EPF6024ATI144-3N - 24K Gate FLEX 6000 FPGA, 144-LQFP | Intel (Altera)
N.º da peça: EPF6024ATI144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $24.9 | $2.490,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $15.2 | $15.200,00 |
EPF6024ATI144-3N Visão geral
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the programmable logic hierarchy, an FPGA sits above a CPLD (Complex Programmable Logic Device) and a SPLD (Simple PLD) in terms of density and routing flexibility. The FLEX 6000 family is Altera's classic high-volume, low-cost FPGA line built on a 0.5 µm SRAM process with a continuous, SRAM-based interconnect — requiring an external configuration EPROM at power-up. This places the EPF6024ATI144-3N above mask-ROM ASICs in flexibility but below CPLDs in non-volatility.
Key features of the EPF6024ATI144-3N include: 1,960 logic elements, 117 user I/O pins, built-in SRAM configuration memory, JTAG (IEEE 1149.1) boundary-scan support, multi-volt I/O compatibility (3.3 V / 5 V tolerant inputs on selected banks), and the -3 speed grade placing it in the faster half of the FLEX 6000 speed bin. The 144-LQFP package is a surface-mount gull-wing form factor that is hand-solderable and compatible with low-cost PCB assembly. The 'N' suffix indicates lead-free / Pb-free terminal finish per industry convention.
Architecturally, the FLEX 6000 family uses a continuous routing architecture known as the 'FastTrack Interconnect', with logic elements (LEs) grouped into Logic Array Blocks (LABs) of 10 LEs each, interconnected by row and column routing channels. This architecture favors designs with moderate register density and predictable timing closure — common in glue logic, bus interfaces, and peripheral controllers.
Typical applications for the EPF6024ATI144-3N include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), telecommunications line cards, and low-volume prototyping where mask-ROM ASICs are not economical. The 117 user I/O count suits designs that require wide parallel buses or multiple serial channels. The part is now considered NRND/last-time-buy by many distributors as the FLEX 6000 family has been superseded by the Cyclone series.
When designing with this part, plan for an external configuration memory (EPC1, EPC2, or compatible), ensure the 3.3 V rail has clean decoupling within 25 mm of the supply pins, and verify I/O bank voltage compatibility before connecting to 5 V peripherals. Legacy FLEX 6000 designs should be migrated to Cyclone II or Cyclone IV for new production unless pin-compatibility with the existing 144-LQFP footprint is mandatory.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the original manufacturer datasheet.
Alternativas drop-in para EPF6024ATI144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6024ATI144-3N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Configuration Method, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6024ATI144-3
✅ Drop-In✓ Em estoque
$26.1 / unidade
Ver ficha técnica →EPF6024ATI144-2N
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EPF6024ATI144-2
✅ Drop-In✓ Em estoque
$21.9 / unidade
Ver ficha técnica →EPF6024ATI144-1N
✅ Drop-In✓ Em estoque
$16.4 / unidade
Ver ficha técnica →EPF6024ATC144-3N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPF6024ATI144-3N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gates | 24,000 |
| User I/O Pins | 117 |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 (faster bin) |
| Encapsulamento | 144-LQFP (TQFP-144, 20x20 mm) |
| Process Technology | 0.5 µm SRAM CMOS |
| Configuration | SRAM, requires external configuration EPROM |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V tolerant on selected banks |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Tipo de montagem | Surface Mount (gull-wing) |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant (lead-free 'N' suffix) |
| Lead-Free Terminal Finish | Yes (N suffix) |
| Configuration Memory Required | EPC1, EPC2 or compatible |
