EPF6016TC144-2N - FLEX 6000 16K-Gate FPGA, 1320 Cells, 144-TQFP | Intel / Altera
Référence : EPF6016TC144-2N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $19.8 | $1 980,00 |
| 500 | $16.5 | $8 250,00 |
| 1 000 | $14.2 | $14 200,00 |
EPF6016TC144-2N Présentation
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement arbitrary digital logic through software-defined bitstream programming. Within the broader semiconductor taxonomy, the EPF6016TC144-2N sits in the programmable logic family, between simple SPLDs/CPLDs and high-density FPGAs, targeting glue-logic and bus-interface applications. The FLEX 6000 family is built on a 0.42 µm CMOS SRAM process, requiring external configuration memory (typically an EPC2 or EPC16 configuration device) to load the bitstream at power-up.
Key features of the EPF6016TC144-2N include a maximum internal toggle frequency of 125 MHz, a 5 V (4.75 V to 5.25 V) single-supply operation, 5 mA quiescent supply current, an operating temperature range of 0 °C to 85 °C (commercial grade), and True-LVDS/LVTTL/MultiVolt I/O support. The device is RoHS compliant and supports in-system programmability via the JTAG (IEEE 1149.1) boundary-scan interface, enabling rapid prototyping and field upgrades.
Architecturally, each LAB contains 10 Logic Elements (LEs), each LE comprising a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic functions. The 117 user I/Os are arranged around the package perimeter with FastTrack interconnect providing predictable routing delay. The -2N speed grade identifies a specific timing bin within the FLEX 6000 family, sitting between the -3 (slower) and -1 (fastest) grades.
Typical applications include peripheral bus interfacing (PCI, ISA, VME), glue-logic integration, custom state-machine controllers, communication channelizers, and industrial control subsystems. The device is widely used in legacy telecom line-card designs and is supported by the classic Altera MAX+PLUS II and Quartus design flows for backwards compatibility.
When designing with the EPF6016TC144-2N, ensure that the configuration scheme (PS, AS, or JTAG) is chosen early in the design cycle, and that the 5 V supply is well decoupled with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin. The I/O banks can be configured independently, but 5 V tolerance requires the PCI-compliant I/O standard on the relevant banks.
This page synthesizes distributor inventory, drop-in TQFP-144 alternatives, and practical design notes not consolidated on any single manufacturer page.
Alternatives de remplacement direct pour EPF6016TC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016TC144-2N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016TC144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6016ATC144-2N
✅ Remplacement direct✓ En stock
$19.5 / unité
Voir la fiche technique →EPF6016ATC144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6016TC144-3N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EPF6010ATC144-2
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPF6016TC144-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | FPGA (SRAM-based, SRAM LUT) |
| Typical Gates | 16,000 |
| Logic Elements / Cells | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| Logic Elements per LAB | 10 |
| Maximum Internal Frequency | 125 MHz |
| User I/Os | 117 |
| Supply Voltage (VCC) | 4.75 V to 5.25 V (5 V nominal) |
| Quiescent Supply Current | 5 mA |
| Process Technology | 0.42 µm CMOS |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16 |
| Boîtier | TQFP-144 (144-pin Thin Quad Flat Pack) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Speed Grade | -2 (mid-range) |
| Statut RoHS | Compliant |
Configuration des broches de EPF6016TC144-2N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | VCCINT — Core supply 5 V |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | VCCIO1 — I/O bank 1 supply 5 V |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | VCCINT — Core supply 5 V |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | VCCIO2 — I/O bank 2 supply 5 V |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | VCCINT — Core supply 5 V |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | VCCIO2 — I/O bank 2 supply 5 V |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | VCCINT — Core supply 5 V |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
| Broche 66 | I/O — User I/O pin (bank 2) |
| Broche 67 | I/O — User I/O pin (bank 2) |
| Broche 68 | I/O — User I/O pin (bank 2) |
| Broche 69 | I/O — User I/O pin (bank 2) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin (bank 2) |
| Broche 72 | I/O — User I/O pin (bank 2) |
| Broche 73 | VCCIO2 — I/O bank 2 supply 5 V |
| Broche 74 | nCONFIG — Configuration control (active low) |
| Broche 75 | nSTATUS — Configuration status (active low) |
| Broche 76 | CONF_DONE — Configuration done indicator |
| Broche 77 | TCK — JTAG test clock |
| Broche 78 | TMS — JTAG test mode select |
| Broche 79 | TDI — JTAG test data in |
