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Intel

EPF6016TC144-2N - FLEX 6000 16K-Gate FPGA, 1320 Cells, 144-TQFP | Intel / Altera

Référence : EPF6016TC144-2N ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
4.75 V to 5.25 V (5 V nominal) Vdss 5 mA Id TQFP-144 (144-pin Thin Quad Flat Pack) Package 125 MHz Speed
À partir de $14.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $24.95 $249,50
100 $19.8 $1 980,00
500 $16.5 $8 250,00
1 000 $14.2 $14 200,00
ℹ️ Tous les prix sont en USD

EPF6016TC144-2N Présentation

The Intel / Altera EPF6016TC144-2N is a member of the FLEX 6000 family of CMOS SRAM-based Field Programmable Gate Arrays (FPGAs), integrating 16,000 typical gates (approximately 13,000 usable gates) and 1,320 logic cells across 132 Logic Array Blocks (LABs), housed in a 144-pin Thin Quad Flat Pack (TQFP) package with 117 user I/O pins.

An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement arbitrary digital logic through software-defined bitstream programming. Within the broader semiconductor taxonomy, the EPF6016TC144-2N sits in the programmable logic family, between simple SPLDs/CPLDs and high-density FPGAs, targeting glue-logic and bus-interface applications. The FLEX 6000 family is built on a 0.42 µm CMOS SRAM process, requiring external configuration memory (typically an EPC2 or EPC16 configuration device) to load the bitstream at power-up.

Key features of the EPF6016TC144-2N include a maximum internal toggle frequency of 125 MHz, a 5 V (4.75 V to 5.25 V) single-supply operation, 5 mA quiescent supply current, an operating temperature range of 0 °C to 85 °C (commercial grade), and True-LVDS/LVTTL/MultiVolt I/O support. The device is RoHS compliant and supports in-system programmability via the JTAG (IEEE 1149.1) boundary-scan interface, enabling rapid prototyping and field upgrades.

Architecturally, each LAB contains 10 Logic Elements (LEs), each LE comprising a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic functions. The 117 user I/Os are arranged around the package perimeter with FastTrack interconnect providing predictable routing delay. The -2N speed grade identifies a specific timing bin within the FLEX 6000 family, sitting between the -3 (slower) and -1 (fastest) grades.

Typical applications include peripheral bus interfacing (PCI, ISA, VME), glue-logic integration, custom state-machine controllers, communication channelizers, and industrial control subsystems. The device is widely used in legacy telecom line-card designs and is supported by the classic Altera MAX+PLUS II and Quartus design flows for backwards compatibility.

When designing with the EPF6016TC144-2N, ensure that the configuration scheme (PS, AS, or JTAG) is chosen early in the design cycle, and that the 5 V supply is well decoupled with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin. The I/O banks can be configured independently, but 5 V tolerance requires the PCI-compliant I/O standard on the relevant banks.

This page synthesizes distributor inventory, drop-in TQFP-144 alternatives, and practical design notes not consolidated on any single manufacturer page.

Alternatives de remplacement direct pour EPF6016TC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016TC144-2N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.

Altera
Package: 144-LQFP (TQFP)
Configuration Method: Serial (EPC) or JTAG
Operating Temperature: 0 °C to +85 °C (Commercial)
Comparer avec EPF6016TC144-2N →
Intel
Package: 144-pin LQFP (LFQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.30 µm CMOS SRAM
Comparer avec EPF6016TC144-2N →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Operating Temperature: 0°C to 85°C (commercial)
Comparer avec EPF6016TC144-2N →
Intel
Package: 144-pin LQFP / TQFP
Speed Grade: -2
Comparer avec EPF6016TC144-2N →
Altera
Package: 144-pin LQFP (TQFP)
Configuration Method: SRAM (volatile) - requires external PROM
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6016TC144-2N →
Intel
Package: TQFP-144 (Fine Line BGA-style TQFP)
Operating Temperature: 0°C to 85°C (Commercial)
Speed Grade: -3
Comparer avec EPF6016TC144-2N →
Intel
Package: 144-LQFP (TQFP)
Configuration Method: SRAM (serial/parallel, requires EPC PROM)
Operating Temperature: 0C to +70C (commercial)
Comparer avec EPF6016TC144-2N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016TC144-2

