EPF6016TC144-2N - FLEX 6000 16K-Gate FPGA, 1320 Cells, 144-TQFP | Intel / Altera
N.º da peça: EPF6016TC144-2N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $19.8 | $1.980,00 |
| 500 | $16.5 | $8.250,00 |
| 1.000 | $14.2 | $14.200,00 |
EPF6016TC144-2N Visão geral
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement arbitrary digital logic through software-defined bitstream programming. Within the broader semiconductor taxonomy, the EPF6016TC144-2N sits in the programmable logic family, between simple SPLDs/CPLDs and high-density FPGAs, targeting glue-logic and bus-interface applications. The FLEX 6000 family is built on a 0.42 µm CMOS SRAM process, requiring external configuration memory (typically an EPC2 or EPC16 configuration device) to load the bitstream at power-up.
Key features of the EPF6016TC144-2N include a maximum internal toggle frequency of 125 MHz, a 5 V (4.75 V to 5.25 V) single-supply operation, 5 mA quiescent supply current, an operating temperature range of 0 °C to 85 °C (commercial grade), and True-LVDS/LVTTL/MultiVolt I/O support. The device is RoHS compliant and supports in-system programmability via the JTAG (IEEE 1149.1) boundary-scan interface, enabling rapid prototyping and field upgrades.
Architecturally, each LAB contains 10 Logic Elements (LEs), each LE comprising a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic functions. The 117 user I/Os are arranged around the package perimeter with FastTrack interconnect providing predictable routing delay. The -2N speed grade identifies a specific timing bin within the FLEX 6000 family, sitting between the -3 (slower) and -1 (fastest) grades.
Typical applications include peripheral bus interfacing (PCI, ISA, VME), glue-logic integration, custom state-machine controllers, communication channelizers, and industrial control subsystems. The device is widely used in legacy telecom line-card designs and is supported by the classic Altera MAX+PLUS II and Quartus design flows for backwards compatibility.
When designing with the EPF6016TC144-2N, ensure that the configuration scheme (PS, AS, or JTAG) is chosen early in the design cycle, and that the 5 V supply is well decoupled with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin. The I/O banks can be configured independently, but 5 V tolerance requires the PCI-compliant I/O standard on the relevant banks.
This page synthesizes distributor inventory, drop-in TQFP-144 alternatives, and practical design notes not consolidated on any single manufacturer page.
Alternativas drop-in para EPF6016TC144-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6016TC144-2N (mesmo formato e footprint) — diferindo em Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6016TC144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6016ATC144-2N
✅ Drop-In✓ Em estoque
$19.5 / unidade
Ver ficha técnica →EPF6016ATC144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EPF6016TC144-3N
✅ Drop-In✓ Em estoque
$10.5 / unidade
Ver ficha técnica →EPF6010ATC144-2
✅ Drop-In✓ Em estoque
$14.95 / unidade
Ver ficha técnica →EPF6016TC144-2N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-based, SRAM LUT) |
| Typical Gates | 16,000 |
| Logic Elements / Cells | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| Logic Elements per LAB | 10 |
| Maximum Internal Frequency | 125 MHz |
| User I/Os | 117 |
| Supply Voltage (VCC) | 4.75 V to 5.25 V (5 V nominal) |
| Quiescent Supply Current | 5 mA |
| Process Technology | 0.42 µm CMOS |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16 |
| Encapsulamento | TQFP-144 (144-pin Thin Quad Flat Pack) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to 85 °C (commercial) |
| Speed Grade | -2 (mid-range) |
| Status RoHS | Compliant |
Configuração de pinos do EPF6016TC144-2N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | VCCINT — Core supply 5 V |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | VCCIO1 — I/O bank 1 supply 5 V |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | I/O — User I/O pin (bank 1) |
