EPF6024ATI144-3N - 24K Gate FLEX 6000 FPGA, 144-LQFP | Intel (Altera)
Référence : EPF6024ATI144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $24.9 | $2 490,00 |
| 500 | $19.4 | $9 700,00 |
| 1 000 | $15.2 | $15 200,00 |
EPF6024ATI144-3N Présentation
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the programmable logic hierarchy, an FPGA sits above a CPLD (Complex Programmable Logic Device) and a SPLD (Simple PLD) in terms of density and routing flexibility. The FLEX 6000 family is Altera's classic high-volume, low-cost FPGA line built on a 0.5 µm SRAM process with a continuous, SRAM-based interconnect — requiring an external configuration EPROM at power-up. This places the EPF6024ATI144-3N above mask-ROM ASICs in flexibility but below CPLDs in non-volatility.
Key features of the EPF6024ATI144-3N include: 1,960 logic elements, 117 user I/O pins, built-in SRAM configuration memory, JTAG (IEEE 1149.1) boundary-scan support, multi-volt I/O compatibility (3.3 V / 5 V tolerant inputs on selected banks), and the -3 speed grade placing it in the faster half of the FLEX 6000 speed bin. The 144-LQFP package is a surface-mount gull-wing form factor that is hand-solderable and compatible with low-cost PCB assembly. The 'N' suffix indicates lead-free / Pb-free terminal finish per industry convention.
Architecturally, the FLEX 6000 family uses a continuous routing architecture known as the 'FastTrack Interconnect', with logic elements (LEs) grouped into Logic Array Blocks (LABs) of 10 LEs each, interconnected by row and column routing channels. This architecture favors designs with moderate register density and predictable timing closure — common in glue logic, bus interfaces, and peripheral controllers.
Typical applications for the EPF6024ATI144-3N include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), telecommunications line cards, and low-volume prototyping where mask-ROM ASICs are not economical. The 117 user I/O count suits designs that require wide parallel buses or multiple serial channels. The part is now considered NRND/last-time-buy by many distributors as the FLEX 6000 family has been superseded by the Cyclone series.
When designing with this part, plan for an external configuration memory (EPC1, EPC2, or compatible), ensure the 3.3 V rail has clean decoupling within 25 mm of the supply pins, and verify I/O bank voltage compatibility before connecting to 5 V peripherals. Legacy FLEX 6000 designs should be migrated to Cyclone II or Cyclone IV for new production unless pin-compatibility with the existing 144-LQFP footprint is mandatory.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the original manufacturer datasheet.
Alternatives de remplacement direct pour EPF6024ATI144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATI144-3N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATI144-3
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF6024ATI144-2N
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF6024ATI144-2
✅ Remplacement direct✓ En stock
$21.9 / unité
Voir la fiche technique →EPF6024ATI144-1N
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →EPF6024ATC144-3N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024ATI144-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gates | 24,000 |
| User I/O Pins | 117 |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 (faster bin) |
| Boîtier | 144-LQFP (TQFP-144, 20x20 mm) |
| Process Technology | 0.5 µm SRAM CMOS |
| Configuration | SRAM, requires external configuration EPROM |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V tolerant on selected banks |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Type de montage | Surface Mount (gull-wing) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant (lead-free 'N' suffix) |
| Lead-Free Terminal Finish | Yes (N suffix) |
| Configuration Memory Required | EPC1, EPC2 or compatible |
Configuration des broches de EPF6024ATI144-3N
| Broche 1 | I/O — User I/O pin |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | VCCIO — I/O bank supply voltage |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | VCCINT — Core supply voltage (3.3 V) |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | VCCIO — I/O bank supply voltage |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | VCCINT — Core supply voltage (3.3 V) |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | VCCIO — I/O bank supply voltage |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | nCONFIG — Configuration control (active low) |
| Broche 74 | nSTATUS — Configuration status (active low) |
| Broche 75 | CONF_DONE — Configuration complete |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | VCCINT — Core supply voltage (3.3 V) |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | VCCIO — I/O bank supply voltage |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | VCCINT — Core supply voltage (3.3 V) |
| Broche 113 | GND — Ground |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | TCK — JTAG clock input |
| Broche 117 | TMS — JTAG test mode select |
| Broche 118 | TDI — JTAG test data input |
| Broche 119 | TDO — JTAG test data output |
| Broche 120 | MSEL0 — Configuration mode select |
| Broche 121 | MSEL1 — Configuration mode select |
| Broche 122 | CLK0 — Dedicated clock input |
| Broche 123 | CLK1 — Dedicated clock input |
| Broche 124 | CLK2 — Dedicated clock input |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | VCCIO — I/O bank supply voltage |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | I/O — User I/O pin |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
Applications typiques
EPF6024ATI144-3N convient pour 6 applications: Industrial Control Glue Logic, Legacy Peripheral Bus Bridges, Telecommunications Line Cards, Low-Volume ASIC Replacement, Test and Measurement Equipment, Aerospace and Defense Legacy Avionics.