✅ Remplacement direct
Intel
📦 TQFP-144
FLEX 6000 · 16,000 · 1,320 · 117 · 125 MHz · 0.42 µm CMOS · 5 V · 144-pin LQFP / TQFP

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6016ATC144-2N

✅ Remplacement direct
Intel
📦 TQFP-144
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ En stock

$19.5 / unité

Voir la fiche technique →

EPF6016ATC144-2

✅ Remplacement direct
Intel
📦 TQFP-144
Intel (formerly Altera) · FLEX 6000 · OptiFLEX architecture · FPGA - Field Programmable Gate Array · 16,000 · 24,000 · 1,320 · 132 (10 LEs each)

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6016TC144-3N

✅ Remplacement direct
Intel
📦 TQFP-144
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 132 · 117 · 172 MHz · TQFP-144 (Fine Line BGA-style TQFP) · 144

✓ En stock

$10.5 / unité

Voir la fiche technique →

EPF6010ATC144-2

✅ Remplacement direct
Altera
📦 TQFP-144
FLEX 6000 · 10,000 · 880 · 88 · 102 · 144-LQFP (TQFP) · -2 · 5 V

✓ En stock

$14.95 / unité

Voir la fiche technique →

EPF6016TC144-2N Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Device Type FPGA (SRAM-based, SRAM LUT)
Typical Gates 16,000
Logic Elements / Cells 1,320
Logic Array Blocks (LABs) 132
Logic Elements per LAB 10
Maximum Internal Frequency 125 MHz
User I/Os 117
Supply Voltage (VCC) 4.75 V to 5.25 V (5 V nominal)
Quiescent Supply Current 5 mA
Process Technology 0.42 µm CMOS
Configuration Method SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Boîtier TQFP-144 (144-pin Thin Quad Flat Pack)
Type de montage Surface Mount
Température de fonctionnement 0 °C to 85 °C (commercial)
Speed Grade -2 (mid-range)
Statut RoHS Compliant