| Broche 80 | TDO — JTAG test data out |
| Broche 81 | MSEL0 — Configuration mode select 0 |
| Broche 82 | MSEL1 — Configuration mode select 1 |
| Broche 83 | DCLK — Configuration clock |
| Broche 84 | DATA0 — Configuration data input |
| Broche 85 | GND — Ground |
| Broche 86 | VCCINT — Core supply 5 V |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | I/O — User I/O pin (bank 3) |
| Broche 93 | VCCIO3 — I/O bank 3 supply 5 V |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 3) |
| Broche 99 | I/O — User I/O pin (bank 3) |
| Broche 100 | I/O — User I/O pin (bank 3) |
| Broche 101 | I/O — User I/O pin (bank 3) |
| Broche 102 | I/O — User I/O pin (bank 3) |
| Broche 103 | VCCINT — Core supply 5 V |
| Broche 104 | I/O — User I/O pin (bank 3) |
| Broche 105 | I/O — User I/O pin (bank 3) |
| Broche 106 | I/O — User I/O pin (bank 3) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 3) |
| Broche 109 | I/O — User I/O pin (bank 3) |
| Broche 110 | I/O — User I/O pin (bank 3) |
| Broche 111 | I/O — User I/O pin (bank 3) |
| Broche 112 | I/O — User I/O pin (bank 3) |
| Broche 113 | VCCIO3 — I/O bank 3 supply 5 V |
| Broche 114 | I/O — User I/O pin (bank 3) |
| Broche 115 | I/O — User I/O pin (bank 3) |
| Broche 116 | I/O — User I/O pin (bank 3) |
| Broche 117 | I/O — User I/O pin (bank 3) |
| Broche 118 | I/O — User I/O pin (bank 3) |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | VCCINT — Core supply 5 V |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | VCCIO4 — I/O bank 4 supply 5 V |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | I/O — User I/O pin (bank 4) |
| Broche 136 | I/O — User I/O pin (bank 4) |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O pin (bank 4) |
| Broche 139 | I/O — User I/O pin (bank 4) |
| Broche 140 | I/O — User I/O pin (bank 4) |
| Broche 141 | I/O — User I/O pin (bank 4) |
| Broche 142 | I/O — User I/O pin (bank 4) |
| Broche 143 | I/O — User I/O pin (bank 4) |
| Broche 144 | I/O — User I/O pin (bank 4) |
Applications typiques
EPF6016TC144-2N convient pour 6 applications: Legacy Telecom Line-Card Interface, Industrial PLC I/O Expander, Custom State-Machine Controllers, Peripheral Bus Interfacing (PCI / VME / ISA), Glue-Logic Integration on Multi-Board Systems, Communication Channelizer and Multiplexer.
Legacy Telecom Line-Card Interface
The EPF6016TC144-2N's 16,000-gate capacity and 117 user I/Os make it well-suited for legacy T1/E1 and early-ATM line-card bus interface glue logic in telecom central-office equipment. Its 5 V I/O tolerance allows direct interface to legacy bus transceivers and TTL/CMOS peripherals without level shifters, while the 125 MHz internal toggle frequency handles bus-arbitration and packet-header parsing at line rates. The 132 LABs are typically allocated to FIFO controllers, DMA state machines, and HDLC framing engines. Designers commonly pair this device with EPC2 configuration PROMs on the same TQFP-144 PCB to support in-service firmware updates via the JTAG port.
Recommandé
Industrial PLC I/O Expander
In industrial PLC designs the EPF6016TC144-2N acts as a programmable I/O expander that maps field-bus signals (Modbus, Profibus) onto a backplane bus, exploiting its 117 user I/Os to consolidate discrete-logic glue that would otherwise require multiple 74-series TTL packages. The 5 V supply aligns with industrial 24V-to-5V regulated rails, and the commercial 0-85 °C operating range covers most factory-floor enclosures. Each LAB implements one I/O channel with input-filtering debounce and output slew-rate control. The JTAG port allows factory-floor firmware updates without removing the PLC module from the rack.
Recommandé
Custom State-Machine Controllers
The EPF6016TC144-2N is ideal for implementing complex multi-state controllers in test and measurement equipment, where its 1320 logic cells can hold 30-50 independent finite-state machines in parallel while the 117 I/Os drive front-panel switches, relay matrices, and indicator LEDs. The 125 MHz internal frequency supports real-time sequencing at kHz-to-MHz rates required by automated test handlers. The True-LVDS option allows direct drive of high-speed differential probes. Designers benefit from the deterministic FastTrack interconnect that yields predictable worst-case timing closure in the MAX+PLUS II timing analyzer.
Recommandé
Peripheral Bus Interfacing (PCI / VME / ISA)
The EPF6016TC144-2N's 117 user I/Os and 5 V PCI-compliant I/O standard make it a drop-in bus-interface bridge between legacy ISA/VME backplanes and modern processors that lack parallel peripheral support. Its 1320 logic cells comfortably fit a 32-bit PCI target-state machine plus DMA engine in a single device, while the 125 MHz toggle frequency handles 33 MHz PCI clock-domain crossings. The TQFP-144 footprint exposes enough I/O to multiplex multiple bus segments. Engineering teams commonly use the Quartus/MAX+PLUS II PCI megafunction to shorten development time and guarantee protocol compliance.