Industrial Control Glue Logic
The EPF6024ATI144-3N is well suited to industrial control systems as a glue-logic aggregator between microcontrollers, sensors, and actuators. With 1,960 logic elements and 117 user I/O pins, the part can absorb discrete 74-series logic, peripheral bus bridges, and PWM/timer blocks that would otherwise require multiple CPLDs. Its 3.3 V core and 5 V-tolerant I/O on selected banks allow direct interface to legacy 5 V industrial buses. In PLC backplanes and motor-drive controllers, the -3 speed grade provides predictable timing closure at 33 MHz system clocks, while the industrial -40 C to +85 C operating range handles factory-floor thermal stress without derating.
Recommandé
Legacy Peripheral Bus Bridges
The EPF6024ATI144-3N is widely used as a bridge between legacy parallel buses such as ISA, VME, PC/104, and PMC, and modern serial interfaces. Its 117 user I/Os comfortably absorb 16-bit or 32-bit data buses plus address and control signals, while the SRAM-based configuration allows firmware updates via JTAG without re-soldering. In telecom line cards and industrial SBCs, the FLEX 6000 acts as a non-standard protocol converter or timing generator that no off-the-shelf ASSP can match. The -3 speed grade delivers 8-10 ns tPD typical, sufficient for 33 MHz PCI bus cycles.
Recommandé
Telecommunications Line Cards
In telecommunications line cards, the EPF6024ATI144-3N handles time-slot assignment, framing, HDLC encoding, and clock-domain crossing between TDM buses and backplane serializers. Its 1,960 logic elements support multiple low-rate channels aggregated into a single high-rate stream. The 144-LQFP package's 0.5 mm pitch is hand-reworkable for telecom equipment manufacturers maintaining legacy installations. Combined with an external EPC2 configuration EPROM, the design supports in-field firmware updates via JTAG, which is essential for telecom equipment requiring protocol updates without service interruption.
Recommandé
Low-Volume ASIC Replacement
The EPF6024ATI144-3N is commonly deployed as a mask-ROM ASIC replacement in low- to medium-volume products where the NRE of a custom ASIC cannot be amortized. With 24,000 typical gates, it covers the function of most small ASICs used in industrial sensors, test equipment, and consumer peripherals. The SRAM-based configuration allows the same PCB to host multiple product variants by simply changing the configuration EPROM image, reducing SKUs and inventory cost. Engineers should budget for the EPC2 (~$3) plus an additional PCB footprint and 3.3 V regulator when migrating from ASIC to FLEX 6000 FPGA.
Recommandé
Test and Measurement Equipment
The EPF6024ATI144-3N finds application in test and measurement instruments where custom timing patterns, protocol analyzers, or stimulus generators are required. Its 117 user I/Os allow direct connection to logic analyzer pods and pattern-generator channels, while the -3 speed grade supports edge rates down to 8 ns for sub-100 MHz stimulus. The FLEX 6000's SRAM-based configuration allows test engineers to iterate on measurement patterns in minutes by re-loading via JTAG. Combined with the JTAG boundary-scan (IEEE 1149.1) support, the part can also be used in board-test fixtures for in-circuit test of legacy designs.
