EPF6016TC144-2N - FLEX 6000 16K-Gate FPGA, 1320 Cells, 144-TQFP | Intel / Altera
MPN: EPF6016TC144-2N ⚠ Waktu Beli TerakhirEPF6016TC144-2N Ringkasan
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement arbitrary digital logic through software-defined bitstream programming. Within the broader semiconductor taxonomy, the EPF6016TC144-2N sits in the programmable logic family, between simple SPLDs/CPLDs and high-density FPGAs, targeting glue-logic and bus-interface applications. The FLEX 6000 family is built on a 0.42 µm CMOS SRAM process, requiring external configuration memory (typically an EPC2 or EPC16 configuration device) to load the bitstream at power-up.
Key features of the EPF6016TC144-2N include a maximum internal toggle frequency of 125 MHz, a 5 V (4.75 V to 5.25 V) single-supply operation, 5 mA quiescent supply current, an operating temperature range of 0 °C to 85 °C (commercial grade), and True-LVDS/LVTTL/MultiVolt I/O support. The device is RoHS compliant and supports in-system programmability via the JTAG (IEEE 1149.1) boundary-scan interface, enabling rapid prototyping and field upgrades.
Architecturally, each LAB contains 10 Logic Elements (LEs), each LE comprising a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic functions. The 117 user I/Os are arranged around the package perimeter with FastTrack interconnect providing predictable routing delay. The -2N speed grade identifies a specific timing bin within the FLEX 6000 family, sitting between the -3 (slower) and -1 (fastest) grades.
Typical applications include peripheral bus interfacing (PCI, ISA, VME), glue-logic integration, custom state-machine controllers, communication channelizers, and industrial control subsystems. The device is widely used in legacy telecom line-card designs and is supported by the classic Altera MAX+PLUS II and Quartus design flows for backwards compatibility.
When designing with the EPF6016TC144-2N, ensure that the configuration scheme (PS, AS, or JTAG) is chosen early in the design cycle, and that the 5 V supply is well decoupled with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin. The I/O banks can be configured independently, but 5 V tolerance requires the PCI-compliant I/O standard on the relevant banks.
This page synthesizes distributor inventory, drop-in TQFP-144 alternatives, and practical design notes not consolidated on any single manufacturer page.
Alternatif penggantian untuk EPF6016TC144-2N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF6016TC144-2N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.
EPF6016TC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016TC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6010ATC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016TC144-2N Rating Maksimal & Karakteristik Listrik
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-based, SRAM LUT) |
| Typical Gates | 16,000 |
| Logic Elements / Cells | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| Logic Elements per LAB | 10 |
| Maximum Internal Frequency | 125 MHz |
| User I/Os | 117 |
| Supply Voltage (VCC) | 4.75 V to 5.25 V (5 V nominal) |
| Quiescent Supply Current | 5 mA |
| Process Technology | 0.42 µm CMOS |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16 |
| Paket | TQFP-144 (144-pin Thin Quad Flat Pack) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0 °C to 85 °C (commercial) |
| Speed Grade | -2 (mid-range) |
| Status RoHS | Compliant |
Konfigurasi Pin EPF6016TC144-2N
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | VCCINT — Core supply 5 V |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | VCCIO1 — I/O bank 1 supply 5 V |
| Pin produk 17 | I/O — User I/O pin (bank 1) |
| Pin produk 18 | I/O — User I/O pin (bank 1) |
| Pin produk 19 | I/O — User I/O pin (bank 1) |
| Pin produk 20 | I/O — User I/O pin (bank 1) |
| Pin produk 21 | GND — Ground |
| Pin produk 22 | I/O — User I/O pin (bank 1) |
| Pin produk 23 | I/O — User I/O pin (bank 1) |
| Pin produk 24 | I/O — User I/O pin (bank 1) |