Configuração de pinos do EPF6024ATI144-3N
| Pino 1 | I/O — User I/O pin |
| Pino 2 | I/O — User I/O pin |
| Pino 3 | I/O — User I/O pin |
| Pino 4 | I/O — User I/O pin |
| Pino 5 | I/O — User I/O pin |
| Pino 6 | I/O — User I/O pin |
| Pino 7 | I/O — User I/O pin |
| Pino 8 | VCCIO — I/O bank supply voltage |
| Pino 9 | I/O — User I/O pin |
| Pino 10 | I/O — User I/O pin |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin |
| Pino 13 | I/O — User I/O pin |
| Pino 14 | I/O — User I/O pin |
| Pino 15 | I/O — User I/O pin |
| Pino 16 | I/O — User I/O pin |
| Pino 17 | I/O — User I/O pin |
| Pino 18 | I/O — User I/O pin |
| Pino 19 | I/O — User I/O pin |
| Pino 20 | I/O — User I/O pin |
| Pino 21 | VCCINT — Core supply voltage (3.3 V) |
| Pino 22 | I/O — User I/O pin |
| Pino 23 | I/O — User I/O pin |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O pin |
| Pino 26 | I/O — User I/O pin |
| Pino 27 | I/O — User I/O pin |
| Pino 28 | I/O — User I/O pin |
| Pino 29 | I/O — User I/O pin |
| Pino 30 | I/O — User I/O pin |
| Pino 31 | I/O — User I/O pin |
| Pino 32 | VCCIO — I/O bank supply voltage |
| Pino 33 | I/O — User I/O pin |
| Pino 34 | I/O — User I/O pin |
| Pino 35 | I/O — User I/O pin |
| Pino 36 | I/O — User I/O pin |
| Pino 37 | GND — Ground |
| Pino 38 | I/O — User I/O pin |
| Pino 39 | I/O — User I/O pin |
| Pino 40 | I/O — User I/O pin |
| Pino 41 | I/O — User I/O pin |
| Pino 42 | I/O — User I/O pin |
| Pino 43 | I/O — User I/O pin |
| Pino 44 | I/O — User I/O pin |
| Pino 45 | I/O — User I/O pin |
| Pino 46 | I/O — User I/O pin |
| Pino 47 | I/O — User I/O pin |
| Pino 48 | VCCINT — Core supply voltage (3.3 V) |
| Pino 49 | I/O — User I/O pin |
| Pino 50 | I/O — User I/O pin |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O pin |
| Pino 53 | I/O — User I/O pin |
| Pino 54 | I/O — User I/O pin |
| Pino 55 | I/O — User I/O pin |
| Pino 56 | I/O — User I/O pin |
| Pino 57 | I/O — User I/O pin |
| Pino 58 | I/O — User I/O pin |
| Pino 59 | I/O — User I/O pin |
| Pino 60 | I/O — User I/O pin |
| Pino 61 | VCCIO — I/O bank supply voltage |
| Pino 62 | I/O — User I/O pin |
| Pino 63 | I/O — User I/O pin |
| Pino 64 | I/O — User I/O pin |
| Pino 65 | I/O — User I/O pin |
| Pino 66 | GND — Ground |
| Pino 67 | I/O — User I/O pin |
| Pino 68 | I/O — User I/O pin |
| Pino 69 | I/O — User I/O pin |
| Pino 70 | I/O — User I/O pin |
| Pino 71 | I/O — User I/O pin |
| Pino 72 | I/O — User I/O pin |
| Pino 73 | nCONFIG — Configuration control (active low) |
| Pino 74 | nSTATUS — Configuration status (active low) |
| Pino 75 | CONF_DONE — Configuration complete |
| Pino 76 | I/O — User I/O pin |
| Pino 77 | I/O — User I/O pin |
| Pino 78 | I/O — User I/O pin |
| Pino 79 | I/O — User I/O pin |
| Pino 80 | I/O — User I/O pin |
| Pino 81 | VCCINT — Core supply voltage (3.3 V) |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O pin |
| Pino 84 | I/O — User I/O pin |
| Pino 85 | I/O — User I/O pin |
| Pino 86 | I/O — User I/O pin |
| Pino 87 | I/O — User I/O pin |
| Pino 88 | I/O — User I/O pin |
| Pino 89 | I/O — User I/O pin |
| Pino 90 | I/O — User I/O pin |
| Pino 91 | I/O — User I/O pin |
| Pino 92 | I/O — User I/O pin |
| Pino 93 | VCCIO — I/O bank supply voltage |
| Pino 94 | I/O — User I/O pin |
| Pino 95 | I/O — User I/O pin |
| Pino 96 | GND — Ground |
| Pino 97 | I/O — User I/O pin |
| Pino 98 | I/O — User I/O pin |
| Pino 99 | I/O — User I/O pin |
| Pino 100 | I/O — User I/O pin |
| Pino 101 | I/O — User I/O pin |
| Pino 102 | I/O — User I/O pin |
| Pino 103 | I/O — User I/O pin |
| Pino 104 | I/O — User I/O pin |
| Pino 105 | I/O — User I/O pin |
| Pino 106 | I/O — User I/O pin |
| Pino 107 | I/O — User I/O pin |
| Pino 108 | I/O — User I/O pin |
| Pino 109 | I/O — User I/O pin |
| Pino 110 | I/O — User I/O pin |
| Pino 111 | I/O — User I/O pin |
| Pino 112 | VCCINT — Core supply voltage (3.3 V) |
| Pino 113 | GND — Ground |
| Pino 114 | I/O — User I/O pin |
| Pino 115 | I/O — User I/O pin |