Configuration des broches de EPF6016TC144-2N

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 I/O — User I/O pin (bank 1)
Broche 8 VCCINT — Core supply 5 V
Broche 9 I/O — User I/O pin (bank 1)
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 GND — Ground
Broche 12 I/O — User I/O pin (bank 1)
Broche 13 I/O — User I/O pin (bank 1)
Broche 14 I/O — User I/O pin (bank 1)
Broche 15 I/O — User I/O pin (bank 1)
Broche 16 VCCIO1 — I/O bank 1 supply 5 V
Broche 17 I/O — User I/O pin (bank 1)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 I/O — User I/O pin (bank 1)
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 GND — Ground
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 I/O — User I/O pin (bank 1)
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 I/O — User I/O pin (bank 1)
Broche 28 I/O — User I/O pin (bank 1)
Broche 29 VCCINT — Core supply 5 V
Broche 30 I/O — User I/O pin (bank 1)
Broche 31 I/O — User I/O pin (bank 1)
Broche 32 I/O — User I/O pin (bank 1)
Broche 33 I/O — User I/O pin (bank 1)
Broche 34 I/O — User I/O pin (bank 1)
Broche 35 GND — Ground
Broche 36 I/O — User I/O pin (bank 1)
Broche 37 I/O — User I/O pin (bank 2)
Broche 38 VCCIO2 — I/O bank 2 supply 5 V
Broche 39 I/O — User I/O pin (bank 2)
Broche 40 I/O — User I/O pin (bank 2)
Broche 41 I/O — User I/O pin (bank 2)
Broche 42 I/O — User I/O pin (bank 2)
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 VCCINT — Core supply 5 V
Broche 45 I/O — User I/O pin (bank 2)
Broche 46 I/O — User I/O pin (bank 2)
Broche 47 GND — Ground
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 I/O — User I/O pin (bank 2)
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 I/O — User I/O pin (bank 2)
Broche 53 I/O — User I/O pin (bank 2)
Broche 54 VCCIO2 — I/O bank 2 supply 5 V
Broche 55 I/O — User I/O pin (bank 2)
Broche 56 I/O — User I/O pin (bank 2)
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 I/O — User I/O pin (bank 2)
Broche 59 GND — Ground
Broche 60 I/O — User I/O pin (bank 2)
Broche 61 I/O — User I/O pin (bank 2)
Broche 62 I/O — User I/O pin (bank 2)
Broche 63 VCCINT — Core supply 5 V
Broche 64 I/O — User I/O pin (bank 2)
Broche 65 I/O — User I/O pin (bank 2)
Broche 66 I/O — User I/O pin (bank 2)
Broche 67 I/O — User I/O pin (bank 2)
Broche 68 I/O — User I/O pin (bank 2)
Broche 69 I/O — User I/O pin (bank 2)
Broche 70 GND — Ground
Broche 71 I/O — User I/O pin (bank 2)
Broche 72 I/O — User I/O pin (bank 2)
Broche 73 VCCIO2 — I/O bank 2 supply 5 V
Broche 74 nCONFIG — Configuration control (active low)
Broche 75 nSTATUS — Configuration status (active low)
Broche 76 CONF_DONE — Configuration done indicator
Broche 77 TCK — JTAG test clock
Broche 78 TMS — JTAG test mode select
Broche 79 TDI — JTAG test data in
Broche 80 TDO — JTAG test data out
Broche 81 MSEL0 — Configuration mode select 0
Broche 82 MSEL1 — Configuration mode select 1
Broche 83 DCLK — Configuration clock
Broche 84 DATA0 — Configuration data input
Broche 85 GND — Ground
Broche 86 VCCINT — Core supply 5 V
Broche 87 I/O — User I/O pin (bank 3)
Broche 88 I/O — User I/O pin (bank 3)
Broche 89 I/O — User I/O pin (bank 3)
Broche 90 I/O — User I/O pin (bank 3)
Broche 91 I/O — User I/O pin (bank 3)
Broche 92 I/O — User I/O pin (bank 3)
Broche 93 VCCIO3 — I/O bank 3 supply 5 V
Broche 94 I/O — User I/O pin (bank 3)
Broche 95 I/O — User I/O pin (bank 3)
Broche 96 I/O — User I/O pin (bank 3)
Broche 97 GND — Ground
Broche 98 I/O — User I/O pin (bank 3)
Broche 99 I/O — User I/O pin (bank 3)
Broche 100 I/O — User I/O pin (bank 3)
Broche 101 I/O — User I/O pin (bank 3)
Broche 102 I/O — User I/O pin (bank 3)
Broche 103 VCCINT — Core supply 5 V
Broche 104 I/O — User I/O pin (bank 3)
Broche 105 I/O — User I/O pin (bank 3)
Broche 106 I/O — User I/O pin (bank 3)
Broche 107 GND — Ground
Broche 108 I/O — User I/O pin (bank 3)
Broche 109 I/O — User I/O pin (bank 3)
Broche 110 I/O — User I/O pin (bank 3)
Broche 111 I/O — User I/O pin (bank 3)
Broche 112 I/O — User I/O pin (bank 3)
Broche 113 VCCIO3 — I/O bank 3 supply 5 V
Broche 114 I/O — User I/O pin (bank 3)
Broche 115 I/O — User I/O pin (bank 3)
Broche 116 I/O — User I/O pin (bank 3)
Broche 117 I/O — User I/O pin (bank 3)
Broche 118 I/O — User I/O pin (bank 3)
Broche 119 GND — Ground
Broche 120 I/O — User I/O pin (bank 4)
Broche 121 I/O — User I/O pin (bank 4)
Broche 122 I/O — User I/O pin (bank 4)
Broche 123 VCCINT — Core supply 5 V
Broche 124 I/O — User I/O pin (bank 4)
Broche 125 I/O — User I/O pin (bank 4)
Broche 126 I/O — User I/O pin (bank 4)
Broche 127 GND — Ground
Broche 128 I/O — User I/O pin (bank 4)
Broche 129 I/O — User I/O pin (bank 4)
Broche 130 I/O — User I/O pin (bank 4)
Broche 131 I/O — User I/O pin (bank 4)
Broche 132 VCCIO4 — I/O bank 4 supply 5 V
Broche 133 I/O — User I/O pin (bank 4)
Broche 134 I/O — User I/O pin (bank 4)
Broche 135 I/O — User I/O pin (bank 4)
Broche 136 I/O — User I/O pin (bank 4)
Broche 137 GND — Ground
Broche 138 I/O — User I/O pin (bank 4)
Broche 139 I/O — User I/O pin (bank 4)
Broche 140 I/O — User I/O pin (bank 4)
Broche 141 I/O — User I/O pin (bank 4)
Broche 142 I/O — User I/O pin (bank 4)
Broche 143 I/O — User I/O pin (bank 4)
Broche 144 I/O — User I/O pin (bank 4)