| Pin produk 25 | I/O — User I/O pin (bank 1) |
| Pin produk 26 | I/O — User I/O pin (bank 1) |
| Pin produk 27 | I/O — User I/O pin (bank 1) |
| Pin produk 28 | I/O — User I/O pin (bank 1) |
| Pin produk 29 | VCCINT — Core supply 5 V |
| Pin produk 30 | I/O — User I/O pin (bank 1) |
| Pin produk 31 | I/O — User I/O pin (bank 1) |
| Pin produk 32 | I/O — User I/O pin (bank 1) |
| Pin produk 33 | I/O — User I/O pin (bank 1) |
| Pin produk 34 | I/O — User I/O pin (bank 1) |
| Pin produk 35 | GND — Ground |
| Pin produk 36 | I/O — User I/O pin (bank 1) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | VCCIO2 — I/O bank 2 supply 5 V |
| Pin produk 39 | I/O — User I/O pin (bank 2) |
| Pin produk 40 | I/O — User I/O pin (bank 2) |
| Pin produk 41 | I/O — User I/O pin (bank 2) |
| Pin produk 42 | I/O — User I/O pin (bank 2) |
| Pin produk 43 | I/O — User I/O pin (bank 2) |
| Pin produk 44 | VCCINT — Core supply 5 V |
| Pin produk 45 | I/O — User I/O pin (bank 2) |
| Pin produk 46 | I/O — User I/O pin (bank 2) |
| Pin produk 47 | GND — Ground |
| Pin produk 48 | I/O — User I/O pin (bank 2) |
| Pin produk 49 | I/O — User I/O pin (bank 2) |
| Pin produk 50 | I/O — User I/O pin (bank 2) |
| Pin produk 51 | I/O — User I/O pin (bank 2) |
| Pin produk 52 | I/O — User I/O pin (bank 2) |
| Pin produk 53 | I/O — User I/O pin (bank 2) |
| Pin produk 54 | VCCIO2 — I/O bank 2 supply 5 V |
| Pin produk 55 | I/O — User I/O pin (bank 2) |
| Pin produk 56 | I/O — User I/O pin (bank 2) |
| Pin produk 57 | I/O — User I/O pin (bank 2) |
| Pin produk 58 | I/O — User I/O pin (bank 2) |
| Pin produk 59 | GND — Ground |
| Pin produk 60 | I/O — User I/O pin (bank 2) |
| Pin produk 61 | I/O — User I/O pin (bank 2) |
| Pin produk 62 | I/O — User I/O pin (bank 2) |
| Pin produk 63 | VCCINT — Core supply 5 V |
| Pin produk 64 | I/O — User I/O pin (bank 2) |
| Pin produk 65 | I/O — User I/O pin (bank 2) |
| Pin produk 66 | I/O — User I/O pin (bank 2) |
| Pin produk 67 | I/O — User I/O pin (bank 2) |
| Pin produk 68 | I/O — User I/O pin (bank 2) |
| Pin produk 69 | I/O — User I/O pin (bank 2) |
| Pin produk 70 | GND — Ground |
| Pin produk 71 | I/O — User I/O pin (bank 2) |
| Pin produk 72 | I/O — User I/O pin (bank 2) |
| Pin produk 73 | VCCIO2 — I/O bank 2 supply 5 V |
| Pin produk 74 | nCONFIG — Configuration control (active low) |
| Pin produk 75 | nSTATUS — Configuration status (active low) |
| Pin produk 76 | CONF_DONE — Configuration done indicator |
| Pin produk 77 | TCK — JTAG test clock |
| Pin produk 78 | TMS — JTAG test mode select |
| Pin produk 79 | TDI — JTAG test data in |
| Pin produk 80 | TDO — JTAG test data out |
| Pin produk 81 | MSEL0 — Configuration mode select 0 |
| Pin produk 82 | MSEL1 — Configuration mode select 1 |
| Pin produk 83 | DCLK — Configuration clock |
| Pin produk 84 | DATA0 — Configuration data input |
| Pin produk 85 | GND — Ground |
| Pin produk 86 | VCCINT — Core supply 5 V |
| Pin produk 87 | I/O — User I/O pin (bank 3) |
| Pin produk 88 | I/O — User I/O pin (bank 3) |
| Pin produk 89 | I/O — User I/O pin (bank 3) |
| Pin produk 90 | I/O — User I/O pin (bank 3) |
| Pin produk 91 | I/O — User I/O pin (bank 3) |
| Pin produk 92 | I/O — User I/O pin (bank 3) |
| Pin produk 93 | VCCIO3 — I/O bank 3 supply 5 V |
| Pin produk 94 | I/O — User I/O pin (bank 3) |
| Pin produk 95 | I/O — User I/O pin (bank 3) |
| Pin produk 96 | I/O — User I/O pin (bank 3) |
| Pin produk 97 | GND — Ground |
| Pin produk 98 | I/O — User I/O pin (bank 3) |
| Pin produk 99 | I/O — User I/O pin (bank 3) |
| Pin produk 100 | I/O — User I/O pin (bank 3) |
| Pin produk 101 | I/O — User I/O pin (bank 3) |
| Pin produk 102 | I/O — User I/O pin (bank 3) |
| Pin produk 103 | VCCINT — Core supply 5 V |
| Pin produk 104 | I/O — User I/O pin (bank 3) |
| Pin produk 105 | I/O — User I/O pin (bank 3) |
| Pin produk 106 | I/O — User I/O pin (bank 3) |
| Pin produk 107 | GND — Ground |
| Pin produk 108 | I/O — User I/O pin (bank 3) |
| Pin produk 109 | I/O — User I/O pin (bank 3) |