Recommandé
Aerospace and Defense Legacy Avionics
The EPF6024ATI144-3N is qualified for use in legacy aerospace and defense avionics where it was originally designed in and remains deployed on existing platforms. Its industrial operating temperature range (-40 C to +85 C) and SRAM-based reprogrammability make it suitable for mission computers and display controllers on legacy aircraft. The 144-LQFP package withstands the thermal cycling and vibration profiles required by MIL-STD-810 testing. For new aerospace designs, however, the recommended path is to migrate to radiation-hardened or RadTolerant FPGAs such as Microsemi RTG4 or Xilinx Virtex-5QV.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATI144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATI144-3 | EPF6024ATI144-2N | EPF6024ATI144-2 | EPF6024ATI144-1N | EPF6024ATC144-3N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -3 (fastest) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| Configuration Memory | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required |
Principaux différenciateurs
- Lead-free (Pb-free) terminal finish (vs EPF6024ATI144-3)
- Faster speed grade within the same family (vs EPF6024ATI144-2N)
- TQFP-144 package code for alternate assembly lines (vs EPF6024ATC144-3N)
- Same die, slowest speed grade for cost-sensitive designs (vs EPF6024ATI144-1N)
Notes de conception
The EPF6024ATI144-3N requires a clean 3.3 V core supply (VCCINT) with ±5% tolerance per the FLEX 6000 datasheet. Place a 10 µF tantalum or ceramic bulk capacitor within 25 mm of the VCCINT pins, plus a 0.1 µF ceramic decoupling capacitor at each VCCINT pin. The I/O bank supply VCCIO can be set independently to 2.5 V, 3.3 V, or 5.0 V per bank to interface with mixed-voltage peripherals. Each VCCIO pin requires the same 0.1 µF + 10 µF decoupling topology. Estimated: at 100% utilization of 1,960 LEs at 33 MHz, ICCINT is approximately 50-100 mA depending on toggle rate.
The most common design mistake with the EPF6024ATI144-3N is forgetting the external configuration memory. The FLEX 6000 family uses SRAM-based configuration that is volatile — without a valid configuration stream from an EPC1, EPC2, or EPC4 EPROM at power-up, all I/Os remain tri-stated and the device appears 'dead'. The nCONFIG, nSTATUS, and CONF_DONE pins must be pulled correctly per the configuration handbook, and MSEL0/MSEL1 must be tied to select the correct configuration mode. In-system programming (ISP) via JTAG requires the EPC2 or EPC4; the EPC1 does not support ISP.
The 144-LQFP package has a thermal resistance θJA of approximately 35-40 C/W on a 4-layer JEDEC test board. For the EPF6024ATI144-3N, maximum power dissipation in worst-case utilization at industrial temperature is approximately 0.5 W, which produces a 17-20 C junction temperature rise above ambient. This is well within the 125 C junction limit, but designers should add thermal relief copper pours under the exposed die pad region (not present on this TQFP package, unlike the EQFP variants). Industrial designs targeting 85 C ambient should validate with a thermal probe at full utilization.
Place the EPC2 configuration EPROM within 50 mm of the EPF6024ATI144-3N to minimize configuration trace length and reduce susceptibility to noise during power-up. Keep configuration data lines (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from high-speed switching signals such as clock outputs and fast-edge I/Os. The JTAG chain (TCK, TMS, TDI, TDO) should be routed with 4-6 mil traces, kept under 150 mm total length, and terminated with a 10 kΩ pull-up on TCK/TMS/TDI per IEEE 1149.1 recommendations. Reserve a programming header footprint for in-system programming access.
Informations de conformité
RoHS compliant per Altera/Intel product page (N suffix denotes lead-free finish). Not AEC-Q100 qualified - FLEX 6000 family is not automotive-grade. Halogen-free per Intel PSG material declaration. Conflict-minerals compliant per Intel supplier reporting.