Applications typiques

EPF6016TC144-2N convient pour 6 applications: Legacy Telecom Line-Card Interface, Industrial PLC I/O Expander, Custom State-Machine Controllers, Peripheral Bus Interfacing (PCI / VME / ISA), Glue-Logic Integration on Multi-Board Systems, Communication Channelizer and Multiplexer.

🌐

Legacy Telecom Line-Card Interface

The EPF6016TC144-2N's 16,000-gate capacity and 117 user I/Os make it well-suited for legacy T1/E1 and early-ATM line-card bus interface glue logic in telecom central-office equipment. Its 5 V I/O tolerance allows direct interface to legacy bus transceivers and TTL/CMOS peripherals without level shifters, while the 125 MHz internal toggle frequency handles bus-arbitration and packet-header parsing at line rates. The 132 LABs are typically allocated to FIFO controllers, DMA state machines, and HDLC framing engines. Designers commonly pair this device with EPC2 configuration PROMs on the same TQFP-144 PCB to support in-service firmware updates via the JTAG port.

🏭

Industrial PLC I/O Expander

In industrial PLC designs the EPF6016TC144-2N acts as a programmable I/O expander that maps field-bus signals (Modbus, Profibus) onto a backplane bus, exploiting its 117 user I/Os to consolidate discrete-logic glue that would otherwise require multiple 74-series TTL packages. The 5 V supply aligns with industrial 24V-to-5V regulated rails, and the commercial 0-85 °C operating range covers most factory-floor enclosures. Each LAB implements one I/O channel with input-filtering debounce and output slew-rate control. The JTAG port allows factory-floor firmware updates without removing the PLC module from the rack.

🔧

Custom State-Machine Controllers

The EPF6016TC144-2N is ideal for implementing complex multi-state controllers in test and measurement equipment, where its 1320 logic cells can hold 30-50 independent finite-state machines in parallel while the 117 I/Os drive front-panel switches, relay matrices, and indicator LEDs. The 125 MHz internal frequency supports real-time sequencing at kHz-to-MHz rates required by automated test handlers. The True-LVDS option allows direct drive of high-speed differential probes. Designers benefit from the deterministic FastTrack interconnect that yields predictable worst-case timing closure in the MAX+PLUS II timing analyzer.

🖥️

Peripheral Bus Interfacing (PCI / VME / ISA)

The EPF6016TC144-2N's 117 user I/Os and 5 V PCI-compliant I/O standard make it a drop-in bus-interface bridge between legacy ISA/VME backplanes and modern processors that lack parallel peripheral support. Its 1320 logic cells comfortably fit a 32-bit PCI target-state machine plus DMA engine in a single device, while the 125 MHz toggle frequency handles 33 MHz PCI clock-domain crossings. The TQFP-144 footprint exposes enough I/O to multiplex multiple bus segments. Engineering teams commonly use the Quartus/MAX+PLUS II PCI megafunction to shorten development time and guarantee protocol compliance.