| Pino 27 | I/O — User I/O pin (bank 1) |
| Pino 28 | I/O — User I/O pin (bank 1) |
| Pino 29 | VCCINT — Core supply 5 V |
| Pino 30 | I/O — User I/O pin (bank 1) |
| Pino 31 | I/O — User I/O pin (bank 1) |
| Pino 32 | I/O — User I/O pin (bank 1) |
| Pino 33 | I/O — User I/O pin (bank 1) |
| Pino 34 | I/O — User I/O pin (bank 1) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O — User I/O pin (bank 1) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | VCCIO2 — I/O bank 2 supply 5 V |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | VCCINT — Core supply 5 V |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | I/O — User I/O pin (bank 2) |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | I/O — User I/O pin (bank 2) |
| Pino 50 | I/O — User I/O pin (bank 2) |
| Pino 51 | I/O — User I/O pin (bank 2) |
| Pino 52 | I/O — User I/O pin (bank 2) |
| Pino 53 | I/O — User I/O pin (bank 2) |
| Pino 54 | VCCIO2 — I/O bank 2 supply 5 V |
| Pino 55 | I/O — User I/O pin (bank 2) |
| Pino 56 | I/O — User I/O pin (bank 2) |
| Pino 57 | I/O — User I/O pin (bank 2) |
| Pino 58 | I/O — User I/O pin (bank 2) |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O pin (bank 2) |
| Pino 61 | I/O — User I/O pin (bank 2) |
| Pino 62 | I/O — User I/O pin (bank 2) |
| Pino 63 | VCCINT — Core supply 5 V |
| Pino 64 | I/O — User I/O pin (bank 2) |
| Pino 65 | I/O — User I/O pin (bank 2) |
| Pino 66 | I/O — User I/O pin (bank 2) |
| Pino 67 | I/O — User I/O pin (bank 2) |
| Pino 68 | I/O — User I/O pin (bank 2) |
| Pino 69 | I/O — User I/O pin (bank 2) |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O pin (bank 2) |
| Pino 72 | I/O — User I/O pin (bank 2) |
| Pino 73 | VCCIO2 — I/O bank 2 supply 5 V |
| Pino 74 | nCONFIG — Configuration control (active low) |
| Pino 75 | nSTATUS — Configuration status (active low) |
| Pino 76 | CONF_DONE — Configuration done indicator |
| Pino 77 | TCK — JTAG test clock |
| Pino 78 | TMS — JTAG test mode select |
| Pino 79 | TDI — JTAG test data in |
| Pino 80 | TDO — JTAG test data out |
| Pino 81 | MSEL0 — Configuration mode select 0 |
| Pino 82 | MSEL1 — Configuration mode select 1 |
| Pino 83 | DCLK — Configuration clock |
| Pino 84 | DATA0 — Configuration data input |
| Pino 85 | GND — Ground |
| Pino 86 | VCCINT — Core supply 5 V |
| Pino 87 | I/O — User I/O pin (bank 3) |
| Pino 88 | I/O — User I/O pin (bank 3) |
| Pino 89 | I/O — User I/O pin (bank 3) |
| Pino 90 | I/O — User I/O pin (bank 3) |
| Pino 91 | I/O — User I/O pin (bank 3) |
| Pino 92 | I/O — User I/O pin (bank 3) |
| Pino 93 | VCCIO3 — I/O bank 3 supply 5 V |
| Pino 94 | I/O — User I/O pin (bank 3) |
| Pino 95 | I/O — User I/O pin (bank 3) |
| Pino 96 | I/O — User I/O pin (bank 3) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O pin (bank 3) |
| Pino 99 | I/O — User I/O pin (bank 3) |
| Pino 100 | I/O — User I/O pin (bank 3) |
| Pino 101 | I/O — User I/O pin (bank 3) |
| Pino 102 | I/O — User I/O pin (bank 3) |
| Pino 103 | VCCINT — Core supply 5 V |
| Pino 104 | I/O — User I/O pin (bank 3) |
| Pino 105 | I/O — User I/O pin (bank 3) |
| Pino 106 | I/O — User I/O pin (bank 3) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O pin (bank 3) |
| Pino 109 | I/O — User I/O pin (bank 3) |
| Pino 110 | I/O — User I/O pin (bank 3) |
| Pino 111 | I/O — User I/O pin (bank 3) |
| Pino 112 | I/O — User I/O pin (bank 3) |
| Pino 113 | VCCIO3 — I/O bank 3 supply 5 V |
| Pino 114 | I/O — User I/O pin (bank 3) |
| Pino 115 | I/O — User I/O pin (bank 3) |
| Pino 116 | I/O — User I/O pin (bank 3) |
| Pino 117 | I/O — User I/O pin (bank 3) |
| Pino 118 | I/O — User I/O pin (bank 3) |
| Pino 119 | GND — Ground |
| Pino 120 | I/O — User I/O pin (bank 4) |
| Pino 121 | I/O — User I/O pin (bank 4) |
| Pino 122 | I/O — User I/O pin (bank 4) |
