Intel

EPF6024ATI144-3N - 24K Gate FLEX 6000 FPGA, 144-LQFP | Intel (Altera)

MPN: EPF6024ATI144-3N ✗ Akhir Hidup

3.3 V Vdss 3.3 V LVTTL/LVCMOS, 5.0 V tolerant on selected banks Rds(on) 144-LQFP (TQFP-144, 20x20 mm) Package -3 (faster bin) Speed EPC1, EPC2 or compatible Memory

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EPF6024ATI144-3N Ringkasan

The Intel (formerly Altera) EPF6024ATI144-3N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays, offering approximately 24,000 typical gates (1,960 logic elements) packaged in a 144-pin Low-profile Quad Flat Pack (LQFP, T144). It provides 117 user I/O pins and operates from a 3.3 V core supply, with the -3 speed grade indicating a faster -3 timing bin in the FLEX 6000 hierarchy.

What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the programmable logic hierarchy, an FPGA sits above a CPLD (Complex Programmable Logic Device) and a SPLD (Simple PLD) in terms of density and routing flexibility. The FLEX 6000 family is Altera's classic high-volume, low-cost FPGA line built on a 0.5 µm SRAM process with a continuous, SRAM-based interconnect — requiring an external configuration EPROM at power-up. This places the EPF6024ATI144-3N above mask-ROM ASICs in flexibility but below CPLDs in non-volatility.

Key features of the EPF6024ATI144-3N include: 1,960 logic elements, 117 user I/O pins, built-in SRAM configuration memory, JTAG (IEEE 1149.1) boundary-scan support, multi-volt I/O compatibility (3.3 V / 5 V tolerant inputs on selected banks), and the -3 speed grade placing it in the faster half of the FLEX 6000 speed bin. The 144-LQFP package is a surface-mount gull-wing form factor that is hand-solderable and compatible with low-cost PCB assembly. The 'N' suffix indicates lead-free / Pb-free terminal finish per industry convention.

Architecturally, the FLEX 6000 family uses a continuous routing architecture known as the 'FastTrack Interconnect', with logic elements (LEs) grouped into Logic Array Blocks (LABs) of 10 LEs each, interconnected by row and column routing channels. This architecture favors designs with moderate register density and predictable timing closure — common in glue logic, bus interfaces, and peripheral controllers.

Typical applications for the EPF6024ATI144-3N include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), telecommunications line cards, and low-volume prototyping where mask-ROM ASICs are not economical. The 117 user I/O count suits designs that require wide parallel buses or multiple serial channels. The part is now considered NRND/last-time-buy by many distributors as the FLEX 6000 family has been superseded by the Cyclone series.

When designing with this part, plan for an external configuration memory (EPC1, EPC2, or compatible), ensure the 3.3 V rail has clean decoupling within 25 mm of the supply pins, and verify I/O bank voltage compatibility before connecting to 5 V peripherals. Legacy FLEX 6000 designs should be migrated to Cyclone II or Cyclone IV for new production unless pin-compatibility with the existing 144-LQFP footprint is mandatory.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the original manufacturer datasheet.

Alternatif penggantian untuk EPF6024ATI144-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF6024ATI144-3N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Configuration Method, RoHS Status.

EPF6024ATC144-3N

Altera

Package: 144-pin LQFP (TQFP, 1.4 mm height)

Process Technology: 0.42 um CMOS, 4 metal layers