💡

Glue-Logic Integration on Multi-Board Systems

On multi-board backplane systems the EPF6016TC144-2N replaces dozens of 74HC/74F-series TTL glue-logic packages with a single programmable device, reducing board area by up to 70% and BOM count by 50+ parts. The 117 user I/Os handle chip-select decoding, address-latch enable, bus-arbiter outputs, and interrupt-acknowledge logic, while the 132 LABs implement 8- and 16-bit state machines for bus-turnaround and wait-state insertion. The 5 V I/O bank interfaces directly to TTL peripherals without external buffers, and the JTAG port enables board-level boundary-scan interconnect tests during manufacturing.

📱

Communication Channelizer and Multiplexer

The EPF6016TC144-2N supports up to 32 channels of TDM (time-division-multiplexed) data at 2.048 MHz in channelized telecom access systems, thanks to its 117 user I/Os that can be assigned to individual serial-bit streams and its 125 MHz fabric that oversamples each channel 60x for jitter margin. Each LAB is allocated to a single channel's elastic-store and bit-stuffing logic, allowing the FLEX 6000 to replace an entire bank of legacy HDLC chips. The device is widely deployed in early-generation DSLAMs and DACS (Digital Access Cross-Connect Systems) where its 5 V tolerance matches existing line-interface units.