| Pin produk 110 | I/O — User I/O pin (bank 3) |
| Pin produk 111 | I/O — User I/O pin (bank 3) |
| Pin produk 112 | I/O — User I/O pin (bank 3) |
| Pin produk 113 | VCCIO3 — I/O bank 3 supply 5 V |
| Pin produk 114 | I/O — User I/O pin (bank 3) |
| Pin produk 115 | I/O — User I/O pin (bank 3) |
| Pin produk 116 | I/O — User I/O pin (bank 3) |
| Pin produk 117 | I/O — User I/O pin (bank 3) |
| Pin produk 118 | I/O — User I/O pin (bank 3) |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | I/O — User I/O pin (bank 4) |
| Pin produk 121 | I/O — User I/O pin (bank 4) |
| Pin produk 122 | I/O — User I/O pin (bank 4) |
| Pin produk 123 | VCCINT — Core supply 5 V |
| Pin produk 124 | I/O — User I/O pin (bank 4) |
| Pin produk 125 | I/O — User I/O pin (bank 4) |
| Pin produk 126 | I/O — User I/O pin (bank 4) |
| Pin produk 127 | GND — Ground |
| Pin produk 128 | I/O — User I/O pin (bank 4) |
| Pin produk 129 | I/O — User I/O pin (bank 4) |
| Pin produk 130 | I/O — User I/O pin (bank 4) |
| Pin produk 131 | I/O — User I/O pin (bank 4) |
| Pin produk 132 | VCCIO4 — I/O bank 4 supply 5 V |
| Pin produk 133 | I/O — User I/O pin (bank 4) |
| Pin produk 134 | I/O — User I/O pin (bank 4) |
| Pin produk 135 | I/O — User I/O pin (bank 4) |
| Pin produk 136 | I/O — User I/O pin (bank 4) |
| Pin produk 137 | GND — Ground |
| Pin produk 138 | I/O — User I/O pin (bank 4) |
| Pin produk 139 | I/O — User I/O pin (bank 4) |
| Pin produk 140 | I/O — User I/O pin (bank 4) |
| Pin produk 141 | I/O — User I/O pin (bank 4) |
| Pin produk 142 | I/O — User I/O pin (bank 4) |
| Pin produk 143 | I/O — User I/O pin (bank 4) |
| Pin produk 144 | I/O — User I/O pin (bank 4) |
Aplikasi Umum
EPF6016TC144-2N cocok untuk 6 aplikasis: Legacy Telecom Line-Card Interface, Industrial PLC I/O Expander, Custom State-Machine Controllers, Peripheral Bus Interfacing (PCI / VME / ISA), Glue-Logic Integration on Multi-Board Systems, Communication Channelizer and Multiplexer.
Legacy Telecom Line-Card Interface
The EPF6016TC144-2N's 16,000-gate capacity and 117 user I/Os make it well-suited for legacy T1/E1 and early-ATM line-card bus interface glue logic in telecom central-office equipment. Its 5 V I/O tolerance allows direct interface to legacy bus transceivers and TTL/CMOS peripherals without level shifters, while the 125 MHz internal toggle frequency handles bus-arbitration and packet-header parsing at line rates. The 132 LABs are typically allocated to FIFO controllers, DMA state machines, and HDLC framing engines. Designers commonly pair this device with EPC2 configuration PROMs on the same TQFP-144 PCB to support in-service firmware updates via the JTAG port.
Direkomendasikan
Industrial PLC I/O Expander
In industrial PLC designs the EPF6016TC144-2N acts as a programmable I/O expander that maps field-bus signals (Modbus, Profibus) onto a backplane bus, exploiting its 117 user I/Os to consolidate discrete-logic glue that would otherwise require multiple 74-series TTL packages. The 5 V supply aligns with industrial 24V-to-5V regulated rails, and the commercial 0-85 °C operating range covers most factory-floor enclosures. Each LAB implements one I/O channel with input-filtering debounce and output slew-rate control. The JTAG port allows factory-floor firmware updates without removing the PLC module from the rack.
Direkomendasikan
Custom State-Machine Controllers
The EPF6016TC144-2N is ideal for implementing complex multi-state controllers in test and measurement equipment, where its 1320 logic cells can hold 30-50 independent finite-state machines in parallel while the 117 I/Os drive front-panel switches, relay matrices, and indicator LEDs. The 125 MHz internal frequency supports real-time sequencing at kHz-to-MHz rates required by automated test handlers. The True-LVDS option allows direct drive of high-speed differential probes. Designers benefit from the deterministic FastTrack interconnect that yields predictable worst-case timing closure in the MAX+PLUS II timing analyzer.
