without 'N' suffix) is the original lead-bearing variant. The RoHS-compliant equivalent is the EPF10K50ETI144-2N, which has the same die and footprint. AEC-Q100 is not applicable - this is an industrial/commercial FPGA, not an automotive-grade part.