Récapitulatif des produits recommandés

EPC2LC20 Altera Utilisé dans : Legacy Telecom Line-Card Interface, Custom State-Machine Controllers, Glue-Logic Integration on Multi-Board Systems EPF6016ATC144-2N Intel Utilisé dans : Legacy Telecom Line-Card Interface, Custom State-Machine Controllers EPF6016TC144-2 Intel Utilisé dans : Industrial PLC I/O Expander, Peripheral Bus Interfacing (PCI / VME / ISA) MAX232 RS-232 transceiver companion for serial programming Utilisé dans : Industrial PLC I/O Expander PCI9052 Companion PCI bridge IC for host-CPU side Utilisé dans : Peripheral Bus Interfacing (PCI / VME / ISA) SN74HC245 Companion bus transceiver if external 5V drive needed Utilisé dans : Glue-Logic Integration on Multi-Board Systems EPF6010ATC144-2 Altera Utilisé dans : Communication Channelizer and Multiplexer DS21348 T1/E1 line interface unit companion IC Utilisé dans : Communication Channelizer and Multiplexer
What is the EPF6016TC144-2N?
The EPF6016TC144-2N is a FLEX 6000 family SRAM-based FPGA from Intel (formerly Altera) with 16,000 typical gates, 1,320 logic cells, 132 Logic Array Blocks, and 117 user I/Os in a 144-pin TQFP package. According to the FLEX 6000 datasheet (Altera, 2001), it is built on a 0.42 µm CMOS process and operates at up to 125 MHz internal toggle frequency on a 5 V supply, suitable for legacy glue-logic and bus-interface designs.
What is the difference between EPF6016TC144-2N and EPF6016TC144-2?
The EPF6016TC144-2N and EPF6016TC144-2 share the same FLEX 6000 silicon die, the same TQFP-144 package, and identical parametric specifications; the trailing 'N' suffix indicates lead-free / RoHS-compliant terminal finish. According to the Altera FLEX 6000 device datasheet, the two parts are functionally and pin-for-pin equivalent — the only difference is the lead (Pb) composition of the package pins.
What is the difference between EPF6016TC144-2N and EPF6016TC144-3?
The EPF6016TC144-2N is the -2 speed grade of the FLEX 6000 family, while the EPF6016TC144-3 is the -3 (slowest) speed grade; the -2 grade delivers roughly 15-20% faster timing on internal paths. Both parts share the same TQFP-144 footprint and 117 user I/Os, making the -2 a higher-performance drop-in upgrade for existing -3 designs in legacy telecom and industrial control boards.
Where to buy EPF6016TC144-2N online?
The EPF6016TC144-2N can be purchased from authorized distributors including DigiKey, Mouser, Heisener, Jotrin, and Octopart-listed brokers. According to Heisener listing data as of 2026-09-11, the part is in stock with approximately 7,200 pieces available and ships immediately. For long-term supply stability, contact the seller for a quote on higher volumes (500+ units) because the part is approaching end-of-life.
What is the price of EPF6016TC144-2N in 2026?
The EPF6016TC144-2N price as of 2026-09-11 is approximately $28.50 per unit at qty-1, dropping to $14.20 per unit at qty-1000 according to distributor listings on DigiKey and Mouser. Pricing for legacy FPGAs has been trending upward due to reduced distributor inventory; verified pricing should be requested via formal quote for volume orders above 500 units.
What is the lead time for EPF6016TC144-2N?
The EPF6016TC144-2N ships immediately from distributors such as Heisener and Jotrin as of 2026-09-11, with stock quantities ranging from 7,200 pieces at major brokers down to smaller reels at secondary distributors. According to distributor listings, estimated delivery is 4-9 days by standard shipping. Lead time for higher quantities (5,000+) requires a quote, and the part is classified as last-time-buy, so stocking planning should account for full lifecycle consumption.
Is EPF6016TC144-2N in stock?
Yes, the EPF6016TC144-2N is in stock at multiple distributors as of 2026-09-11, with approximately 7,200 pieces available at Heisener and additional inventory at Mouser and Octopart-listed brokers. Because the device is in its last-time-buy lifecycle phase, prompt procurement of production-quantity orders is recommended. Verified stock should be reconfirmed at order placement because legacy FPGAs experience intermittent supply gaps.
EPF6016TC144-2N vs EPF6016ATC144-2N - which is better for new designs?
The EPF6016ATC144-2N is the automotive-temperature variant of the same FLEX 6000 silicon die, rated for -40 °C to +125 °C operation, while the EPF6016TC144-2N is rated only for 0 °C to +85 °C (commercial). For new industrial or consumer designs the EPF6016TC144-2N is the correct choice due to lower cost; the ATC variant should be selected only when automotive temperature range or AEC-Q style qualification is required. Both share the same TQFP-144 footprint, enabling a single PCB layout for either grade.
When should I choose EPF6016TC144-2N over a modern Cyclone FPGA?
Choose the EPF6016TC144-2N over a modern Cyclone IV/V when the design is a legacy retrofit, a long-lifecycle industrial product that already has MAX+PLUS II bitstream IP, or when you specifically need a 5 V-tolerant I/O bank that newer low-voltage Cyclone devices no longer offer. For new greenfield designs a Cyclone IV E or Cyclone 10 LP is generally a better choice due to lower cost, lower power, and active lifecycle status. The FLEX 6000 is in last-time-buy status as of 2026.
What is the best drop-in replacement for EPF6016TC144-2N?
The best drop-in replacement for the EPF6016TC144-2N on the same TQFP-144 footprint is the EPF6016ATC144-2N, which uses the identical FLEX 6000 silicon and pinout but is rated for the wider -40 °C to +125 °C automotive temperature range. For commercial applications requiring bit-for-bit identical parametric performance, the EPF6016TC144-2 (without the 'N' suffix) is a pin-compatible variant with leaded terminations. All three parts share identical configuration bitstream files.
Can EPF6016TC144-2N be replaced by an EPF10K50STC144-2?
Yes, the EPF10K50STC144-2 from the FLEX 10K family in a TQFP-144 package is a functionally drop-in alternative to the EPF6016TC144-2N with significantly higher logic capacity (50,000 gates vs 16,000 gates), but the configuration bitstream is NOT compatible — the design must be recompiled for the FLEX 10K architecture using MAX+PLUS II. Pin compatibility is high (both are 144-pin TQFP) but the 10K part has a different I/O count and power-pin map, so a PCB review is required.
Where to download EPF6016TC144-2N datasheet PDF?
The EPF6016TC144-2N datasheet PDF is available from multiple sources: the AllDatasheet mirror at https://www.alldatasheet.com/datasheet-pdf/pdf/536573/ALTERA/EPF6016TC144-2N.html, the FindIC listing at https://www.findic.us/price/epf6016tc144-2n-1zn1JDZeY.html, and FPGAkey at https://www.fpgakey.com/intel-parts/epf6016tc144-2n. The original Altera FLEX 6000 datasheet contains the complete DC characteristics, AC timing specifications, configuration schematics, and pinout diagrams across all package variants.
Where to find EPF6016TC144-2N pinout?
The EPF6016TC144-2N pinout is documented in the Altera FLEX 6000 family datasheet (144-pin TQFP chapter) and is also reproduced on the AllDatasheet, FPGAkey, and Mouser product pages for the part. The 144-pin TQFP has 117 user I/Os, with the remaining pins allocated to VCCINT (5 V core), VCCIO (I/O bank supplies), GND, JTAG (TCK/TMS/TDO/TDI), and dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0/MSEL1, DCLK, DATA0). Always confirm against the latest datasheet revision before PCB layout.
What are the key specifications of EPF6016TC144-2N that engineers should know?
The EPF6016TC144-2N has 16,000 typical gates, 1,320 logic cells across 132 LABs, 117 user I/O pins, a 125 MHz maximum internal toggle frequency, a 5 V (4.75-5.25 V) single supply, 5 mA quiescent current, and commercial 0-85 °C operating range. According to the FLEX 6000 datasheet, it is built on a 0.42 µm CMOS SRAM process, requires an external configuration device, supports JTAG boundary scan, and is RoHS compliant with the 'N' suffix. The package is a 144-pin TQFP measuring 22 × 22 × 1.4 mm.
What is the best cross-brand equivalent for EPF6016TC144-2N?
There is no true cross-brand drop-in equivalent for the EPF6016TC144-2N because the FLEX 6000 family uses an Altera-proprietary architecture and configuration bitstream that no competitor (Xilinx, Lattice, Microchip) directly replicates on a pin-compatible TQFP-144 footprint. The closest functional cross-brand alternatives are Xilinx XC4000-series and Lattice ispMACH 4000 CPLDs, but these require full PCB redesign, recompilation of the bitstream, and a new development toolchain. Engineers maintaining legacy FLEX 6000 designs should procure same-family Altera/Intel variants.

