PIC18F26K83-I/ML - 8-Bit 64MHz 64KB Flash MCU w/ CAN | Microchip
MPN: PIC18F26K83-I/ML ✓ AktifPIC18F26K83-I/ML Ringkasan
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash/RAM), and programmable peripherals that engineers configure to read sensors, drive actuators, and exchange data via serial busses. PIC18 MCUs use a modified Harvard architecture optimized for deterministic real-time control, and the K-series extends that line with enhanced peripherals like ADC2, DMA, and CIP (Core Independent Peripherals). Within Microchip's 8-bit portfolio, the PIC18F26K83 sits in the K83 sub-family that combines an MSSP-based CAN module, 12-bit differential ADC, and XLP battery-friendly sleep currents below 100 nA.
Key features of the PIC18F26K83-I/ML include 64 KB self-programmable Flash (32K x 16 words), 4 KB SRAM, 1 KB EEPROM, four 16-bit timers, two I2C, two SPI, four UART, and a CAN 2.0B module. ADC2 automates oversampling, averaging, and threshold comparison without CPU intervention, freeing cycles for higher-level control loops. The device also includes a Peripheral Pin Select (PPS) engine that remaps most digital peripherals to any I/O pin, simplifying PCB routing on dense boards.
Designed for industrial-grade reliability, the PIC18F26K83-I/ML supports -40C to +85C operation, watch timers, windowed WDT, and CRC/SCAN memory integrity checking. The 28-QFN exposed pad provides a low theta_JA footprint suitable for compact industrial modules and energy-meter PCBs that previously required larger SSOP packages. Internal DMA moves data between peripherals and RAM without CPU load, enabling efficient noise-filter pipelines and high-speed UART/CAN traffic.
Typical applications include industrial CAN node controls (sensor hubs, motor pre-drivers, building automation), touch-sensing human-machine interfaces using CVD, automotive body and accessory ECUs, e-metering, and battery-powered IoT sensor nodes. Designers benefit from MPLAB X IDE, MCC pin/clock code generators, and the PIC18F26K83 Plug-In Module (MA180037) for rapid prototyping on Microchip development boards.
When selecting this part, consider that the 28-QFN variant (-I/ML, industrial -40 to +85C) is drop-in compatible with the 28-SSOP (-I/SS) and 28-SOIC (-I/SO) variants, but PCB re-layout is required to migrate between QFN and leaded packages. Designers migrating from the older PIC18F25K80 gain ADC resolution (12-bit vs 10-bit), CAN-FD capability, DMA, and CIP peripherals with software-level compatibility through the XC8 toolchain.
This page synthesizes distributor pricing, drop-in alternatives sourced from Microchip's K80/K42 families, design notes covering ADC2 configuration and CAN bus termination, and an AEO-optimized FAQ tailored to engineers evaluating this MCU for new designs or replacement of legacy K80 silicon.
Alternatif penggantian untuk PIC18F26K83-I/ML — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC18F26K83-I/ML (sama faktor bentuk dan footprint) — berbeda di dalam ADC, Package, Program Memory (Flash), Operating Temperature, Communication Peripherals.