| Pino 123 | VCCINT — Core supply 5 V |
| Pino 124 | I/O — User I/O pin (bank 4) |
| Pino 125 | I/O — User I/O pin (bank 4) |
| Pino 126 | I/O — User I/O pin (bank 4) |
| Pino 127 | GND — Ground |
| Pino 128 | I/O — User I/O pin (bank 4) |
| Pino 129 | I/O — User I/O pin (bank 4) |
| Pino 130 | I/O — User I/O pin (bank 4) |
| Pino 131 | I/O — User I/O pin (bank 4) |
| Pino 132 | VCCIO4 — I/O bank 4 supply 5 V |
| Pino 133 | I/O — User I/O pin (bank 4) |
| Pino 134 | I/O — User I/O pin (bank 4) |
| Pino 135 | I/O — User I/O pin (bank 4) |
| Pino 136 | I/O — User I/O pin (bank 4) |
| Pino 137 | GND — Ground |
| Pino 138 | I/O — User I/O pin (bank 4) |
| Pino 139 | I/O — User I/O pin (bank 4) |
| Pino 140 | I/O — User I/O pin (bank 4) |
| Pino 141 | I/O — User I/O pin (bank 4) |
| Pino 142 | I/O — User I/O pin (bank 4) |
| Pino 143 | I/O — User I/O pin (bank 4) |
| Pino 144 | I/O — User I/O pin (bank 4) |
Aplicações típicas
EPF6016TC144-2N é adequado para 6 aplicaçãos: Legacy Telecom Line-Card Interface, Industrial PLC I/O Expander, Custom State-Machine Controllers, Peripheral Bus Interfacing (PCI / VME / ISA), Glue-Logic Integration on Multi-Board Systems, Communication Channelizer and Multiplexer.
Legacy Telecom Line-Card Interface
The EPF6016TC144-2N's 16,000-gate capacity and 117 user I/Os make it well-suited for legacy T1/E1 and early-ATM line-card bus interface glue logic in telecom central-office equipment. Its 5 V I/O tolerance allows direct interface to legacy bus transceivers and TTL/CMOS peripherals without level shifters, while the 125 MHz internal toggle frequency handles bus-arbitration and packet-header parsing at line rates. The 132 LABs are typically allocated to FIFO controllers, DMA state machines, and HDLC framing engines. Designers commonly pair this device with EPC2 configuration PROMs on the same TQFP-144 PCB to support in-service firmware updates via the JTAG port.
Recomendado
Industrial PLC I/O Expander
In industrial PLC designs the EPF6016TC144-2N acts as a programmable I/O expander that maps field-bus signals (Modbus, Profibus) onto a backplane bus, exploiting its 117 user I/Os to consolidate discrete-logic glue that would otherwise require multiple 74-series TTL packages. The 5 V supply aligns with industrial 24V-to-5V regulated rails, and the commercial 0-85 °C operating range covers most factory-floor enclosures. Each LAB implements one I/O channel with input-filtering debounce and output slew-rate control. The JTAG port allows factory-floor firmware updates without removing the PLC module from the rack.
Recomendado
Custom State-Machine Controllers
The EPF6016TC144-2N is ideal for implementing complex multi-state controllers in test and measurement equipment, where its 1320 logic cells can hold 30-50 independent finite-state machines in parallel while the 117 I/Os drive front-panel switches, relay matrices, and indicator LEDs. The 125 MHz internal frequency supports real-time sequencing at kHz-to-MHz rates required by automated test handlers. The True-LVDS option allows direct drive of high-speed differential probes. Designers benefit from the deterministic FastTrack interconnect that yields predictable worst-case timing closure in the MAX+PLUS II timing analyzer.
Recomendado
Peripheral Bus Interfacing (PCI / VME / ISA)
The EPF6016TC144-2N's 117 user I/Os and 5 V PCI-compliant I/O standard make it a drop-in bus-interface bridge between legacy ISA/VME backplanes and modern processors that lack parallel peripheral support. Its 1320 logic cells comfortably fit a 32-bit PCI target-state machine plus DMA engine in a single device, while the 125 MHz toggle frequency handles 33 MHz PCI clock-domain crossings. The TQFP-144 footprint exposes enough I/O to multiplex multiple bus segments. Engineering teams commonly use the Quartus/MAX+PLUS II PCI megafunction to shorten development time and guarantee protocol compliance.