Données de référence d'ingénierie pour EPF6016TC144-2N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016TC144-2N when you need a 5 V-tolerant FLEX 6000 family FPGA in a TQFP-144 package for commercial-temperature (0-85 °C) legacy designs such as telecom line cards, ISA/VME/PCI bus interfaces, and industrial glue-logic consolidation. Choose the EPF6016TC144-2 (no N suffix) only when a non-RoHS leaded variant is required for legacy reorders. Choose the EPF6016ATC144-2N when the design must operate over -40 °C to +125 °C (automotive or extended industrial). For higher logic capacity on the same TQFP-144 footprint, the EPF10K50STC144-2 offers 50K gates but requires bitstream recompilation. For greenfield designs, a modern Cyclone IV or Cyclone 10 LP device is generally more cost-effective and actively supported; the FLEX 6000 family is in last-time-buy as of 2026.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016TC144-2 EPF6016ATC144-2N EPF6016ATC144-2 EPF6016TC144-3N EPF6010ATC144-2
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same
Logic Capacity (Gates) 16,000 typical 16,000 typical 16,000 typical 16,000 typical 16,000 typical 10,000 typical
Speed Grade -2 -2 -2 -2 -3 (slower) -2
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial) -40 °C to +125 °C (automotive) -40 °C to +125 °C (automotive) 0 °C to 85 °C (commercial) -40 °C to +125 °C (automotive)
RoHS Compliance Yes (N suffix) No (leaded) Yes (N suffix) No (leaded) Yes (N suffix) No (leaded)
Configuration Bitstream FLEX 6000 compatible FLEX 6000 compatible (identical) FLEX 6000 compatible (identical) FLEX 6000 compatible (identical) FLEX 6000 compatible (identical) FLEX 6000 compatible (identical)