PIC18F26K83T-I/ML
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC18F26K83-E/ML
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC18F25K83-I/MX
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →PIC18F26K83-I/ML Rating Maksimal & Karakteristik Listrik
| Family | PIC18F26K83 (PIC XLP 18K) |
| Core | 8-bit PIC18, modified Harvard |
| Program Memory (Flash) | 64 KB (32K x 16 words) |
| SRAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Tegangan Pemuat | 2.3 V to 5.5 V |
| I/O Pins | 24 |
| ADC | 12-bit with Computation (ADC2), up to 24 channels |
| Timers | 4 x 16-bit / 2 x 8-bit |
| Communication | 2x I2C, 2x SPI, 4x UART, 1x CAN 2.0B |
| DMA Channels | Yes (peripheral-to-RAM) |
| Peripheral Pin Select (PPS) | Yes |
| Suhu Kerja | -40C to +85C (Industrial) |
| Paket | 28-QFN (6x6 mm) with exposed pad |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant |
| Functional Safety | Yes (FuSa features) |
Konfigurasi Pin PIC18F26K83-I/ML
| Pin produk 1 | VSS — Ground reference |
| Pin produk 2 | RA0/ANA0 — PORTA bit 0 / analog input AN0 |
| Pin produk 3 | RA1/ANA1 — PORTA bit 1 / analog input AN1 |
| Pin produk 4 | RA2/ANA2 — PORTA bit 2 / analog input AN2 |
| Pin produk 5 | RA3/ANA3/VREF+ — PORTA bit 3 / analog input AN3 / voltage reference plus |
| Pin produk 6 | RA4/ANA4/T0CKI — PORTA bit 4 / analog input AN4 / Timer0 clock input |
| Pin produk 7 | RA5/ANA5 — PORTA bit 5 / analog input AN5 |
| Pin produk 8 | RA6/ANA6 — PORTA bit 6 / analog input AN6 |
| Pin produk 9 | RA7/ANA7 — PORTA bit 7 / analog input AN7 |
| Pin produk 10 | VSS — Ground reference (digital) |
| Pin produk 11 | VDD — Positive supply voltage 2.3V-5.5V |
| Pin produk 12 | RB0/ANB0 — PORTB bit 0 / analog input B0 |
| Pin produk 13 | RB1/ANB1 — PORTB bit 1 / analog input B1 |
| Pin produk 14 | RB2/ANB2 — PORTB bit 2 / analog input B2 |
| Pin produk 15 | RB3/ANB3 — PORTB bit 3 / analog input B3 |
| Pin produk 16 | RB4/ANB4 — PORTB bit 4 / analog input B4 |
| Pin produk 17 | RB5/ANB5 — PORTB bit 5 / analog input B5 |
| Pin produk 18 | RB6/ICSPCLK — PORTB bit 6 / ICSP clock |
| Pin produk 19 | RB7/ICSPDAT — PORTB bit 7 / ICSP data |
| Pin produk 20 | VSS — Ground reference (digital) |
| Pin produk 21 | VDD — Positive supply voltage 2.3V-5.5V |
| Pin produk 22 | RC0 — PORTC bit 0 (CCP/SPI/I2C via PPS) |
| Pin produk 23 | RC1 — PORTC bit 1 (CCP/SPI/I2C via PPS) |
| Pin produk 24 | RC2 — PORTC bit 2 (CCP/SPI/I2C via PPS) |
| Pin produk 25 | RC3 — PORTC bit 3 (SCL/SPI via PPS) |
| Pin produk 26 | RC4 — PORTC bit 4 (SDA/SPI via PPS) |
| Pin produk 27 | RC5 — PORTC bit 5 |
| Pin produk 28 | RC6 — PORTC bit 6 (TX/CAN TX via PPS) |
Aplikasi Umum
PIC18F26K83-I/ML cocok untuk 6 aplikasis: Industrial CAN Sensor Node, Capacitive Touch HMI Panel, Building Automation Controller, Automotive Body Control Accessory ECU, Smart Energy Meter / Sub-GHz Data Logger, IoT Sensor / Wearable Edge Node.
Industrial CAN Sensor Node
The PIC18F26K83-I/ML fits industrial CAN sensor nodes because its integrated CAN 2.0B controller supports bit rates up to 1 Mbit/s for CANopen/DeviceNet slaves, while the -40 to +85C industrial grade handles factory floor environments. Designers place the QFN on a sensor PCB and run a CANopen stack from the 64 KB Flash, leaving 4 KB RAM for process-data buffering and CIP peripherals for deterministic cyclic messaging. Compared with a discrete CAN transceiver plus external MCU, this integration cuts BOM cost roughly 30 percent and shrinks PCB area significantly.
Direkomendasikan
Capacitive Touch HMI Panel
The PIC18F26K83-I/ML is well suited for capacitive touch HMI panels because ADC2 hardware automates Capacitive Voltage Divider (CVD) scanning of 12+ buttons without CPU intervention, reducing firmware complexity and scan latency below 1 ms. DMA channels move raw ADC samples into RAM for hardware averaging and threshold comparison, freeing CPU time for the user interface. The exposed QFN pad enables slim panel designs, while XLP sleep currents below 100 nA support battery-powered remote controls for HVAC and appliance user interfaces.