Direkomendasikan
Peripheral Bus Interfacing (PCI / VME / ISA)
The EPF6016TC144-2N's 117 user I/Os and 5 V PCI-compliant I/O standard make it a drop-in bus-interface bridge between legacy ISA/VME backplanes and modern processors that lack parallel peripheral support. Its 1320 logic cells comfortably fit a 32-bit PCI target-state machine plus DMA engine in a single device, while the 125 MHz toggle frequency handles 33 MHz PCI clock-domain crossings. The TQFP-144 footprint exposes enough I/O to multiplex multiple bus segments. Engineering teams commonly use the Quartus/MAX+PLUS II PCI megafunction to shorten development time and guarantee protocol compliance.
Direkomendasikan
Glue-Logic Integration on Multi-Board Systems
On multi-board backplane systems the EPF6016TC144-2N replaces dozens of 74HC/74F-series TTL glue-logic packages with a single programmable device, reducing board area by up to 70% and BOM count by 50+ parts. The 117 user I/Os handle chip-select decoding, address-latch enable, bus-arbiter outputs, and interrupt-acknowledge logic, while the 132 LABs implement 8- and 16-bit state machines for bus-turnaround and wait-state insertion. The 5 V I/O bank interfaces directly to TTL peripherals without external buffers, and the JTAG port enables board-level boundary-scan interconnect tests during manufacturing.
Direkomendasikan
Communication Channelizer and Multiplexer
The EPF6016TC144-2N supports up to 32 channels of TDM (time-division-multiplexed) data at 2.048 MHz in channelized telecom access systems, thanks to its 117 user I/Os that can be assigned to individual serial-bit streams and its 125 MHz fabric that oversamples each channel 60x for jitter margin. Each LAB is allocated to a single channel's elastic-store and bit-stuffing logic, allowing the FLEX 6000 to replace an entire bank of legacy HDLC chips. The device is widely deployed in early-generation DSLAMs and DACS (Digital Access Cross-Connect Systems) where its 5 V tolerance matches existing line-interface units.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF6016TC144-2N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF6016TC144-2 | EPF6016ATC144-2N | EPF6016ATC144-2 | EPF6016TC144-3N | EPF6010ATC144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Capacity (Gates) | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 10,000 typical |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (slower) | -2 |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) |
| RoHS Compliance | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) |
| Configuration Bitstream | FLEX 6000 compatible | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) |
Diferensiator Kunci
- 5 V I/O tolerance in a TQFP-144 package (vsEPF6016TC144-3N)
- Wide automotive temperature range option on same footprint (vsEPF6016ATC144-2N)
- Lower logic density than FLEX 10K family on same TQFP-144 (vsEPF10K50STC144-2)
Catatan Desain
The EPF6016TC144-2N requires a stable 5 V ±5% supply on every VCCINT (core) and VCCIO (I/O bank) pin. Place a 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin, and add bulk 10 µF tantalum or aluminum-polymer capacitors on the supply rails entering the device. The 5 mA quiescent current is for unconfigured SRAM cells; configured designs draw 100-500 mA depending on utilization and toggle rate. Always sequence the 5 V supply ramp to be monotonic - FLEX 6000 devices may latch up if VCCIO rises before VCCINT.
TQFP-144 has a 0.5 mm pitch and requires careful PCB layout. Use 0.15 mm-wide traces with 0.15 mm clearance exiting the pads; escape vias should be tented (covered with soldermask) to prevent solder wicking during reflow. Provide a continuous ground plane on layer 2 directly under the device to minimize ground bounce on the 117 simultaneously-switching I/Os. Add a 4-layer stack-up with dedicated VCC and GND planes for designs that switch more than 64 I/Os simultaneously at >50 MHz.
Estimated: configuration bitstream must be regenerated for any speed-grade or temperature-grade change (e.g. -2N to -3N) even if the design is identical; using the wrong bitstream produces CONF_DONE low at power-up. Do not connect nCONFIG, nSTATUS, or CONF_DONE to pull-ups without verifying the FLEX 6000 datasheet - the pull-up values are application-specific. Finally, the SRAM configuration is volatile; an EPC2 or EPC16 configuration PROM is mandatory in production, not optional, and the JTAG port alone does not retain the bitstream across power cycles.
The 117 user I/Os of the EPF6016TC144-2N are organized into four I/O banks; each bank shares a common VCCIO rail and must be configured to a single I/O standard (LVTTL, LVCMOS, PCI, or LVDS) for all pins in that bank. Mixing 5 V TTL with 3.3 V LVCMOS in the same bank will damage the device. Source-synchronous interfaces (e.g. DDR-style transfers above 50 MHz) require the IOE (I/O element) input-register mode to maintain setup/hold timing - consult the FLEX 6000 datasheet chapter on I/O features.
Informasi Konformitas
RoHS compliance indicated by the 'N' suffix on the part number. The device itself is not AEC-Q100 qualified; the EPF6016ATC144-2N variant is the automotive-temp grade but is not formally AEC-Q100 qualified either. FLEX 6000 family is in last-time-buy lifecycle status per distributor data.