| Pino 116 | TCK — JTAG clock input |
| Pino 117 | TMS — JTAG test mode select |
| Pino 118 | TDI — JTAG test data input |
| Pino 119 | TDO — JTAG test data output |
| Pino 120 | MSEL0 — Configuration mode select |
| Pino 121 | MSEL1 — Configuration mode select |
| Pino 122 | CLK0 — Dedicated clock input |
| Pino 123 | CLK1 — Dedicated clock input |
| Pino 124 | CLK2 — Dedicated clock input |
| Pino 125 | I/O — User I/O pin |
| Pino 126 | I/O — User I/O pin |
| Pino 127 | I/O — User I/O pin |
| Pino 128 | VCCIO — I/O bank supply voltage |
| Pino 129 | I/O — User I/O pin |
| Pino 130 | I/O — User I/O pin |
| Pino 131 | GND — Ground |
| Pino 132 | I/O — User I/O pin |
| Pino 133 | I/O — User I/O pin |
| Pino 134 | I/O — User I/O pin |
| Pino 135 | I/O — User I/O pin |
| Pino 136 | I/O — User I/O pin |
| Pino 137 | I/O — User I/O pin |
| Pino 138 | I/O — User I/O pin |
| Pino 139 | I/O — User I/O pin |
| Pino 140 | I/O — User I/O pin |
| Pino 141 | I/O — User I/O pin |
| Pino 142 | I/O — User I/O pin |
| Pino 143 | I/O — User I/O pin |
| Pino 144 | I/O — User I/O pin |
Aplicações típicas
EPF6024ATI144-3N é adequado para 6 aplicaçãos: Industrial Control Glue Logic, Legacy Peripheral Bus Bridges, Telecommunications Line Cards, Low-Volume ASIC Replacement, Test and Measurement Equipment, Aerospace and Defense Legacy Avionics.
Industrial Control Glue Logic
The EPF6024ATI144-3N is well suited to industrial control systems as a glue-logic aggregator between microcontrollers, sensors, and actuators. With 1,960 logic elements and 117 user I/O pins, the part can absorb discrete 74-series logic, peripheral bus bridges, and PWM/timer blocks that would otherwise require multiple CPLDs. Its 3.3 V core and 5 V-tolerant I/O on selected banks allow direct interface to legacy 5 V industrial buses. In PLC backplanes and motor-drive controllers, the -3 speed grade provides predictable timing closure at 33 MHz system clocks, while the industrial -40 C to +85 C operating range handles factory-floor thermal stress without derating.
Recomendado
Legacy Peripheral Bus Bridges
The EPF6024ATI144-3N is widely used as a bridge between legacy parallel buses such as ISA, VME, PC/104, and PMC, and modern serial interfaces. Its 117 user I/Os comfortably absorb 16-bit or 32-bit data buses plus address and control signals, while the SRAM-based configuration allows firmware updates via JTAG without re-soldering. In telecom line cards and industrial SBCs, the FLEX 6000 acts as a non-standard protocol converter or timing generator that no off-the-shelf ASSP can match. The -3 speed grade delivers 8-10 ns tPD typical, sufficient for 33 MHz PCI bus cycles.
Recomendado
Telecommunications Line Cards
In telecommunications line cards, the EPF6024ATI144-3N handles time-slot assignment, framing, HDLC encoding, and clock-domain crossing between TDM buses and backplane serializers. Its 1,960 logic elements support multiple low-rate channels aggregated into a single high-rate stream. The 144-LQFP package's 0.5 mm pitch is hand-reworkable for telecom equipment manufacturers maintaining legacy installations. Combined with an external EPC2 configuration EPROM, the design supports in-field firmware updates via JTAG, which is essential for telecom equipment requiring protocol updates without service interruption.
Recomendado
Low-Volume ASIC Replacement
The EPF6024ATI144-3N is commonly deployed as a mask-ROM ASIC replacement in low- to medium-volume products where the NRE of a custom ASIC cannot be amortized. With 24,000 typical gates, it covers the function of most small ASICs used in industrial sensors, test equipment, and consumer peripherals. The SRAM-based configuration allows the same PCB to host multiple product variants by simply changing the configuration EPROM image, reducing SKUs and inventory cost. Engineers should budget for the EPC2 (~$3) plus an additional PCB footprint and 3.3 V regulator when migrating from ASIC to FLEX 6000 FPGA.