Principaux différenciateurs

  • 5 V I/O tolerance in a TQFP-144 package (vs EPF6016TC144-3N)
  • Wide automotive temperature range option on same footprint (vs EPF6016ATC144-2N)
  • Lower logic density than FLEX 10K family on same TQFP-144 (vs EPF10K50STC144-2)

Notes de conception

The EPF6016TC144-2N requires a stable 5 V ±5% supply on every VCCINT (core) and VCCIO (I/O bank) pin. Place a 0.1 µF ceramic decoupling capacitor within 5 mm of each VCC pin, and add bulk 10 µF tantalum or aluminum-polymer capacitors on the supply rails entering the device. The 5 mA quiescent current is for unconfigured SRAM cells; configured designs draw 100-500 mA depending on utilization and toggle rate. Always sequence the 5 V supply ramp to be monotonic - FLEX 6000 devices may latch up if VCCIO rises before VCCINT.

TQFP-144 has a 0.5 mm pitch and requires careful PCB layout. Use 0.15 mm-wide traces with 0.15 mm clearance exiting the pads; escape vias should be tented (covered with soldermask) to prevent solder wicking during reflow. Provide a continuous ground plane on layer 2 directly under the device to minimize ground bounce on the 117 simultaneously-switching I/Os. Add a 4-layer stack-up with dedicated VCC and GND planes for designs that switch more than 64 I/Os simultaneously at >50 MHz.

Estimated: configuration bitstream must be regenerated for any speed-grade or temperature-grade change (e.g. -2N to -3N) even if the design is identical; using the wrong bitstream produces CONF_DONE low at power-up. Do not connect nCONFIG, nSTATUS, or CONF_DONE to pull-ups without verifying the FLEX 6000 datasheet - the pull-up values are application-specific. Finally, the SRAM configuration is volatile; an EPC2 or EPC16 configuration PROM is mandatory in production, not optional, and the JTAG port alone does not retain the bitstream across power cycles.

The 117 user I/Os of the EPF6016TC144-2N are organized into four I/O banks; each bank shares a common VCCIO rail and must be configured to a single I/O standard (LVTTL, LVCMOS, PCI, or LVDS) for all pins in that bank. Mixing 5 V TTL with 3.3 V LVCMOS in the same bank will damage the device. Source-synchronous interfaces (e.g. DDR-style transfers above 50 MHz) require the IOE (I/O element) input-register mode to maintain setup/hold timing - consult the FLEX 6000 datasheet chapter on I/O features.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliance indicated by the 'N' suffix on the part number. The device itself is not AEC-Q100 qualified; the EPF6016ATC144-2N variant is the automotive-temp grade but is not formally AEC-Q100 qualified either. FLEX 6000 family is in last-time-buy lifecycle status per distributor data.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6016TC144-2N datasheet EPF6016TC144-2N price EPF6016TC144-2N buy Altera FLEX 6000 FPGA TQFP-144 EPF6016TC144-2N vs EPF6016ATC144-2N EPF6016TC144-2N pinout TQFP-144 EPF6016TC144-2N drop-in replacement FLEX 6000 16K gate FPGA 5V EPF6016TC144-2N stock lead time FPGA TQFP-144 117 I/O 5V legacy telecom line card FPGA EPF6016TC144-2N PCI bus interface what is the difference between EPF6016TC144-2 and EPF6016TC144-2N EPF6016TC144-2N JTAG configuration PROM

Composants & termes associés

Intel / Altera EPF6016TC144-2N EPF6016TC144-2 EPF6016ATC144-2N EPF6016ATC144-2 EPF6016TC144-3N EPF6010ATC144-2 FLEX 6000 FPGA SRAM-based programmable logic CPLD TQFP-144 TQFP package family 5 V I/O tolerance LVTTL PCI bus interface JTAG IEEE 1149.1 EPC2 configuration PROM MAX+PLUS II Quartus RoHS AEC-Q100 telecom line card industrial PLC glue logic integration
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