Direkomendasikan
Building Automation Controller
The PIC18F26K83-I/ML is ideal for building automation controllers because it combines CAN/RS-485-style UARTs for BACnet or Modbus communications, ADC2 for analog sensor digitization, and XLP sleep modes that draw only microamps in battery-backed HVAC zone sensors. With 64 KB Flash and 4 KB RAM, a single MCU can run the application protocol, process temperature/humidity/CO2 reads, and drive a relay or 0-10 V actuator output. The industrial 85C temperature rating covers plenum enclosures where ambient can rise during summer peaks.
Direkomendasikan
Automotive Body Control Accessory ECU
The PIC18F26K83-I/ML suits automotive accessory ECUs such as seat controllers, mirror modules, or body controllers because it integrates CAN 2.0B for chassis bus communication plus ADC2 for current/voltage feedback on motor drives. For under-hood or high-temperature cabin environments, the extended-grade PIC18F26K83-E/ML (rated +125C) is the preferred drop-in. With Functional Safety (FuSa) features and 64 KB Flash, it can host AUTOSAR-mappable firmware plus safety diagnostics like windowed WDT and CRC memory scans.
Direkomendasikan
Smart Energy Meter / Sub-GHz Data Logger
The PIC18F26K83-I/ML handles smart energy metering because its 12-bit ADC2 captures accurate load-current measurements with hardware averaging for noise rejection, while DMA streams samples into RAM at high rates without CPU load. The PIC XLP sleep mode keeps idle consumption below 100 nA, extending battery life in wireless meter modules. The QFN exposed pad provides low thermal resistance, allowing continuous metrology accuracy across the -40 to +85C industrial range required by utility-grade metering specifications.
Direkomendasikan
IoT Sensor / Wearable Edge Node
The PIC18F26K83-I/ML is well matched to low-power IoT edge nodes because the PIC XLP architecture achieves sleep currents under 100 nA with wake-on-change, allowing months of battery life on coin cells for wearables or environmental sensors. ADC2 with CVD supports both temperature/humidity measurements and capacitive user interfaces, while PPS lets designers remap SPI/I2C pins without PCB changes. The 6x6 mm QFN footprint fits easily inside compact wearables, and 64 KB Flash supports full BLE/Zigbee node stacks plus over-the-air update bootloaders.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC18F26K83-I/ML — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC18F26K83T-I/ML | PIC18F26K83-E/ML | PIC18F25K83-I/MX |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| SRAM | 4 KB | 4 KB | 4 KB | 2 KB (-50%) |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ADC Resolution | 12-bit (ADC2) | 12-bit (ADC2) | 12-bit (ADC2) | 12-bit (ADC2) |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Supply Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
Diferensiator Kunci
- Integrated CAN 2.0B with dedicated hardware (vsPIC18F25K83-I/MX)
- 12-bit ADC2 with hardware CVD touch sensing (vsPIC18F25K80T-I/SS)
- Industrial-grade extended temperature variant available (vsPIC18F26K83T-I/ML)
Catatan Desain
The 28-QFN exposed pad must be soldered to a PCB thermal land with at least 8 thermal vias to the inner ground plane for adequate heat dissipation. A 200mm x 200mm area of solid ground plane brings theta_JA below 30 C/W; a floating or absent thermal pad can cause thermal-shutdown events during high-CPU-load CAN bus bursts.
Add a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pin pair (4 each on 28-QFN). A bulk 4.7 uF aluminum-polymer or tantalum capacitor near the MCU handles CAN bus supply transients. Place the 32.768 kHz crystal (if used for RTCC) within 5 mm of SOSC pins to minimize EMI and start-up drift.
Use Peripheral Pin Select (PPS) to remap SPI, I2C, UART, and CAN signals to alternate I/O pins, simplifying PCB routing on dense two-layer boards. Keep CANH/CANL differential traces matched within 0.5 mm and use 120-ohm characteristic impedance; place the termination resistor only at the bus ends, not on stub branches, to avoid reflections above 500 kbit/s.
For capacitive touch (CVD) sensing, dedicate a ground fill island under each touch pad with a 0.5 mm clearance ring to enhance sensitivity. Keep ADC reference voltage traces short and decoupled with 100 nF plus 10 uF capacitors to avoid jitter; route ADC inputs away from PWM and CAN switching signals with 0.4 mm grounded isolation channels.
Informasi Konformitas
RoHS compliant per Microchip product page; AEC-Q100 grade requires extended E/ML variant.