Recomendado
Test and Measurement Equipment
The EPF6024ATI144-3N finds application in test and measurement instruments where custom timing patterns, protocol analyzers, or stimulus generators are required. Its 117 user I/Os allow direct connection to logic analyzer pods and pattern-generator channels, while the -3 speed grade supports edge rates down to 8 ns for sub-100 MHz stimulus. The FLEX 6000's SRAM-based configuration allows test engineers to iterate on measurement patterns in minutes by re-loading via JTAG. Combined with the JTAG boundary-scan (IEEE 1149.1) support, the part can also be used in board-test fixtures for in-circuit test of legacy designs.
Recomendado
Aerospace and Defense Legacy Avionics
The EPF6024ATI144-3N is qualified for use in legacy aerospace and defense avionics where it was originally designed in and remains deployed on existing platforms. Its industrial operating temperature range (-40 C to +85 C) and SRAM-based reprogrammability make it suitable for mission computers and display controllers on legacy aircraft. The 144-LQFP package withstands the thermal cycling and vibration profiles required by MIL-STD-810 testing. For new aerospace designs, however, the recommended path is to migrate to radiation-hardened or RadTolerant FPGAs such as Microsemi RTG4 or Xilinx Virtex-5QV.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6024ATI144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6024ATI144-3 | EPF6024ATI144-2N | EPF6024ATI144-2 | EPF6024ATI144-1N | EPF6024ATC144-3N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -3 (fastest) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| Configuration Memory | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required |
Principais diferenciais
- Lead-free (Pb-free) terminal finish (vs EPF6024ATI144-3)
- Faster speed grade within the same family (vs EPF6024ATI144-2N)
- TQFP-144 package code for alternate assembly lines (vs EPF6024ATC144-3N)
- Same die, slowest speed grade for cost-sensitive designs (vs EPF6024ATI144-1N)
Notas de projeto
The EPF6024ATI144-3N requires a clean 3.3 V core supply (VCCINT) with ±5% tolerance per the FLEX 6000 datasheet. Place a 10 µF tantalum or ceramic bulk capacitor within 25 mm of the VCCINT pins, plus a 0.1 µF ceramic decoupling capacitor at each VCCINT pin. The I/O bank supply VCCIO can be set independently to 2.5 V, 3.3 V, or 5.0 V per bank to interface with mixed-voltage peripherals. Each VCCIO pin requires the same 0.1 µF + 10 µF decoupling topology. Estimated: at 100% utilization of 1,960 LEs at 33 MHz, ICCINT is approximately 50-100 mA depending on toggle rate.
The most common design mistake with the EPF6024ATI144-3N is forgetting the external configuration memory. The FLEX 6000 family uses SRAM-based configuration that is volatile — without a valid configuration stream from an EPC1, EPC2, or EPC4 EPROM at power-up, all I/Os remain tri-stated and the device appears 'dead'. The nCONFIG, nSTATUS, and CONF_DONE pins must be pulled correctly per the configuration handbook, and MSEL0/MSEL1 must be tied to select the correct configuration mode. In-system programming (ISP) via JTAG requires the EPC2 or EPC4; the EPC1 does not support ISP.
The 144-LQFP package has a thermal resistance θJA of approximately 35-40 C/W on a 4-layer JEDEC test board. For the EPF6024ATI144-3N, maximum power dissipation in worst-case utilization at industrial temperature is approximately 0.5 W, which produces a 17-20 C junction temperature rise above ambient. This is well within the 125 C junction limit, but designers should add thermal relief copper pours under the exposed die pad region (not present on this TQFP package, unlike the EQFP variants). Industrial designs targeting 85 C ambient should validate with a thermal probe at full utilization.
Place the EPC2 configuration EPROM within 50 mm of the EPF6024ATI144-3N to minimize configuration trace length and reduce susceptibility to noise during power-up. Keep configuration data lines (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from high-speed switching signals such as clock outputs and fast-edge I/Os. The JTAG chain (TCK, TMS, TDI, TDO) should be routed with 4-6 mil traces, kept under 150 mm total length, and terminated with a 10 kΩ pull-up on TCK/TMS/TDI per IEEE 1149.1 recommendations. Reserve a programming header footprint for in-system programming access.
Informações de conformidade
RoHS compliant per Altera/Intel product page (N suffix denotes lead-free finish). Not AEC-Q100 qualified - FLEX 6000 family is not automotive-grade. Halogen-free per Intel PSG material declaration. Conflict-minerals compliant per Intel supplier reporting.