Recommandé
Glue-Logic Integration on Multi-Board Systems
On multi-board backplane systems the EPF6016TC144-2N replaces dozens of 74HC/74F-series TTL glue-logic packages with a single programmable device, reducing board area by up to 70% and BOM count by 50+ parts. The 117 user I/Os handle chip-select decoding, address-latch enable, bus-arbiter outputs, and interrupt-acknowledge logic, while the 132 LABs implement 8- and 16-bit state machines for bus-turnaround and wait-state insertion. The 5 V I/O bank interfaces directly to TTL peripherals without external buffers, and the JTAG port enables board-level boundary-scan interconnect tests during manufacturing.
Recommandé
Communication Channelizer and Multiplexer
The EPF6016TC144-2N supports up to 32 channels of TDM (time-division-multiplexed) data at 2.048 MHz in channelized telecom access systems, thanks to its 117 user I/Os that can be assigned to individual serial-bit streams and its 125 MHz fabric that oversamples each channel 60x for jitter margin. Each LAB is allocated to a single channel's elastic-store and bit-stuffing logic, allowing the FLEX 6000 to replace an entire bank of legacy HDLC chips. The device is widely deployed in early-generation DSLAMs and DACS (Digital Access Cross-Connect Systems) where its 5 V tolerance matches existing line-interface units.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016TC144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016TC144-2 | EPF6016ATC144-2N | EPF6016ATC144-2 | EPF6016TC144-3N | EPF6010ATC144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Capacity (Gates) | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 16,000 typical | 10,000 typical |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (slower) | -2 |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) | 0 °C to 85 °C (commercial) | -40 °C to +125 °C (automotive) |
| RoHS Compliance | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) |
| Configuration Bitstream | FLEX 6000 compatible | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) | FLEX 6000 compatible (identical) |
Principaux différenciateurs
- 5 V I/O tolerance in a TQFP-144 package (vs EPF6016TC144-3N)
- Wide automotive temperature range option on same footprint (vs EPF6016ATC144-2N)
- Lower logic density than FLEX 10K family on same TQFP-144 (vs EPF10K50STC144-2)
Notes de conception
The EPF6016TC144-2N requires a stable 5 V ±5% supply on every VCCINT (core) and VCCIO (I/O bank) pin. Place a 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin, and add bulk 10 µF tantalum or aluminum-polymer capacitors on the supply rails entering the device. The 5 mA quiescent current is for unconfigured SRAM cells; configured designs draw 100-500 mA depending on utilization and toggle rate. Always sequence the 5 V supply ramp to be monotonic - FLEX 6000 devices may latch up if VCCIO rises before VCCINT.
TQFP-144 has a 0.5 mm pitch and requires careful PCB layout. Use 0.15 mm-wide traces with 0.15 mm clearance exiting the pads; escape vias should be tented (covered with soldermask) to prevent solder wicking during reflow. Provide a continuous ground plane on layer 2 directly under the device to minimize ground bounce on the 117 simultaneously-switching I/Os. Add a 4-layer stack-up with dedicated VCC and GND planes for designs that switch more than 64 I/Os simultaneously at >50 MHz.
Estimated: configuration bitstream must be regenerated for any speed-grade or temperature-grade change (e.g. -2N to -3N) even if the design is identical; using the wrong bitstream produces CONF_DONE low at power-up. Do not connect nCONFIG, nSTATUS, or CONF_DONE to pull-ups without verifying the FLEX 6000 datasheet - the pull-up values are application-specific. Finally, the SRAM configuration is volatile; an EPC2 or EPC16 configuration PROM is mandatory in production, not optional, and the JTAG port alone does not retain the bitstream across power cycles.
The 117 user I/Os of the EPF6016TC144-2N are organized into four I/O banks; each bank shares a common VCCIO rail and must be configured to a single I/O standard (LVTTL, LVCMOS, PCI, or LVDS) for all pins in that bank. Mixing 5 V TTL with 3.3 V LVCMOS in the same bank will damage the device. Source-synchronous interfaces (e.g. DDR-style transfers above 50 MHz) require the IOE (I/O element) input-register mode to maintain setup/hold timing - consult the FLEX 6000 datasheet chapter on I/O features.
Informations de conformité
RoHS compliance indicated by the 'N' suffix on the part number. The device itself is not AEC-Q100 qualified; the EPF6016ATC144-2N variant is the automotive-temp grade but is not formally AEC-Q100 qualified either. FLEX 6000 family is in last-time-buy lifecycle status per distributor data.