Recomendado
Glue-Logic Integration on Multi-Board Systems
On multi-board backplane systems the EPF6016TC144-2N replaces dozens of 74HC/74F-series TTL glue-logic packages with a single programmable device, reducing board area by up to 70% and BOM count by 50+ parts. The 117 user I/Os handle chip-select decoding, address-latch enable, bus-arbiter outputs, and interrupt-acknowledge logic, while the 132 LABs implement 8- and 16-bit state machines for bus-turnaround and wait-state insertion. The 5 V I/O bank interfaces directly to TTL peripherals without external buffers, and the JTAG port enables board-level boundary-scan interconnect tests during manufacturing.
Recomendado
Communication Channelizer and Multiplexer
The EPF6016TC144-2N supports up to 32 channels of TDM (time-division-multiplexed) data at 2.048 MHz in channelized telecom access systems, thanks to its 117 user I/Os that can be assigned to individual serial-bit streams and its 125 MHz fabric that oversamples each channel 60x for jitter margin. Each LAB is allocated to a single channel's elastic-store and bit-stuffing logic, allowing the FLEX 6000 to replace an entire bank of legacy HDLC chips. The device is widely deployed in early-generation DSLAMs and DACS (Digital Access Cross-Connect Systems) where its 5 V tolerance matches existing line-interface units.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6016TC144-2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6016TC144-2 | EPF6016ATC144-2N | EPF6016ATC144-2 | EPF6016TC144-3N | EPF6010ATC144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Capacity (Gates) | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 10,000 typical |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (slower) | -2 |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) |
| RoHS Compliance | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) |
| Configuration Bitstream | FLEX 6000 compatible | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) |
Principais diferenciais
- 5 V I/O tolerance in a TQFP-144 package (vs EPF6016TC144-3N)
- Wide automotive temperature range option on same footprint (vs EPF6016ATC144-2N)
- Lower logic density than FLEX 10K family on same TQFP-144 (vs EPF10K50STC144-2)
Notas de projeto
The EPF6016TC144-2N requires a stable 5 V ±5% supply on every VCCINT (core) and VCCIO (I/O bank) pin. Place a 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin, and add bulk 10 µF tantalum or aluminum-polymer capacitors on the supply rails entering the device. The 5 mA quiescent current is for unconfigured SRAM cells; configured designs draw 100-500 mA depending on utilization and toggle rate. Always sequence the 5 V supply ramp to be monotonic - FLEX 6000 devices may latch up if VCCIO rises before VCCINT.
TQFP-144 has a 0.5 mm pitch and requires careful PCB layout. Use 0.15 mm-wide traces with 0.15 mm clearance exiting the pads; escape vias should be tented (covered with soldermask) to prevent solder wicking during reflow. Provide a continuous ground plane on layer 2 directly under the device to minimize ground bounce on the 117 simultaneously-switching I/Os. Add a 4-layer stack-up with dedicated VCC and GND planes for designs that switch more than 64 I/Os simultaneously at >50 MHz.
Estimated: configuration bitstream must be regenerated for any speed-grade or temperature-grade change (e.g. -2N to -3N) even if the design is identical; using the wrong bitstream produces CONF_DONE low at power-up. Do not connect nCONFIG, nSTATUS, or CONF_DONE to pull-ups without verifying the FLEX 6000 datasheet - the pull-up values are application-specific. Finally, the SRAM configuration is volatile; an EPC2 or EPC16 configuration PROM is mandatory in production, not optional, and the JTAG port alone does not retain the bitstream across power cycles.
The 117 user I/Os of the EPF6016TC144-2N are organized into four I/O banks; each bank shares a common VCCIO rail and must be configured to a single I/O standard (LVTTL, LVCMOS, PCI, or LVDS) for all pins in that bank. Mixing 5 V TTL with 3.3 V LVCMOS in the same bank will damage the device. Source-synchronous interfaces (e.g. DDR-style transfers above 50 MHz) require the IOE (I/O element) input-register mode to maintain setup/hold timing - consult the FLEX 6000 datasheet chapter on I/O features.
Informações de conformidade
RoHS compliance indicated by the 'N' suffix on the part number. The device itself is not AEC-Q100 qualified; the EPF6016ATC144-2N variant is the automotive-temp grade but is not formally AEC-Q100 qualified either. FLEX 6000 family is in last-time-buy lifecycle status per distributor data.